linux-dev/Documentation/devicetree/bindings/thermal, branch linus/master

Merge tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

2022-05-25T21:56:06Z

Pull devicetree updates from Rob Herring: "Bindings: - Convert smsc,lan91c111, qcom,spi-qup, qcom,msm-uartdm, qcom,i2c-qup, qcom,gsbi, i2c-mt65xx, TI wkup_m3_ipc (and new props), qcom,smp2p, TI timer, Mediatek gnss, Mediatek topckgen, Mediatek apmixedsys, Mediatek infracfg, fsl,ls-extirq, fsl,layerscape-dcfg, QCom PMIC SPMI, rda,8810pl-timer, Xilinx zynqmp_ipi, uniphier-pcie, and Ilitek touchscreen controllers - Convert various Arm Ltd peripheral IP bindings to schemas - New bindings for Menlo board CPLD, DH electronics board CPLD, Qualcomm Geni based QUP I2C, Renesas RZ/G2UL OSTM, Broafcom BCM4751 GNSS, MT6360 PMIC, ASIX USB Ethernet controllers, and Microchip/SMSC LAN95xx USB Ethernet controllers - Add vendor prefix for Enclustra - Add various compatible string additions - Various example fixes and cleanups - Remove unused hisilicon,hi6220-reset binding - Treewide fix properties missing type definition - Drop some empty and unreferenced .txt bindings - Documentation improvements for writing schemas DT driver core: - Drop static IRQ resources for DT platform devices as IRQ setup is dynamic and drivers have all been converted to use platform_get_irq() and friends - Rework memory allocations and frees for overlays - Continue overlay notifier callbacks on successful calls and add unittests - Handle 'interrupts-extended' in early DT IRQ setup - Fix of_property_read_string() errors to match documentation - Ignore disabled nodes in FDT API calls" * tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (86 commits) of/irq: fix typo in comment dt-bindings: Fix properties without any type Revert "dt-bindings: mailbox: qcom-ipcc: add missing properties into example" dt-bindings: input: touchscreen: ilitek_ts_i2c: Absorb ili2xxx bindings dt-bindings: timer: samsung,exynos4210-mct: define strict clock order dt-bindings: timer: samsung,exynos4210-mct: drop unneeded minItems dt-bindings: timer: cdns,ttc: drop unneeded minItems dt-bindings: mailbox: zynqmp_ipi: convert to yaml dt-bindings: usb: ci-hdrc-usb2: fix node node for ethernet controller dt-bindings: net: add schema for Microchip/SMSC LAN95xx USB Ethernet controllers dt-bindings: net: add schema for ASIX USB Ethernet controllers of/fdt: Ignore disabled memory nodes dt-bindings: arm: fix typos in compatible dt-bindings: mfd: Add bindings child nodes for the Mediatek MT6360 dt-bindings: display: convert Arm Komeda to DT schema dt-bindings: display: convert Arm Mali-DP to DT schema dt-bindings: display: convert Arm HDLCD to DT schema dt-bindings: display: convert PL110/PL111 to DT schema dt-bindings: arm: convert vexpress-config to DT schema dt-bindings: arm: convert vexpress-sysregs to DT schema ...

dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation

2022-05-19T10:11:53Z

Add VTM bindings documentation. In the Voltage Thermal Management Module(VTM), K3 J72XX supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Signed-off-by: Keerthy Reviewed-by: Rob Herring Link: https://lore.kernel.org/r/20220517172920.10857-2-j-keerthy@ti.com Signed-off-by: Daniel Lezcano

dt-bindings: thermal: tsens: Add sc8280xp compatible

2022-05-19T10:11:52Z

The Qualcomm SC8280XP platform has three instances of the tsens block, add a compatible for these instances. Acked-by: Krzysztof Kozlowski Signed-off-by: Bjorn Andersson Link: https://lore.kernel.org/r/20220503153436.960184-1-bjorn.andersson@linaro.org Signed-off-by: Daniel Lezcano

dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible

2022-05-19T10:11:52Z

Add compatible for the LMh blocks found in the Qualcomm sc8180x platform. Signed-off-by: Bjorn Andersson Acked-by: Krzysztof Kozlowski Link: https://lore.kernel.org/r/20220502164504.3972938-2-bjorn.andersson@linaro.org Signed-off-by: Daniel Lezcano

dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings

2022-05-19T10:11:52Z

Document RZ/G2UL TSU bindings. The TSU block on RZ/G2UL is identical to one found on RZ/G2L SoC. No driver changes are required as generic compatible string "renesas,rzg2l-tsu" will be used as a fallback. Signed-off-by: Biju Das Reviewed-by: Geert Uytterhoeven Acked-by: Krzysztof Kozlowski Link: https://lore.kernel.org/r/20220501081930.23743-1-biju.das.jz@bp.renesas.com Signed-off-by: Daniel Lezcano

dt-bindings: thermal: qcom-tsens.yaml: add msm8960 compat string

2022-05-19T10:11:51Z

Add compatibility string for the thermal sensors on MSM8960/APQ8064 platforms. Signed-off-by: Dmitry Baryshkov Acked-by: Krzysztof Kozlowski Link: https://lore.kernel.org/r/20220406002648.393486-2-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano

dt-bindings: thermal: qcom: add PMIC5 Gen2 ADC_TM bindings

2022-05-19T10:11:50Z

Add documentation for PMIC5 Gen2 ADC_TM peripheral. It is used for monitoring ADC channel thresholds for PMIC7-type PMICs. It is present on PMK8350, like PMIC7 ADC and can be used to monitor up to 8 ADC channels, from any of the PMIC7 PMICs on a target, through PBS(Programmable Boot Sequence). Signed-off-by: Jishnu Prakash Reviewed-by: Jonathan Cameron Reviewed-by: Rob Herring Link: https://lore.kernel.org/r/1648991869-20899-2-git-send-email-quic_jprakash@quicinc.com Signed-off-by: Daniel Lezcano

dt-bindings: thermal: rzg2l-thermal: Document RZ/V2L bindings

2022-05-19T10:11:50Z

Document RZ/V2L TSU bindings. The TSU block on RZ/V2L is identical to one found on RZ/G2L SoC. No driver changes are required as generic compatible string "renesas,rzg2l-tsu" will be used as a fallback. Signed-off-by: Lad Prabhakar Reviewed-by: Biju Das Acked-by: Krzysztof Kozlowski Reviewed-by: Geert Uytterhoeven Link: https://lore.kernel.org/r/20220308212315.4551-1-prabhakar.mahadev-lad.rj@bp.renesas.com Signed-off-by: Daniel Lezcano

Merge branch 'dt/linus' into dt/next

2022-05-09T16:50:27Z

Pick up new meta-schema fixes.

Merge tag 'devicetree-fixes-for-5.18-3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

2022-05-05T22:50:27Z

Pull devicetree fixes from Rob Herring: - Drop unused 'max-link-speed' in Apple PCIe - More redundant 'maxItems/minItems' schema fixes - Support values for pinctrl 'drive-push-pull' and 'drive-open-drain' - Fix redundant 'unevaluatedProperties' in MT6360 LEDs binding - Add missing 'power-domains' property to Cadence UFSHC * tag 'devicetree-fixes-for-5.18-3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: dt-bindings: pci: apple,pcie: Drop max-link-speed from example dt-bindings: Drop redundant 'maxItems/minItems' in if/then schemas dt-bindings: pinctrl: Allow values for drive-push-pull and drive-open-drain dt-bindings: leds-mt6360: Drop redundant 'unevaluatedProperties' dt-bindings: ufs: cdns,ufshc: Add power-domains