linux-dev/Documentation/devicetree/bindings/thermal, branch master

Merge tag 'devicetree-for-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

2022-10-10T20:13:51Z

Pull devicetree updates from Rob Herring: "DT core: - Fix node refcounting in of_find_last_cache_level() - Constify device_node in of_device_compatible_match() - Fix 'dma-ranges' handling in bus controller nodes - Fix handling of initrd start > end - Improve error reporting in of_irq_init() - Taint kernel on DT unittest running - Use strscpy instead of strlcpy - Add a build target, dt_compatible_check, to check for compatible strings used in kernel sources against compatible strings in DT schemas. - Handle DT_SCHEMA_FILES changes when rebuilding DT bindings: - LED bindings for MT6370 PMIC - Convert Mediatek mtk-gce mailbox, MIPS CPU interrupt controller, mt7621 I2C, virtio,pci-iommu, nxp,tda998x, QCom fastrpc, qcom,pdc, and arm,versatile-sysreg to DT schema format - Add nvmem cells to u-boot,env schema - Add more LED_COLOR_ID definitions - Require 'opp-table' uses to be a node - Various schema fixes to match QEMU 'virt' DT usage - Tree wide dropping of redundant 'Device Tree Binding' in schema titles - More (unevaluated|additional)Properties fixes in schema child nodes - Drop various redundant minItems equal to maxItems" * tag 'devicetree-for-6.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (62 commits) of: base: Shift refcount decrement in of_find_last_cache_level() dt-bindings: leds: Add MediaTek MT6370 flashlight dt-bindings: leds: mt6370: Add MediaTek MT6370 current sink type LED indicator dt-bindings: mailbox: Convert mtk-gce to DT schema of: base: make of_device_compatible_match() accept const device node of: Fix "dma-ranges" handling for bus controllers of: fdt: Remove unused struct fdt_scan_status dt-bindings: display: st,stm32-dsi: Handle data-lanes in DSI port node dt-bindings: timer: Add power-domains for TI timer-dm on K3 dt: Add a check for undocumented compatible strings in kernel kbuild: take into account DT_SCHEMA_FILES changes while checking dtbs dt-bindings: interrupt-controller: migrate MIPS CPU interrupt controller text bindings to YAML dt-bindings: i2c: migrate mt7621 text bindings to YAML dt-bindings: power: gpcv2: correct patternProperties dt-bindings: virtio: Convert virtio,pci-iommu to DT schema dt-bindings: timer: arm,arch_timer: Allow dual compatible string dt-bindings: arm: cpus: Add kryo240 compatible dt-bindings: display: bridge: nxp,tda998x: Convert to json-schema dt-bindings: nvmem: u-boot,env: add basic NVMEM cells dt-bindings: remoteproc: qcom,adsp: enforce smd-edge schema ...

Merge branch 'thermal-core'

2022-08-27T13:07:58Z

Merge thermal control core fixes for 6.0-rc3: - Fix missing required property for thermal zone description (Daniel Lezcano). - Add missing export symbol for thermal_zone_device_register_with_trips() (Daniel Lezcano). * thermal-core: dt-bindings: thermal: Fix missing required property thermal/core: Add missing EXPORT_SYMBOL_GPL

dt-bindings: Remove 'Device Tree Bindings' from end of title:

2022-08-25T19:06:57Z

As indicated in link: https://lore.kernel.org/all/20220822204945.GA808626-robh@kernel.org/ DT schema files should not have 'Device Tree Binding' as part of there title: line. Remove this in most .yaml files, so hopefully preventing developers copying it into new .yaml files, and being asked to remove it. Signed-off-by: Andrew Lunn Link: https://lore.kernel.org/r/20220825020427.3460650-1-andrew@lunn.ch Signed-off-by: Rob Herring

dt-bindings: Fix incorrect "the the" corrections

2022-08-18T17:59:33Z

Lots of double occurrences of "the" were replaced by single occurrences, but some of them should become "to the" instead. Fixes: 12e5bde18d7f6ca4 ("dt-bindings: Fix typo in comment") Signed-off-by: Geert Uytterhoeven Link: https://lore.kernel.org/r/c5743c0a1a24b3a8893797b52fed88b99e56b04b.1660755148.git.geert+renesas@glider.be Signed-off-by: Jakub Kicinski

dt-bindings: thermal: Fix missing required property

2022-08-15T18:38:40Z

When the thermal zone description was converted to yaml schema, the required 'trips' property was forgotten. The initial text bindings was describing: " [ ... ] * Thermal zone nodes The thermal zone node is the node containing all the required info for describing a thermal zone, including its cooling device bindings. The thermal zone node must contain, apart from its own properties, one sub-node containing trip nodes and one sub-node containing all the zone cooling maps. Required properties: - polling-delay: The maximum number of milliseconds to wait between polls Type: unsigned when checking this thermal zone. Size: one cell - polling-delay-passive: The maximum number of milliseconds to wait Type: unsigned between polls when performing passive cooling. Size: one cell - thermal-sensors: A list of thermal sensor phandles and sensor specifier Type: list of used while monitoring the thermal zone. phandles + sensor specifier - trips: A sub-node which is a container of only trip point nodes Type: sub-node required to describe the thermal zone. Optional property: - cooling-maps: A sub-node which is a container of only cooling device Type: sub-node map nodes, used to describe the relation between trips and cooling devices. [ ... ] " Now the schema describes: " [ ... ] required: - polling-delay - polling-delay-passive - thermal-sensors [ ... ] " Add the missing 'trips' property in the required properties. Fixed: 1202a442a31fd ("dt-bindings: thermal: Add yaml bindings for thermal zones") Signed-off-by: Daniel Lezcano Acked-by: Rob Herring Link: https://lore.kernel.org/r/20220809085629.509116-3-daniel.lezcano@linaro.org

Merge tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux

2022-08-05T01:08:34Z

Pull devicetree updates from Rob Herring: "Bindings: - Add spi-peripheral-props.yaml references to various SPI device bindings - Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x, skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm CCN PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and arm-firmware-suite bindings to DT schema format - New bindings for Arm virtual platforms display, Qualcomm IMEM memory region, Samsung S5PV210 ChipID, EM Microelectronic EM3027 RTC, and arm,cortex-a78ae - Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec, quanta, and densitron - Add missing MSI and IOMMU properties to host-generic-pci - Remove bindings for removed EFM32 platform - Remove old chosen.txt binding (replaced by schema) - Treewide add missing type information for properties - Treewide fixing of typos and its vs. it's in bindings. Its all good now. - Drop unnecessary quoting in power related schemas - Several LED binding updates which didn't get picked up - Move various bindings to proper directories DT core code: - Convert unittest GPIO related tests to use fwnode - Check ima-kexec-buffer against memory bounds - Print reserved-memory allocation/reservation failures as errors - Cleanup early_init_dt_reserve_memory_arch() - Simplify of_overlay_fdt_apply() tail" * tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (65 commits) dt-bindings: mtd: microchip,mchp48l640: use spi-peripheral-props.yaml dt-bindings: power: supply: drop quotes when not needed dt-bindings: power: reset: drop quotes when not needed dt-bindings: power: drop quotes when not needed dt-bindings: PCI: host-generic-pci: Allow IOMMU and MSI properties of/fdt: declared return type does not match actual return type devicetree/bindings: correct possessive "its" typos dt-bindings: net: convert emac_rockchip.txt to YAML dt-bindings: eeprom: microchip,93lc46b: move to eeprom directory dt-bindings: eeprom: at25: use spi-peripheral-props.yaml dt-bindings: display: use spi-peripheral-props.yaml dt-bindings: watchdog: qcom,pm8916-wdt: convert to dtschema dt-bindings: power: reset: qcom,pon: use absolute path to other schema dt-bindings: iio/dac: adi,ad5766: Add missing type to 'output-range-microvolts' dt-bindings: power: supply: charger-manager: Add missing type for 'cm-battery-stat' dt-bindings: panel: raydium,rm67191: Add missing type to 'video-mode' of/fdt: Clean up early_init_dt_reserve_memory_arch() dt-bindings: PCI: fsl,imx6q-pcie: Add missing type for 'reset-gpio-active-high' dt-bindings: rtc: Add EM Microelectronic EM3027 bindings dt-bindings: rtc: ds1307: Convert to json-schema ...

Merge tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

2022-08-02T18:27:53Z

Pull thermal control updates from Rafael Wysocki: "These start a rework of the handling of trip points in the thermal core, improve the cpufreq/devfreq cooling device handling, update some thermal control drivers and the tmon utility and clean up code. Specifics: - Consolidate the thermal core code by beginning to move the thermal trip structure from the thermal OF code as a generic structure to be used by the different sensors when registering a thermal zone (Daniel Lezcano). - Make per cpufreq / devfreq cooling device ops instead of using a global variable, fix comments and rework the trace information (Lukasz Luba). - Add the include/dt-bindings/thermal.h under the area covered by the thermal maintainer in the MAINTAINERS file (Lukas Bulwahn). - Improve the error output by giving the sensor identification when a thermal zone failed to initialize, the DT bindings by changing the positive logic and adding the r8a779f0 support on the rcar3 (Wolfram Sang). - Convert the QCom tsens DT binding to the dtsformat format (Krzysztof Kozlowski). - Remove the pointless get_trend() function in the QCom, Ux500 and tegra thermal drivers, along with the unused DROP_FULL and RAISE_FULL trends definitions. Simplify the code by using clamp() macros (Daniel Lezcano). - Fix ref_table memory leak at probe time on the k3_j72xx bandgap (Bryan Brattlof). - Fix array underflow in prep_lookup_table (Dan Carpenter). - Add static annotation to the k3_j72xx_bandgap_j7* data structure (Jin Xiaoyun). - Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall). - Fix typos in comments on rzg2l (Biju Das). - Remove as unnecessary call to dev_err() as the error is already printed by the failing function on u8500 (Yang Li). - Register the thermal zones as hwmon sensors for the Qcom thermal sensors (Dmitry Baryshkov). - Fix 'tmon' tool compilation issue by adding phtread.h include (Markus Mayer). - Fix typo in the comments for the 'tmon' tool (Slark Xiao). - Make the thermal core use ida_alloc()/free() directly instead of ida_simple_get()/ida_simple_remove() that have been deprecated (keliu). - Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal control driver (Rafael Wysocki)" * tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits) thermal/of: Initialize trip points separately thermal/of: Use thermal trips stored in the thermal zone thermal/core: Add thermal_trip in thermal_zone thermal/core: Rename 'trips' to 'num_trips' thermal/core: Move thermal_set_delay_jiffies to static thermal/core: Remove unneeded EXPORT_SYMBOLS thermal/of: Move thermal_trip structure to thermal.h thermal/of: Remove the device node pointer for thermal_trip thermal/of: Replace device node match with device node search thermal/core: Remove duplicate information when an error occurs thermal/core: Avoid calling ->get_trip_temp() unnecessarily thermal/tools/tmon: Fix typo 'the the' in comment thermal/tools/tmon: Include pthread and time headers in tmon.h thermal/ti-soc-thermal: Fix comment typo thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors thermal/drivers/u8500: Remove unnecessary print function dev_err() thermal/drivers/rzg2l: Fix comments thermal/drivers/sun8i: Fix typo in comment thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static ...

Merge tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

2022-07-29T17:10:56Z

Pull thermal control changes for 5.20-rc1 from Daniel Lezcano: "- Make per cpufreq / devfreq cooling device ops instead of using a global variable, fix comments and rework the trace information (Lukasz Luba) - Add the include/dt-bindings/thermal.h under the area covered by the thermal maintainer in the MAINTAINERS file (Lukas Bulwahn) - Improve the error output by giving the sensor identification when a thermal zone failed to initialize, the DT bindings by changing the positive logic and adding the r8a779f0 support on the rcar3 (Wolfram Sang) - Convert the QCom tsens DT binding to the dtsformat format (Krzysztof Kozlowski) - Remove the pointless get_trend() function in the QCom, Ux500 and tegra thermal drivers, along with the unused DROP_FULL and RAISE_FULL trends definitions. Simplify the code by using clamp() macros (Daniel Lezcano) - Fix ref_table memory leak at probe time on the k3_j72xx bandgap (Bryan Brattlof) - Fix array underflow in prep_lookup_table (Dan Carpenter) - Add static annotation to the k3_j72xx_bandgap_j7* data structure (Jin Xiaoyun) - Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall) - Fix typos in comments on rzg2l (Biju Das) - Remove as unnecessary call to dev_err() as the error is already printed by the failing function on u8500 (Yang Li) - Register the thermal zones as hwmon sensors for the Qcom thermal sensors (Dmitry Baryshkov) - Fix 'tmon' tool compilation issue by adding phtread.h include (Markus Mayer) - Fix typo in the comments for the 'tmon' tool (Slark Xiao) - Consolidate the thermal core code by beginning to move the thermal trip structure from the thermal OF code as a generic structure to be used by the different sensors when registering a thermal zone (Daniel Lezcano)" * tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (36 commits) thermal/of: Initialize trip points separately thermal/of: Use thermal trips stored in the thermal zone thermal/core: Add thermal_trip in thermal_zone thermal/core: Rename 'trips' to 'num_trips' thermal/core: Move thermal_set_delay_jiffies to static thermal/core: Remove unneeded EXPORT_SYMBOLS thermal/of: Move thermal_trip structure to thermal.h thermal/of: Remove the device node pointer for thermal_trip thermal/of: Replace device node match with device node search thermal/core: Remove duplicate information when an error occurs thermal/core: Avoid calling ->get_trip_temp() unnecessarily thermal/tools/tmon: Fix typo 'the the' in comment thermal/tools/tmon: Include pthread and time headers in tmon.h thermal/ti-soc-thermal: Fix comment typo thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors thermal/drivers/u8500: Remove unnecessary print function dev_err() thermal/drivers/rzg2l: Fix comments thermal/drivers/sun8i: Fix typo in comment thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static ...

dt-bindings: thermal: rcar-gen3-thermal: Add r8a779f0 support

2022-07-28T15:29:45Z

Add support for R-Car S4. The S4 IP differs a bit from its siblings in such way that it has 3 out of 4 TSC nodes for Linux and the interrupts are not routed to the INTC-AP but to the ECM. Signed-off-by: Wolfram Sang Reviewed-by: Niklas Söderlund Reviewed-by: Geert Uytterhoeven Reviewed-by: Rob Herring Link: https://lore.kernel.org/r/20220610201701.7946-2-wsa+renesas@sang-engineering.com Signed-off-by: Daniel Lezcano

dt-bindings: thermal: rcar-gen3-thermal: use positive logic

2022-07-28T15:29:44Z

When handling the V3U/r8a779a0 exception, avoid using 'not:' because then its subschemas are far away in the 'else:' branch. Keep them together using positive logic. Signed-off-by: Wolfram Sang Reviewed-by: Niklas Söderlund Reviewed-by: Geert Uytterhoeven Link: https://lore.kernel.org/r/20220610201701.7946-1-wsa+renesas@sang-engineering.com Signed-off-by: Daniel Lezcano