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-Generic Thermal Sysfs driver How To
-===================================
-
-Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com>
-
-Updated: 2 January 2008
-
-Copyright (c) 2008 Intel Corporation
-
-
-0. Introduction
-
-The generic thermal sysfs provides a set of interfaces for thermal zone
-devices (sensors) and thermal cooling devices (fan, processor...) to register
-with the thermal management solution and to be a part of it.
-
-This how-to focuses on enabling new thermal zone and cooling devices to
-participate in thermal management.
-This solution is platform independent and any type of thermal zone devices
-and cooling devices should be able to make use of the infrastructure.
-
-The main task of the thermal sysfs driver is to expose thermal zone attributes
-as well as cooling device attributes to the user space.
-An intelligent thermal management application can make decisions based on
-inputs from thermal zone attributes (the current temperature and trip point
-temperature) and throttle appropriate devices.
-
-[0-*] denotes any positive number starting from 0
-[1-*] denotes any positive number starting from 1
-
-1. thermal sysfs driver interface functions
-
-1.1 thermal zone device interface
-1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *type,
- int trips, int mask, void *devdata,
- struct thermal_zone_device_ops *ops,
- const struct thermal_zone_params *tzp,
- int passive_delay, int polling_delay))
-
- This interface function adds a new thermal zone device (sensor) to
- /sys/class/thermal folder as thermal_zone[0-*]. It tries to bind all the
- thermal cooling devices registered at the same time.
-
- type: the thermal zone type.
- trips: the total number of trip points this thermal zone supports.
- mask: Bit string: If 'n'th bit is set, then trip point 'n' is writeable.
- devdata: device private data
- ops: thermal zone device call-backs.
- .bind: bind the thermal zone device with a thermal cooling device.
- .unbind: unbind the thermal zone device with a thermal cooling device.
- .get_temp: get the current temperature of the thermal zone.
- .set_trips: set the trip points window. Whenever the current temperature
- is updated, the trip points immediately below and above the
- current temperature are found.
- .get_mode: get the current mode (enabled/disabled) of the thermal zone.
- - "enabled" means the kernel thermal management is enabled.
- - "disabled" will prevent kernel thermal driver action upon trip points
- so that user applications can take charge of thermal management.
- .set_mode: set the mode (enabled/disabled) of the thermal zone.
- .get_trip_type: get the type of certain trip point.
- .get_trip_temp: get the temperature above which the certain trip point
- will be fired.
- .set_emul_temp: set the emulation temperature which helps in debugging
- different threshold temperature points.
- tzp: thermal zone platform parameters.
- passive_delay: number of milliseconds to wait between polls when
- performing passive cooling.
- polling_delay: number of milliseconds to wait between polls when checking
- whether trip points have been crossed (0 for interrupt driven systems).
-
-
-1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz)
-
- This interface function removes the thermal zone device.
- It deletes the corresponding entry from /sys/class/thermal folder and
- unbinds all the thermal cooling devices it uses.
-
-1.1.3 struct thermal_zone_device *thermal_zone_of_sensor_register(
- struct device *dev, int sensor_id, void *data,
- const struct thermal_zone_of_device_ops *ops)
-
- This interface adds a new sensor to a DT thermal zone.
- This function will search the list of thermal zones described in
- device tree and look for the zone that refer to the sensor device
- pointed by dev->of_node as temperature providers. For the zone
- pointing to the sensor node, the sensor will be added to the DT
- thermal zone device.
-
- The parameters for this interface are:
- dev: Device node of sensor containing valid node pointer in
- dev->of_node.
- sensor_id: a sensor identifier, in case the sensor IP has more
- than one sensors
- data: a private pointer (owned by the caller) that will be
- passed back, when a temperature reading is needed.
- ops: struct thermal_zone_of_device_ops *.
-
- get_temp: a pointer to a function that reads the
- sensor temperature. This is mandatory
- callback provided by sensor driver.
- set_trips: a pointer to a function that sets a
- temperature window. When this window is
- left the driver must inform the thermal
- core via thermal_zone_device_update.
- get_trend: a pointer to a function that reads the
- sensor temperature trend.
- set_emul_temp: a pointer to a function that sets
- sensor emulated temperature.
- The thermal zone temperature is provided by the get_temp() function
- pointer of thermal_zone_of_device_ops. When called, it will
- have the private pointer @data back.
-
- It returns error pointer if fails otherwise valid thermal zone device
- handle. Caller should check the return handle with IS_ERR() for finding
- whether success or not.
-
-1.1.4 void thermal_zone_of_sensor_unregister(struct device *dev,
- struct thermal_zone_device *tzd)
-
- This interface unregisters a sensor from a DT thermal zone which was
- successfully added by interface thermal_zone_of_sensor_register().
- This function removes the sensor callbacks and private data from the
- thermal zone device registered with thermal_zone_of_sensor_register()
- interface. It will also silent the zone by remove the .get_temp() and
- get_trend() thermal zone device callbacks.
-
-1.1.5 struct thermal_zone_device *devm_thermal_zone_of_sensor_register(
- struct device *dev, int sensor_id,
- void *data, const struct thermal_zone_of_device_ops *ops)
-
- This interface is resource managed version of
- thermal_zone_of_sensor_register().
- All details of thermal_zone_of_sensor_register() described in
- section 1.1.3 is applicable here.
- The benefit of using this interface to register sensor is that it
- is not require to explicitly call thermal_zone_of_sensor_unregister()
- in error path or during driver unbinding as this is done by driver
- resource manager.
-
-1.1.6 void devm_thermal_zone_of_sensor_unregister(struct device *dev,
- struct thermal_zone_device *tzd)
-
- This interface is resource managed version of
- thermal_zone_of_sensor_unregister().
- All details of thermal_zone_of_sensor_unregister() described in
- section 1.1.4 is applicable here.
- Normally this function will not need to be called and the resource
- management code will ensure that the resource is freed.
-
-1.1.7 int thermal_zone_get_slope(struct thermal_zone_device *tz)
-
- This interface is used to read the slope attribute value
- for the thermal zone device, which might be useful for platform
- drivers for temperature calculations.
-
-1.1.8 int thermal_zone_get_offset(struct thermal_zone_device *tz)
-
- This interface is used to read the offset attribute value
- for the thermal zone device, which might be useful for platform
- drivers for temperature calculations.
-
-1.2 thermal cooling device interface
-1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name,
- void *devdata, struct thermal_cooling_device_ops *)
-
- This interface function adds a new thermal cooling device (fan/processor/...)
- to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself
- to all the thermal zone devices registered at the same time.
- name: the cooling device name.
- devdata: device private data.
- ops: thermal cooling devices call-backs.
- .get_max_state: get the Maximum throttle state of the cooling device.
- .get_cur_state: get the Currently requested throttle state of the cooling device.
- .set_cur_state: set the Current throttle state of the cooling device.
-
-1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)
-
- This interface function removes the thermal cooling device.
- It deletes the corresponding entry from /sys/class/thermal folder and
- unbinds itself from all the thermal zone devices using it.
-
-1.3 interface for binding a thermal zone device with a thermal cooling device
-1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
- int trip, struct thermal_cooling_device *cdev,
- unsigned long upper, unsigned long lower, unsigned int weight);
-
- This interface function binds a thermal cooling device to a particular trip
- point of a thermal zone device.
- This function is usually called in the thermal zone device .bind callback.
- tz: the thermal zone device
- cdev: thermal cooling device
- trip: indicates which trip point in this thermal zone the cooling device
- is associated with.
- upper:the Maximum cooling state for this trip point.
- THERMAL_NO_LIMIT means no upper limit,
- and the cooling device can be in max_state.
- lower:the Minimum cooling state can be used for this trip point.
- THERMAL_NO_LIMIT means no lower limit,
- and the cooling device can be in cooling state 0.
- weight: the influence of this cooling device in this thermal
- zone. See 1.4.1 below for more information.
-
-1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
- int trip, struct thermal_cooling_device *cdev);
-
- This interface function unbinds a thermal cooling device from a particular
- trip point of a thermal zone device. This function is usually called in
- the thermal zone device .unbind callback.
- tz: the thermal zone device
- cdev: thermal cooling device
- trip: indicates which trip point in this thermal zone the cooling device
- is associated with.
-
-1.4 Thermal Zone Parameters
-1.4.1 struct thermal_bind_params
- This structure defines the following parameters that are used to bind
- a zone with a cooling device for a particular trip point.
- .cdev: The cooling device pointer
- .weight: The 'influence' of a particular cooling device on this
- zone. This is relative to the rest of the cooling
- devices. For example, if all cooling devices have a
- weight of 1, then they all contribute the same. You can
- use percentages if you want, but it's not mandatory. A
- weight of 0 means that this cooling device doesn't
- contribute to the cooling of this zone unless all cooling
- devices have a weight of 0. If all weights are 0, then
- they all contribute the same.
- .trip_mask:This is a bit mask that gives the binding relation between
- this thermal zone and cdev, for a particular trip point.
- If nth bit is set, then the cdev and thermal zone are bound
- for trip point n.
- .binding_limits: This is an array of cooling state limits. Must have
- exactly 2 * thermal_zone.number_of_trip_points. It is an
- array consisting of tuples <lower-state upper-state> of
- state limits. Each trip will be associated with one state
- limit tuple when binding. A NULL pointer means
- <THERMAL_NO_LIMITS THERMAL_NO_LIMITS> on all trips.
- These limits are used when binding a cdev to a trip point.
- .match: This call back returns success(0) if the 'tz and cdev' need to
- be bound, as per platform data.
-1.4.2 struct thermal_zone_params
- This structure defines the platform level parameters for a thermal zone.
- This data, for each thermal zone should come from the platform layer.
- This is an optional feature where some platforms can choose not to
- provide this data.
- .governor_name: Name of the thermal governor used for this zone
- .no_hwmon: a boolean to indicate if the thermal to hwmon sysfs interface
- is required. when no_hwmon == false, a hwmon sysfs interface
- will be created. when no_hwmon == true, nothing will be done.
- In case the thermal_zone_params is NULL, the hwmon interface
- will be created (for backward compatibility).
- .num_tbps: Number of thermal_bind_params entries for this zone
- .tbp: thermal_bind_params entries
-
-2. sysfs attributes structure
-
-RO read only value
-WO write only value
-RW read/write value
-
-Thermal sysfs attributes will be represented under /sys/class/thermal.
-Hwmon sysfs I/F extension is also available under /sys/class/hwmon
-if hwmon is compiled in or built as a module.
-
-Thermal zone device sys I/F, created once it's registered:
-/sys/class/thermal/thermal_zone[0-*]:
- |---type: Type of the thermal zone
- |---temp: Current temperature
- |---mode: Working mode of the thermal zone
- |---policy: Thermal governor used for this zone
- |---available_policies: Available thermal governors for this zone
- |---trip_point_[0-*]_temp: Trip point temperature
- |---trip_point_[0-*]_type: Trip point type
- |---trip_point_[0-*]_hyst: Hysteresis value for this trip point
- |---emul_temp: Emulated temperature set node
- |---sustainable_power: Sustainable dissipatable power
- |---k_po: Proportional term during temperature overshoot
- |---k_pu: Proportional term during temperature undershoot
- |---k_i: PID's integral term in the power allocator gov
- |---k_d: PID's derivative term in the power allocator
- |---integral_cutoff: Offset above which errors are accumulated
- |---slope: Slope constant applied as linear extrapolation
- |---offset: Offset constant applied as linear extrapolation
-
-Thermal cooling device sys I/F, created once it's registered:
-/sys/class/thermal/cooling_device[0-*]:
- |---type: Type of the cooling device(processor/fan/...)
- |---max_state: Maximum cooling state of the cooling device
- |---cur_state: Current cooling state of the cooling device
- |---stats: Directory containing cooling device's statistics
- |---stats/reset: Writing any value resets the statistics
- |---stats/time_in_state_ms: Time (msec) spent in various cooling states
- |---stats/total_trans: Total number of times cooling state is changed
- |---stats/trans_table: Cooing state transition table
-
-
-Then next two dynamic attributes are created/removed in pairs. They represent
-the relationship between a thermal zone and its associated cooling device.
-They are created/removed for each successful execution of
-thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device.
-
-/sys/class/thermal/thermal_zone[0-*]:
- |---cdev[0-*]: [0-*]th cooling device in current thermal zone
- |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with
- |---cdev[0-*]_weight: Influence of the cooling device in
- this thermal zone
-
-Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
-the generic thermal driver also creates a hwmon sysfs I/F for each _type_
-of thermal zone device. E.g. the generic thermal driver registers one hwmon
-class device and build the associated hwmon sysfs I/F for all the registered
-ACPI thermal zones.
-
-/sys/class/hwmon/hwmon[0-*]:
- |---name: The type of the thermal zone devices
- |---temp[1-*]_input: The current temperature of thermal zone [1-*]
- |---temp[1-*]_critical: The critical trip point of thermal zone [1-*]
-
-Please read Documentation/hwmon/sysfs-interface.rst for additional information.
-
-***************************
-* Thermal zone attributes *
-***************************
-
-type
- Strings which represent the thermal zone type.
- This is given by thermal zone driver as part of registration.
- E.g: "acpitz" indicates it's an ACPI thermal device.
- In order to keep it consistent with hwmon sys attribute; this should
- be a short, lowercase string, not containing spaces nor dashes.
- RO, Required
-
-temp
- Current temperature as reported by thermal zone (sensor).
- Unit: millidegree Celsius
- RO, Required
-
-mode
- One of the predefined values in [enabled, disabled].
- This file gives information about the algorithm that is currently
- managing the thermal zone. It can be either default kernel based
- algorithm or user space application.
- enabled = enable Kernel Thermal management.
- disabled = Preventing kernel thermal zone driver actions upon
- trip points so that user application can take full
- charge of the thermal management.
- RW, Optional
-
-policy
- One of the various thermal governors used for a particular zone.
- RW, Required
-
-available_policies
- Available thermal governors which can be used for a particular zone.
- RO, Required
-
-trip_point_[0-*]_temp
- The temperature above which trip point will be fired.
- Unit: millidegree Celsius
- RO, Optional
-
-trip_point_[0-*]_type
- Strings which indicate the type of the trip point.
- E.g. it can be one of critical, hot, passive, active[0-*] for ACPI
- thermal zone.
- RO, Optional
-
-trip_point_[0-*]_hyst
- The hysteresis value for a trip point, represented as an integer
- Unit: Celsius
- RW, Optional
-
-cdev[0-*]
- Sysfs link to the thermal cooling device node where the sys I/F
- for cooling device throttling control represents.
- RO, Optional
-
-cdev[0-*]_trip_point
- The trip point in this thermal zone which cdev[0-*] is associated
- with; -1 means the cooling device is not associated with any trip
- point.
- RO, Optional
-
-cdev[0-*]_weight
- The influence of cdev[0-*] in this thermal zone. This value
- is relative to the rest of cooling devices in the thermal
- zone. For example, if a cooling device has a weight double
- than that of other, it's twice as effective in cooling the
- thermal zone.
- RW, Optional
-
-passive
- Attribute is only present for zones in which the passive cooling
- policy is not supported by native thermal driver. Default is zero
- and can be set to a temperature (in millidegrees) to enable a
- passive trip point for the zone. Activation is done by polling with
- an interval of 1 second.
- Unit: millidegrees Celsius
- Valid values: 0 (disabled) or greater than 1000
- RW, Optional
-
-emul_temp
- Interface to set the emulated temperature method in thermal zone
- (sensor). After setting this temperature, the thermal zone may pass
- this temperature to platform emulation function if registered or
- cache it locally. This is useful in debugging different temperature
- threshold and its associated cooling action. This is write only node
- and writing 0 on this node should disable emulation.
- Unit: millidegree Celsius
- WO, Optional
-
- WARNING: Be careful while enabling this option on production systems,
- because userland can easily disable the thermal policy by simply
- flooding this sysfs node with low temperature values.
-
-sustainable_power
- An estimate of the sustained power that can be dissipated by
- the thermal zone. Used by the power allocator governor. For
- more information see Documentation/thermal/power_allocator.txt
- Unit: milliwatts
- RW, Optional
-
-k_po
- The proportional term of the power allocator governor's PID
- controller during temperature overshoot. Temperature overshoot
- is when the current temperature is above the "desired
- temperature" trip point. For more information see
- Documentation/thermal/power_allocator.txt
- RW, Optional
-
-k_pu
- The proportional term of the power allocator governor's PID
- controller during temperature undershoot. Temperature undershoot
- is when the current temperature is below the "desired
- temperature" trip point. For more information see
- Documentation/thermal/power_allocator.txt
- RW, Optional
-
-k_i
- The integral term of the power allocator governor's PID
- controller. This term allows the PID controller to compensate
- for long term drift. For more information see
- Documentation/thermal/power_allocator.txt
- RW, Optional
-
-k_d
- The derivative term of the power allocator governor's PID
- controller. For more information see
- Documentation/thermal/power_allocator.txt
- RW, Optional
-
-integral_cutoff
- Temperature offset from the desired temperature trip point
- above which the integral term of the power allocator
- governor's PID controller starts accumulating errors. For
- example, if integral_cutoff is 0, then the integral term only
- accumulates error when temperature is above the desired
- temperature trip point. For more information see
- Documentation/thermal/power_allocator.txt
- Unit: millidegree Celsius
- RW, Optional
-
-slope
- The slope constant used in a linear extrapolation model
- to determine a hotspot temperature based off the sensor's
- raw readings. It is up to the device driver to determine
- the usage of these values.
- RW, Optional
-
-offset
- The offset constant used in a linear extrapolation model
- to determine a hotspot temperature based off the sensor's
- raw readings. It is up to the device driver to determine
- the usage of these values.
- RW, Optional
-
-*****************************
-* Cooling device attributes *
-*****************************
-
-type
- String which represents the type of device, e.g:
- - for generic ACPI: should be "Fan", "Processor" or "LCD"
- - for memory controller device on intel_menlow platform:
- should be "Memory controller".
- RO, Required
-
-max_state
- The maximum permissible cooling state of this cooling device.
- RO, Required
-
-cur_state
- The current cooling state of this cooling device.
- The value can any integer numbers between 0 and max_state:
- - cur_state == 0 means no cooling
- - cur_state == max_state means the maximum cooling.
- RW, Required
-
-stats/reset
- Writing any value resets the cooling device's statistics.
- WO, Required
-
-stats/time_in_state_ms:
- The amount of time spent by the cooling device in various cooling
- states. The output will have "<state> <time>" pair in each line, which
- will mean this cooling device spent <time> msec of time at <state>.
- Output will have one line for each of the supported states. usertime
- units here is 10mS (similar to other time exported in /proc).
- RO, Required
-
-stats/total_trans:
- A single positive value showing the total number of times the state of a
- cooling device is changed.
- RO, Required
-
-stats/trans_table:
- This gives fine grained information about all the cooling state
- transitions. The cat output here is a two dimensional matrix, where an
- entry <i,j> (row i, column j) represents the number of transitions from
- State_i to State_j. If the transition table is bigger than PAGE_SIZE,
- reading this will return an -EFBIG error.
- RO, Required
-
-3. A simple implementation
-
-ACPI thermal zone may support multiple trip points like critical, hot,
-passive, active. If an ACPI thermal zone supports critical, passive,
-active[0] and active[1] at the same time, it may register itself as a
-thermal_zone_device (thermal_zone1) with 4 trip points in all.
-It has one processor and one fan, which are both registered as
-thermal_cooling_device. Both are considered to have the same
-effectiveness in cooling the thermal zone.
-
-If the processor is listed in _PSL method, and the fan is listed in _AL0
-method, the sys I/F structure will be built like this:
-
-/sys/class/thermal:
-
-|thermal_zone1:
- |---type: acpitz
- |---temp: 37000
- |---mode: enabled
- |---policy: step_wise
- |---available_policies: step_wise fair_share
- |---trip_point_0_temp: 100000
- |---trip_point_0_type: critical
- |---trip_point_1_temp: 80000
- |---trip_point_1_type: passive
- |---trip_point_2_temp: 70000
- |---trip_point_2_type: active0
- |---trip_point_3_temp: 60000
- |---trip_point_3_type: active1
- |---cdev0: --->/sys/class/thermal/cooling_device0
- |---cdev0_trip_point: 1 /* cdev0 can be used for passive */
- |---cdev0_weight: 1024
- |---cdev1: --->/sys/class/thermal/cooling_device3
- |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/
- |---cdev1_weight: 1024
-
-|cooling_device0:
- |---type: Processor
- |---max_state: 8
- |---cur_state: 0
-
-|cooling_device3:
- |---type: Fan
- |---max_state: 2
- |---cur_state: 0
-
-/sys/class/hwmon:
-
-|hwmon0:
- |---name: acpitz
- |---temp1_input: 37000
- |---temp1_crit: 100000
-
-4. Event Notification
-
-The framework includes a simple notification mechanism, in the form of a
-netlink event. Netlink socket initialization is done during the _init_
-of the framework. Drivers which intend to use the notification mechanism
-just need to call thermal_generate_netlink_event() with two arguments viz
-(originator, event). The originator is a pointer to struct thermal_zone_device
-from where the event has been originated. An integer which represents the
-thermal zone device will be used in the message to identify the zone. The
-event will be one of:{THERMAL_AUX0, THERMAL_AUX1, THERMAL_CRITICAL,
-THERMAL_DEV_FAULT}. Notification can be sent when the current temperature
-crosses any of the configured thresholds.
-
-5. Export Symbol APIs:
-
-5.1: get_tz_trend:
-This function returns the trend of a thermal zone, i.e the rate of change
-of temperature of the thermal zone. Ideally, the thermal sensor drivers
-are supposed to implement the callback. If they don't, the thermal
-framework calculated the trend by comparing the previous and the current
-temperature values.
-
-5.2:get_thermal_instance:
-This function returns the thermal_instance corresponding to a given
-{thermal_zone, cooling_device, trip_point} combination. Returns NULL
-if such an instance does not exist.
-
-5.3:thermal_notify_framework:
-This function handles the trip events from sensor drivers. It starts
-throttling the cooling devices according to the policy configured.
-For CRITICAL and HOT trip points, this notifies the respective drivers,
-and does actual throttling for other trip points i.e ACTIVE and PASSIVE.
-The throttling policy is based on the configured platform data; if no
-platform data is provided, this uses the step_wise throttling policy.
-
-5.4:thermal_cdev_update:
-This function serves as an arbitrator to set the state of a cooling
-device. It sets the cooling device to the deepest cooling state if
-possible.
-
-6. thermal_emergency_poweroff:
-
-On an event of critical trip temperature crossing. Thermal framework
-allows the system to shutdown gracefully by calling orderly_poweroff().
-In the event of a failure of orderly_poweroff() to shut down the system
-we are in danger of keeping the system alive at undesirably high
-temperatures. To mitigate this high risk scenario we program a work
-queue to fire after a pre-determined number of seconds to start
-an emergency shutdown of the device using the kernel_power_off()
-function. In case kernel_power_off() fails then finally
-emergency_restart() is called in the worst case.
-
-The delay should be carefully profiled so as to give adequate time for
-orderly_poweroff(). In case of failure of an orderly_poweroff() the
-emergency poweroff kicks in after the delay has elapsed and shuts down
-the system.
-
-If set to 0 emergency poweroff will not be supported. So a carefully
-profiled non-zero positive value is a must for emergerncy poweroff to be
-triggered.