aboutsummaryrefslogtreecommitdiffstats
path: root/Documentation/devicetree/bindings/arm/ti (follow)
AgeCommit message (Collapse)AuthorFilesLines
2019-07-26dt-bindings: Fix more $id value mismatches filenamesRob Herring1-1/+1
The path in the schema '$id' values are wrong. Fix them. Signed-off-by: Rob Herring <robh@kernel.org>
2019-06-19dt-bindings: arm: ti: Add bindings for J721E SoCNishanth Menon1-0/+3
The J721E SoC belongs to the K3 Multicore SoC architecture platform, providing advanced system integration to enable lower system costs of automotive applications such as infotainment, cluster, premium Audio, Gateway, industrial and a range of broad market applications. This SoC is designed around reducing the system cost by eliminating the need of an external system MCU and is targeted towards ASIL-B/C certification/requirements in addition to allowing complex software and system use-cases. Some highlights of this SoC are: * Dual Cortex-A72s in a single cluster, three clusters of lockstep capable dual Cortex-R5F MCUs, Deep-learning Matrix Multiply Accelerator(MMA), C7x floating point Vector DSP, Two C66x floating point DSPs. * 3D GPU PowerVR Rogue 8XE GE8430 * Vision Processing Accelerator (VPAC) with image signal processor and Depth and Motion Processing Accelerator (DMPAC) * Two Gigabit Industrial Communication Subsystems (ICSSG), each with dual PRUs and dual RTUs * Two CSI2.0 4L RX plus one CSI2.0 4L TX, one eDP/DP, One DSI Tx, and up to two DPI interfaces. * Integrated Ethernet switch supporting up to a total of 8 external ports in addition to legacy Ethernet switch of up to 2 ports. * System MMU (SMMU) Version 3.0 and advanced virtualisation capabilities. * Upto 4 PCIe-GEN3 controllers, 2 USB3.0 Dual-role device subsystems, 16 MCANs, 12 McASP, eMMC and SD, UFS, OSPI/HyperBus memory controller, QSPI, I3C and I2C, eCAP/eQEP, eHRPWM, MLB among other peripherals. * Two hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL management. * Configurable L3 Cache and IO-coherent architecture with high data throughput capable distributed DMA architecture under NAVSS * Centralized System Controller for Security, Power, and Resource Management (DMSC) See J721E Technical Reference Manual (SPRUIL1, May 2019) for further details: http://www.ti.com/lit/pdf/spruil1 Signed-off-by: Nishanth Menon <nm@ti.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Tero Kristo <t-kristo@ti.com>
2018-12-13dt-bindings: arm: Convert TI nspire board/soc bindings to json-schemaRob Herring1-0/+24
Convert TI NSpire SoC bindings to DT schema format using json-schema. Cc: Mark Rutland <mark.rutland@arm.com> Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org>
2018-12-13dt-bindings: arm: Convert TI davinci board/soc bindings to json-schemaRob Herring1-0/+26
Convert TI Davinci SoC bindings to DT schema format using json-schema. Reviewed-by: Sekhar Nori <nsekhar@ti.com> Cc: Kevin Hilman <khilman@kernel.org> Cc: Mark Rutland <mark.rutland@arm.com> Cc: devicetree@vger.kernel.org Signed-off-by: Rob Herring <robh@kernel.org>
2018-07-18dt-bindings: arm: ti: Add bindings for AM654 SoCNishanth Menon1-0/+23
The AM654 SoC is a lead device of the K3 Multicore SoC architecture platform, targeted for broad market and industrial control with aim to meet the complex processing needs of modern embedded products. Some highlights of this SoC are: * Quad ARMv8 A53 cores split over two clusters * GICv3 compliant GIC500 * Configurable L3 Cache and IO-coherent architecture * Dual lock-step capable R5F uC for safety-critical applications * High data throughput capable distributed DMA architecture under NAVSS * Three Gigabit Industrial Communication Subsystems (ICSSG), each with dual PRUs and dual RTUs * Hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL * Centralized System Controller for Security, Power, and Resource management. * Dual ADCSS, eQEP/eCAP, eHRPWM, dual CAN-FD * Flash subsystem with OSPI and Hyperbus interfaces * Multimedia capability with CAL, DSS7-UL, SGX544, McASP * Peripheral connectivity including USB3, PCIE, MMC/SD, GPMC, I2C, SPI, GPIO See AM65x Technical Reference Manual (SPRUID7, April 2018) for further details: http://www.ti.com/lit/pdf/spruid7 Reviewed-by: Tony Lindgren <tony@atomide.com> Signed-off-by: Nishanth Menon <nm@ti.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Tony Lindgren <tony@atomide.com>