| Age | Commit message (Collapse) | Author | Files | Lines | |
|---|---|---|---|---|---|
| 2010-08-03 | x86, hwmon: Package Level Thermal/Power: pkgtemp documentation |   Fenghua Yu | 1 | -0/+36 | |
| Document for package level thermal hwmon driver. Signed-off-by: Fenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-6-git-send-email-fenghua.yu@intel.com> Reviewed-by: Len Brown <len.brown@intel.com> Signed-off-by: H. Peter Anvin <hpa@linux.intel.com> | |||||
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index : linux-dev | |
| Linux kernel development work - see feature branches | Jason A. Donenfeld |
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