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When reading the number of gearboxes from the hardware, the driver does
not validate the returned 'device type' field. The driver can therefore
wrongly assume that the queried devices are gearboxes.
On Spectrum-3 systems that support different types of devices, this can
prevent the driver from loading, as it will try to query the
temperature sensors from devices which it assumes are gearboxes and in
fact are not.
For example:
[ 218.129230] mlxsw_minimal 2-0048: Reg cmd access status failed (status=7(bad parameter))
[ 218.138282] mlxsw_minimal 2-0048: Reg cmd access failed (reg_id=900a(mtmp),type=write)
[ 218.147131] mlxsw_minimal 2-0048: Failed to setup temp sensor number 256
[ 218.534480] mlxsw_minimal 2-0048: Fail to register core bus
[ 218.540714] mlxsw_minimal: probe of 2-0048 failed with error -5
Fix this by validating the 'device type' field.
Fixes: 2e265a8b6c094 ("mlxsw: core: Extend hwmon interface with inter-connect temperature attributes")
Fixes: f14f4e621b1b4 ("mlxsw: core: Extend thermal core with per inter-connect device thermal zones")
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Acked-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Use new field "num_of_modules" of MGPIR register for "thermal" interface
in order to get the number of modules supported by system directly from
the system configuration, instead of getting it from port to module
mapping info.
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Acked-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Extend MGPIR - Management General Peripheral Information Register
with new field "num_of_modules" exposing the number of modules
supported by specific system.
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Acked-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Extend macros MLXSW_REG_MTMP_TEMP_TO_MC() to allow support of negative
temperature readout, since chip and others thermal components are
capable of operating within the negative temperature.
With no such support negative temperature will be consider as very high
temperature and it will cause wrong readout and thermal shutdown.
For negative values 2`s complement is used.
Tested in chamber.
Example of chip ambient temperature readout with chamber temperature:
-10 Celsius:
temp1: -6.0C (highest = -5.0C)
-5 Celsius:
temp1: -1.0C (highest = -1.0C)
v2 (Andrew Lunn):
* Replace '%u' with '%d' in mlxsw_hwmon_module_temp_show()
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Acked-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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When multiple sensors are mapped to the same cooling device, the
cooling device should be set according the worst sensor from the
sensors associated with this cooling device.
Provide the hottest thermal zone detection and enforce cooling device
to follow the temperature trends of the hottest zone only.
Prevent competition for the cooling device control from others zones,
by "stable trend" indication. A cooling device will not perform any
actions associated with a zone with a "stable trend".
When other thermal zone is detected as a hottest, a cooling device is
to be switched to following temperature trends of new hottest zone.
Thermal zone score is represented by 32 bits unsigned integer and
calculated according to the next formula:
For T < TZ<t><i>, where t from {normal trip = 0, high trip = 1, hot
trip = 2, critical = 3}:
TZ<i> score = (T + (TZ<t><i> - T) / 2) / (TZ<t><i> - T) * 256 ** j;
Highest thermal zone score s is set as MAX(TZ<i>score);
Following this formula, if TZ<i> is in trip point higher than TZ<k>,
the higher score is to be always assigned to TZ<i>.
For two thermal zones located at the same kind of trip point, the higher
score will be assigned to the zone which is closer to the next trip
point. Thus, the highest score will always be assigned objectively to
the hottest thermal zone.
All the thermal zones initially are to be configured with mode
"enabled" with the "step_wise" governor.
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Acked-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Add a dedicated thermal zone for each inter-connect device. The
current temperature is obtained from inter-connect temperature sensor
and the default trip points are set to the same values as default ASIC
trip points. These settings could be changed from the user space.
A cooling device (fan) is bound to all inter-connect devices.
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Acked-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Obtain SFP modules temperatures through MTMP register instead of MTBR
register, because the first one utilizes shorter transaction buffer size
for request. It improves performance in case low frequency interface
(I2C) is used for communication with a chip.
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Acked-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Old Mellanox silicons, like switchx-2, switch-ib do not support reading
QSFP modules temperature through MTMP register. Attempt to access this
register on systems equipped with the this kind of silicon will cause
initialization flow failure.
Test for hardware resource capability is added in order to distinct
between old and new silicon - old silicons do not have such capability.
Fixes: 6a79507cfe94 ("mlxsw: core: Extend thermal module with per QSFP module thermal zones")
Fixes: 5c42eaa07bd0 ("mlxsw: core: Extend hwmon interface with QSFP module temperature attributes")
Reported-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Verify during thermal initialization if QSFP module's entry is already
configured in order to prevent duplication.
Such scenario could happen in case two switch drivers (PCI and I2C
based) coexist and if after boot, splitting configuration is applied
for some ports and then I2C based driver is re-probed.
In such case after reboot same QSFP module, associated with split will
be discovered by I2C based driver few times, and it will cause a crash.
It could happen for example on system equipped with BMC (Baseboard
Management Controller), running I2C based driver, when the next steps
are performed:
- System boot
- Host side configures port spilt.
- BMC side is rebooted.
Fixes: 6a79507cfe94 ("mlxsw: core: Extend thermal module with per QSFP module thermal zones")
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Add a dedicated thermal zone for each QSFP/SFP module. The current
temperature is obtained from the module's temperature sensor and the
trip points are set based on the warning and critical thresholds
read from the module.
A cooling device (fan) is bound to all the thermal zones. The
thermal zone governor is set to user space in order to avoid
collisions between thermal zones.
For example, one thermal zone might want to increase the speed of
the fan, whereas another one would like to decrease it.
Deferring this decision to user space allows the user to the take
the most suitable decision.
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Allow thermal zone binding to an external cooling device from the
cooling devices white list.
It provides support for Mellanox next generation systems on which
cooling device logic is not controlled through the switch registers.
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Reviewed-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Rename cooling device from "Fan" to "mlxsw_fan". Name "Fan" is too
common name, and such name is misleading, while it's interpreted by
user. For example name "Fan" could be used by ACPI.
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Reviewed-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Replace thermal hardcoded temperature trip values with defines.
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Reviewed-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Modify thermal zone trip points setting for better alignment with system
thermal requirement.
Add hysteresis thresholds for thermal trips in order to avoid throttling
around thermal trip point. If hysteresis temperature is not considered,
PWM can have side effect of flip up/down on thermal trip point boundary.
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Reviewed-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Add low frequency bus capability in order to allow core functionality
separation based on bus type. Driver could run over PCIe, which is
considered as high frequency bus or I2C, which is considered as low
frequency bus. In the last case time setting, for example, for thermal
polling interval, should be increased.
Use different thermal monitoring based on bus type. For I2C bus time is
set to 20 seconds, while for PCIe 1 second polling interval is used.
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Reviewed-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Extend cooling device with cooling levels vector to allow more
flexibility of PWM setting.
Thermal zone algorithm operates with the numerical states for PWM
setting. Each state is the index, defined in range from 0 to 10 and it's
mapped to the relevant duty cycle value, which is written to PWM
controller. With the current definition fan speed is set to 0% for state
0, 10% for state 1, and so on up to 100% for the maximum state 10.
Some systems have limitation for the PWM speed minimum. For such systems
PWM setting speed to 0% will just disable the ability to increase speed
anymore and such device will be stall on zero speed. Cooling levels
allow to configure state vector according to the particular system
requirements. For example, if PWM speed is not allowed to be below 30%,
cooling levels could be configured as 30%, 30%, 30%, 30%, 40%, 50% and
so on.
Signed-off-by: Vadim Pasternak <vadimp@mellanox.com>
Reviewed-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Signed-off-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Implement thermal zone for mlxsw based HW. It uses temperature sensor
provided by ASIC (the same as mlxsw hwmon interface) to report current
temp to thermal core. The ASIC's PWM is then used to control speed
of system fans registered as cooling devices.
Signed-off-by: Ivan Vecera <cera@cera.cz>
Reviewed-by: Ido Schimmel <idosch@mellanox.com>
Signed-off-by: Jiri Pirko <jiri@mellanox.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Vadim Pasternak
Jiri Pirko
Ivan Vecera