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path: root/drivers/thermal/samsung/Kconfig (follow)
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2013-08-29thermal: exynos: Clean up non-DT remnantsSachin Kamat1-1/+1
Commit 1cd1ecb6 ("thermal: exynos: Remove non DT based support") cleaned up some non-DT code. However, there were few more things needed for complete cleanup to make this driver DT only. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29thermal: exynos: Fix typos in KconfigSachin Kamat1-5/+5
Fixes some trivial typos. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Bifurcate exynos tmu driver and configuration dataAmit Daniel Kachhap1-1/+2
This code splits the exynos tmu driver code into SOC specific data parts. This will simplify adding new SOC specific data to the same TMU controller. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Bifurcate exynos thermal common and tmu controller codeAmit Daniel Kachhap1-5/+14
This code bifurcates exynos thermal implementation into common and sensor specific parts. The common thermal code interacts with core thermal layer and core cpufreq cooling parts and is independent of SOC specific driver. This change is needed to cleanly add support for new TMU sensors. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Remove un-necessary CPU_THERMAL dependencyAmit Daniel Kachhap1-1/+0
This patch removes the dependency on CPU_THERMAL for compiling TMU driver. This is useful for cases when only TMU controller needs to be initialised without cpu cooling action. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Use ARCH_HAS_BANDGAP config to know the supported soc'sAmit Daniel Kachhap1-1/+1
This patch uses the recently added config sybmol ARCH_HAS_BANDGAP to enable the TMU driver. This will allow adding support for new soc easily as now it is the platform responsibility to enable this config symbol for a particular soc. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Moving exynos thermal files into samsung directoryAmit Daniel Kachhap1-0/+9
This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>