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path: root/drivers/thermal/thermal_sys.c (follow)
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2012-12-12Thermal: fix a NULL pointer dereference when generic thermal layer is built as a moduleZhang Rui1-1/+2
[ 12.761956] BUG: unable to handle kernel NULL pointer dereference at 0000000000000018 [ 12.762016] IP: [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys] [ 12.762060] PGD 1fec74067 PUD 1fee5b067 PMD 0 [ 12.762127] Oops: 0000 [#1] SMP [ 12.762177] Modules linked in: hid_generic crc32c_intel usbhid hid firewire_ohci(+) e1000e(+) firewire_core crc_itu_t xhci_hcd(+) thermal(+) fan thermal_sys hwmon [ 12.762423] CPU 1 [ 12.762443] Pid: 187, comm: modprobe Tainted: G A 3.7.0-thermal-module+ #25 /DH77DF [ 12.762496] RIP: 0010:[<ffffffffa0005277>] [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys] [ 12.762682] RSP: 0018:ffff8801fe7ddc18 EFLAGS: 00010282 [ 12.762704] RAX: 0000000000000000 RBX: ffff8801ff3e9c00 RCX: ffff8801fdc39800 [ 12.762728] RDX: ffff8801fe7ddc24 RSI: 0000000000000001 RDI: ffff8801ff3e9c00 [ 12.762764] RBP: ffff8801fe7ddc48 R08: 0000000004000000 R09: ffffffffa001f568 [ 12.762797] R10: ffffffff81363083 R11: 0000000000000001 R12: 0000000000000001 [ 12.762832] R13: 0000000000000000 R14: 0000000000000001 R15: ffff8801fde73e68 [ 12.762866] FS: 00007f5548516700(0000) GS:ffff88021f240000(0000) knlGS:0000000000000000 [ 12.762912] CS: 0010 DS: 0000 ES: 0000 CR0: 0000000080050033 [ 12.762946] CR2: 0000000000000018 CR3: 00000001fefe2000 CR4: 00000000001407e0 [ 12.762979] DR0: 0000000000000000 DR1: 0000000000000000 DR2: 0000000000000000 [ 12.763014] DR3: 0000000000000000 DR6: 00000000ffff0ff0 DR7: 0000000000000400 [ 12.763048] Process modprobe (pid: 187, threadinfo ffff8801fe7dc000, task ffff8801fe5bdb40) [ 12.763095] Stack: [ 12.763122] 0000000000019640 00000000fdc39800 ffff8801fe7ddc48 ffff8801ff3e9c00 [ 12.763225] 0000000000000002 0000000000000000 ffff8801fe7ddc78 ffffffffa00053e7 [ 12.763338] ffff8801ff3e9c00 0000000000006c98 ffffffffa0007480 ffff8801ff3e9c00 [ 12.763440] Call Trace: [ 12.763470] [<ffffffffa00053e7>] thermal_zone_device_update+0x77/0xa0 [thermal_sys] [ 12.763515] [<ffffffffa0006d38>] thermal_zone_device_register+0x788/0xa88 [thermal_sys] [ 12.763562] [<ffffffffa001f394>] acpi_thermal_add+0x360/0x4c8 [thermal] [ 12.763598] [<ffffffff8133902a>] acpi_device_probe+0x50/0x190 [ 12.763632] [<ffffffff811bd793>] ? sysfs_create_link+0x13/0x20 [ 12.763666] [<ffffffff813cc41b>] driver_probe_device+0x7b/0x240 [ 12.763699] [<ffffffff813cc68b>] __driver_attach+0xab/0xb0 [ 12.763732] [<ffffffff813cc5e0>] ? driver_probe_device+0x240/0x240 [ 12.763766] [<ffffffff813ca836>] bus_for_each_dev+0x56/0x90 [ 12.763799] [<ffffffff813cbf4e>] driver_attach+0x1e/0x20 [ 12.763831] [<ffffffff813cbac0>] bus_add_driver+0x190/0x290 [ 12.763864] [<ffffffffa0022000>] ? 0xffffffffa0021fff [ 12.763896] [<ffffffff813ccbea>] driver_register+0x7a/0x160 [ 12.763928] [<ffffffffa0022000>] ? 0xffffffffa0021fff [ 12.763960] [<ffffffff813399fb>] acpi_bus_register_driver+0x43/0x45 [ 12.763995] [<ffffffffa002203a>] acpi_thermal_init+0x3a/0x42 [thermal] [ 12.764029] [<ffffffff8100207f>] do_one_initcall+0x3f/0x170 [ 12.764063] [<ffffffff810b1a5f>] sys_init_module+0x8f/0x200 [ 12.764097] [<ffffffff815ff259>] system_call_fastpath+0x16/0x1b [ 12.764129] Code: 48 8b 87 c8 02 00 00 41 89 f4 48 8d 55 dc ff 50 28 44 8b 6d dc 41 8d 45 fe 83 f8 01 76 5e 48 8b 83 d8 02 00 00 44 89 e6 48 89 df <ff> 50 18 4c 8d a3 10 03 00 00 4c 89 e7 e8 87 f1 5e e1 8b 83 bc [ 12.765164] RIP [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys] [ 12.765223] RSP <ffff8801fe7ddc18> [ 12.765252] CR2: 0000000000000018 [ 12.765284] ---[ end trace 7723294cdfb00d2a ]--- This is because thermal_zone_device_update() is invoked before any thermal governors being registered. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Fix oops and unlocking in thermal_sys.cHugh Dickins1-4/+5
This patch fixes the following mutex and NULL pointer problems in thermal_sys.c: * mutex_unlock fix in update_temperature function * mutex_unlock fix in bind_cdev function * Correct early return to continue in bind_cdev function * NULL check fix in bind_cdev function * NULL check fix in bind_tz function Reported-by: Dan Carpenter <dan.carpenter@oracle.com> Reported-by: Sedat Dilek <sedat.dilek@gmail.com> Reported-by: Hugh Dickins <hughd@google.com> Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Sedat Dilek <sedat.dilek@gmail.com> Signed-off-by: Hugh Dickins <hughd@google.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Add a notification APIDurgadoss R1-0/+18
This patch adds a notification API which the sensor drivers' can use to notify the framework. The framework then takes care of the throttling according to the configured policy. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Remove throttling logic out of thermal_sys.cDurgadoss R1-198/+109
This patch removes the throttling logic out of thermal_sys.c; also refactors the code into smaller functions so that are easy to read/maintain. * Seperates the handling of critical and non-critical trips * Re-arranges the set_polling and device_check methods, so that all related functions are arranged in one place. * Removes the 'do_update' and 'trip_update' method, as part of moving the throttling logic out of thermal_sys.c Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Make thermal_cdev_update as a global functionDurgadoss R1-2/+3
This patch makes the thermal_cdev_update function as a global one, so that other files can use it. This function serves as a single arbitrator to set the state of a cooling device. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Update binding logic based on platform dataDurgadoss R1-26/+157
This patch updates the binding logic in thermal_sys.c It uses the platform layer data to bind a thermal zone to a cdev for a particular trip point. * If we do not have platform data and do not have .bind defined, do not bind. * If we do not have platform data but .bind is defined, then use tz->ops->bind. * If we have platform data, use it to create binding. The same logic sequence is followed for unbind also. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Add a policy sysfs attributeDurgadoss R1-3/+39
This patch adds a policy sysfs attribute to a thermal zone. This attribute denotes the throttling governor used for the zone. This is a RW attribute. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Add thermal governor registration APIsDurgadoss R1-0/+90
This patch creates a structure to hold platform thermal governor information, and provides APIs for individual thermal governors to register/unregister with the Thermal framework. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Pass zone parameters as argument to tzd_registerDurgadoss R1-0/+3
This patch adds the thermal zone parameter as an argument to the tzd_register() function call; and updates other drivers using this function. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Add get trend, get instance API's to thermal_sysDurgadoss R1-0/+40
This patch adds the following API's to thermal_sys.c, that can be used by other Thermal drivers. * get_tz_trend: obtain the trend of the given thermal zone * get_thermal_instance: obtain the instance corresponding to the given tz, cdev and the trip point. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Move thermal_instance to thermal_core.hDurgadoss R1-21/+2
This patch creates a thermal_core.h file which can contain all defines used by the core thermal framework files. For now, move the thermal_instance structure to thermal_core.h This structure is used by files under drivers/thermal/. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-10-09Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermalLen Brown1-121/+200
Conflicts: drivers/staging/omap-thermal/omap-thermal-common. OMAP supplied dummy TC1 and TC2, at the same time that the thermal tree removed them from thermal_zone_device_register() drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c propogate the upstream MAX_IDR_LEVEL re-name to prevent a build failure Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au> Signed-off-by: Len Brown <len.brown@intel.com>
2012-10-06idr: rename MAX_LEVEL to MAX_IDR_LEVELFengguang Wu1-1/+1
To avoid name conflicts: drivers/video/riva/fbdev.c:281:9: sparse: preprocessor token MAX_LEVEL redefined While at it, also make the other names more consistent and add parentheses. [akpm@linux-foundation.org: repair fallout] [sfr@canb.auug.org.au: IB/mlx4: fix for MAX_ID_MASK to MAX_IDR_MASK name change] Signed-off-by: Fengguang Wu <fengguang.wu@intel.com> Cc: Bernd Petrovitsch <bernd@petrovitsch.priv.at> Cc: walter harms <wharms@bfs.de> Cc: Glauber Costa <glommer@parallels.com> Signed-off-by: Stephen Rothwell <sfr@canb.auug.org.au> Cc: Roland Dreier <roland@purestorage.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2012-09-24thermal: Fix potential NULL pointer accessesGuenter Roeck1-4/+4
The type parameter in thermal_zone_device_register and thermal_cooling_device_register can be NULL, indicating that no sysfs attribute for the type should be created. Only call strlen() and strcpy() on type if it is not NULL. This patch addresses Coverity #102180 and #102182: Dereference before null check Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24thermal: fix potential out-of-bounds memory accessGuenter Roeck1-2/+3
temp_crit.name and temp_input.name have a length of 16 bytes. Using THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in out-of-bounds memory accesses. Replace it with sizeof(). Addresses Coverity #115679 Signed-off-by: Guenter Roeck <linux@roeck-us.net> Cc: Len Brown <lenb@kernel.org> Cc: "Brown, Len" <len.brown@intel.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24Thermal: Introduce locking for cdev.thermal_instances list.Zhang Rui1-0/+8
we need to go over all the thermal_instance list of a cooling device to decide which cooling state to put the cooling device to. But at this time, as a cooling device may be referenced in multiple thermal zones, we need to lock the list first in case another thermal zone is updating this cooling device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: Unify the code for both active and passive coolingZhang Rui1-85/+25
Remove thermal_zone_device_passive(). And use thermal_zone_trip_update() and thermal_zone_do_update() for both active and passive cooling. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: Introduce simple arbitrator for setting device cooling stateZhang Rui1-3/+41
This fixes the problem that a cooling device may be referenced by by multiple trip points in multiple thermal zones. With this patch, we have two stages for updating a thermal zone, 1. check if a thermal_instance needs to be updated or not 2. update the cooling device, based on the target cooling state of all its instances. Note that, currently, the cooling device is set to the deepest cooling state required. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: List thermal_instance in thermal_cooling_device.Zhang Rui1-1/+6
List thermal_instance in thermal_cooling_device so that cooling device can know the cooling state requirement of all the thermal instances. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: Rename thermal_instance.node to thermal_instance.tz_node.Zhang Rui1-10/+10
thermal_instance should be referenced by both thermal zone devices and thermal cooling devices. Rename thermal_instance.node to thermal_instance.tz_node in this patch and thermal_instanace.cdev_node will be introduced in next patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: Rename thermal_zone_device.cooling_devicesZhang Rui1-9/+9
Rename thermal_zone_device.cooling_devices to thermal_zone_device.thermal_instances thermal_zone_device.cooling_devices is not accurate as this is a list for thermal instances, rather than cooling devices. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: rename structure thermal_cooling_device_instance to thermal_instanceZhang Rui1-9/+9
This struct is used to describe the behavior for a thermal cooling device on a certain trip point for a certain thremal zone. thermal_cooling_device_instance is not accurate, as a cooling device can be used for more than one trip point in one thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: Introduce thermal_zone_trip_update()Zhang Rui1-26/+76
This function is used to update the cooling state of all the cooling devices that are bound to an active trip point. This will be used for passive cooling as well, in the future patches. as both active and passive cooling can share the same algorithm, which is 1. if the temperature is higher than a trip point, a. if the trend is THERMAL_TREND_RAISING, use higher cooling state for this trip point b. if the trend is THERMAL_TREND_DROPPING, use lower cooling state for this trip point 2. if the temperature is lower than a trip point, use lower cooling state for this trip point. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: Remove tc1/tc2 in generic thermal layer.Zhang Rui1-18/+6
Remove tc1/tc2 in generic thermal layer. .get_trend() callback starts to take effect from this patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-09-24Thermal: Introduce .get_trend() callback.Zhang Rui1-2/+17
According to ACPI spec, tc1 and tc2 are used by OSPM to anticipate the temperature trends. We introduced the same concept to the generic thermal layer for passive cooling, but now it seems that these values are hard to be used on other platforms. So We introduce .get_trend() as a more general solution. For the platform thermal drivers that have their own way to anticipate the temperature trends, they should provide their own .get_trend() callback. Or else, we will calculate the temperature trends by simply comparing the current temperature and the cached previous temperature reading. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-09-24Thermal: set upper and lower limitsZhang Rui1-7/+16
set upper and lower limits when binding a thermal cooling device to a thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: Introduce cooling states range supportZhang Rui1-4/+21
As the active cooling devices can have multiple cooling states, we may want only several cooling states for a certain trip point, and other cooling states for other active trip points. To do this, we should be able to describe the cooling device behavior for a certain trip point, rather than for the entire thermal zone. And when updating thermal zone, we need to check the upper and lower limit to make sure the cooling device is set to the proper cooling state. Note that this patch will not bring any different behavior as upper limit is set to max_state and lower limit is set to 0 in this patch, for now. Next patch will set these to real values. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: Introduce multiple cooling states supportZhang Rui1-2/+10
This is because general active cooling devices, like fans, may have multiple speeds, which can be mapped to different cooling states. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-08-13workqueue: use mod_delayed_work() instead of cancel + queueTejun Heo1-9/+6
Convert delayed_work users doing cancel_delayed_work() followed by queue_delayed_work() to mod_delayed_work(). Most conversions are straight-forward. Ones worth mentioning are, * drivers/edac/edac_mc.c: edac_mc_workq_setup() converted to always use mod_delayed_work() and cancel loop in edac_mc_reset_delay_period() is dropped. * drivers/platform/x86/thinkpad_acpi.c: No need to remember whether watchdog is active or not. @fan_watchdog_active and related code dropped. * drivers/power/charger-manager.c: Seemingly a lot of delayed_work_pending() abuse going on here. [delayed_]work_pending() are unsynchronized and racy when used like this. I converted one instance in fullbatt_handler(). Please conver the rest so that it invokes workqueue APIs for the intended target state rather than trying to game work item pending state transitions. e.g. if timer should be modified - call mod_delayed_work(), canceled - call cancel_delayed_work[_sync](). * drivers/thermal/thermal_sys.c: thermal_zone_device_set_polling() simplified. Note that round_jiffies() calls in this function are meaningless. round_jiffies() work on absolute jiffies not delta delay used by delayed_work. v2: Tomi pointed out that __cancel_delayed_work() users can't be safely converted to mod_delayed_work(). They could be calling it from irq context and if that happens while delayed_work_timer_fn() is running, it could deadlock. __cancel_delayed_work() users are dropped. Signed-off-by: Tejun Heo <tj@kernel.org> Acked-by: Henrique de Moraes Holschuh <hmh@hmh.eng.br> Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Acked-by: Anton Vorontsov <cbouatmailru@gmail.com> Acked-by: David Howells <dhowells@redhat.com> Cc: Tomi Valkeinen <tomi.valkeinen@ti.com> Cc: Jens Axboe <axboe@kernel.dk> Cc: Jiri Kosina <jkosina@suse.cz> Cc: Doug Thompson <dougthompson@xmission.com> Cc: David Airlie <airlied@linux.ie> Cc: Roland Dreier <roland@kernel.org> Cc: "John W. Linville" <linville@tuxdriver.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Len Brown <len.brown@intel.com> Cc: "J. Bruce Fields" <bfields@fieldses.org> Cc: Johannes Berg <johannes@sipsolutions.net>
2012-07-31Merge tag 'for-v3.6' of git://git.infradead.org/battery-2.6Linus Torvalds1-1/+1
Pull battery updates from Anton Vorontsov: "The tag contains just a few battery-related changes for v3.6. It's is all pretty straightforward, except one thing. One of our patches added thermal support for power supply class, but thermal/ subsystem changed under our feet. We (well, Stephen, that is) caught the issue and it was decided[1] that I'd just delay the battery pull request, and then will fix it up by merging upstream back into battery tree at the specific commit. That's not all though: another[2] small fixup for thermal subsystem was needed to get rid of a warning in power supply subsystem (the warning was not drivers/power's "fault", the thermal registration function just needed a proper const annotation, which is also done by a small commit on top of the merge. So, to sum this up: - The 'master' branch of the battery tree was in the -next tree for weeks, was never rebased, altered etc. It should be all OK; - Although, for-v3.6 tag contains the 'master' branch + merge + the warning fix. [1] http://lkml.org/lkml/2012/6/19/23 [2] http://lkml.org/lkml/2012/6/18/28" * tag 'for-v3.6' of git://git.infradead.org/battery-2.6: (23 commits) thermal: Constify 'type' argument for the registration routine olpc-battery: update CHARGE_FULL_DESIGN property for BYD LiFe batteries olpc-battery: Add VOLTAGE_MAX_DESIGN property charger-manager: Fix build break related to EXTCON lp8727_charger: Move header file into platform_data directory power_supply: Add min/max alert properties for CAPACITY, TEMP, TEMP_AMBIENT bq27x00_battery: Add support for BQ27425 chip charger-manager: Set current limit of regulator for over current protection charger-manager: Use EXTCON Subsystem to detect charger cables for charging test_power: Add VOLTAGE_NOW and BATTERY_TEMP properties test_power: Add support for USB AC source gpio-charger: Use cansleep version of gpio_set_value bq27x00_battery: Add support for power average and health properties sbs-battery: Don't trigger false supply_changed event twl4030_charger: Allow charger to control the regulator that feeds it twl4030_charger: Add backup-battery charging twl4030_charger: Fix some typos max17042_battery: Support CHARGE_COUNTER power supply attribute smb347-charger: Add constant charge and current properties power_supply: Add constant charge_current and charge_voltage properties ...
2012-07-31thermal: Constify 'type' argument for the registration routineAnton Vorontsov1-1/+1
thermal_zone_device_register() does not modify 'type' argument, so it is safe to declare it as const. Otherwise, if we pass a const string, we are getting the ugly warning: CC drivers/power/power_supply_core.o drivers/power/power_supply_core.c: In function 'psy_register_thermal': drivers/power/power_supply_core.c:204:6: warning: passing argument 1 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default] include/linux/thermal.h:140:29: note: expected 'char *' but argument is of type 'const char *' Signed-off-by: Anton Vorontsov <anton.vorontsov@linaro.org> Acked-by: Jean Delvare <khali@linux-fr.org>
2012-07-24Thermal: Add Hysteresis attributesDurgadoss R1-5/+83
The Linux Thermal Framework does not support hysteresis attributes. Most thermal sensors, today, have a hysteresis value associated with trip points. This patch adds hysteresis attributes on a per-trip-point basis, to the Thermal Framework. These attributes are optionally writable. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2012-07-24Thermal: Make Thermal trip points writeableDurgadoss R1-44/+101
Some of the thermal drivers using the Generic Thermal Framework require (all/some) trip points to be writeable. This patch makes the trip point temperatures writeable on a per-trip point basis, and modifies the required function call in thermal.c. This patch also updates the Documentation to reflect the new change. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22thermal: Fix for setting the thermal zone mode to enable/disableAmit Daniel Kachhap1-2/+2
Basically without this patch changing the mode of thermal zone is not possible as wrong string size is passed to strncmp. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22thermal_sys: convert printks to pr_<level>Joe Perches1-8/+6
Use the current logging style. Remove PREFIX, add pr_fmt, convert the printks. All dmesg output now prefixed with "thermal_sys: ". Signed-off-by: Joe Perches <joe@perches.com> Cc: Jesper Juhl <jj@chaosbits.net> Cc: Len Brown <lenb@kernel.org> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22thermal_sys: kernel style cleanupsJoe Perches1-17/+13
Just a few tidies to make it more like most kernel sources. A couple of long lines still remain. Signed-off-by: Joe Perches <joe@perches.com> Reviewed-by: Jesper Juhl <jj@chaosbits.net> Cc: Len Brown <lenb@kernel.org> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22thermal_sys: remove obfuscating used-once macrosJoe Perches1-20/+12
These don't add any value as they are used only once and the surrounding code uses similar variable. Signed-off-by: Joe Perches <joe@perches.com> Cc: Jesper Juhl <jj@chaosbits.net> Cc: Len Brown <lenb@kernel.org> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22thermal_sys: remove unnecessary line continuationsJoe Perches1-6/+5
Line continations are not necessary in function calls or statements. Remove them. Signed-off-by: Joe Perches <joe@perches.com> Reviewed-by: Jesper Juhl <jj@chaosbits.net> Cc: Len Brown <lenb@kernel.org> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22drivers/thermal/thermal_sys.c: fix build warningFabio Estevam1-2/+1
With CONFIG_NET=n: drivers/thermal/thermal_sys.c:63: warning: 'thermal_event_seqnum' defined but not used Move 'thermal_event_seqnum' definition inside the '#ifdef CONFIG_NET' [akpm@linux-foundation.org: make thermal_event_seqnum local to generate_netlink_event()] Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Acked-by: Durgadoss R <durgadoss.r@intel.com> Cc: Jean Delvare <khali@linux-fr.org> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2012-01-23thermal: Rename generate_netlink_eventJean Delvare1-2/+2
It doesn't seem right for the thermal subsystem to export a symbol named generate_netlink_event. This function is thermal-specific and its name should reflect that fact. Rename it to thermal_generate_netlink_event. Signed-off-by: Jean Delvare <khali@linux-fr.org> Acked-by: Rafael J. Wysocki <rjw@sisk.pl> Acked-by: R.Durgadoss <durgadoss.r@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2011-11-06thermal: Prevent polling from happening during system suspendRafael J. Wysocki1-2/+2
The thermal driver should use a freezable workqueue to schedule polling to prevent thermal_zone_device_update() from being run during system suspend, when the devices it relies on may be inactive. Make it use the system freezable workqueue for this purpose. Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl> Signed-off-by: Len Brown <len.brown@intel.com>
2011-08-02thermal: make THERMAL_HWMON implementation fully internalJean Delvare1-25/+92
THERMAL_HWMON is implemented inside the thermal_sys driver and has no effect on drivers implementing thermal zones, so they shouldn't see anything related to it in <linux/thermal.h>. Making the THERMAL_HWMON implementation fully internal has two advantages beyond the cleaner design: * This avoids rebuilding all thermal drivers if the THERMAL_HWMON implementation changes, or if CONFIG_THERMAL_HWMON gets enabled or disabled. * This avoids breaking the thermal kABI in these cases too, which should make distributions happy. The only drawback I can see is slightly higher memory fragmentation, as the number of kzalloc() calls will increase by one per thermal zone. But I doubt it will be a problem in practice, as I've never seen a system with more than two thermal zones. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-08-02thermal: split hwmon lookup to a separate functionJean Delvare1-6/+19
We'll soon need to reuse it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-03-23ACPI:Fix goto flows in thermal-sysDurgadoss R1-6/+7
This patch fixes two minor bugs in thermal_sys: (a) The flow of goto's in thermal_hwmon_add_sysfs. (b) Remove the temp*_crit only if there is a get_crit_temp defined, in thermal_remove_hwmon_sysfs. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2011-02-28ACPI: Fix build for CONFIG_NET unsetRafael J. Wysocki1-19/+21
Several ACPI drivers fail to build if CONFIG_NET is unset, because they refer to things depending on CONFIG_THERMAL that in turn depends on CONFIG_NET. However, CONFIG_THERMAL doesn't really need to depend on CONFIG_NET, because the only part of it requiring CONFIG_NET is the netlink interface in thermal_sys.c. Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET and remove the dependency of CONFIG_THERMAL on CONFIG_NET from drivers/thermal/Kconfig. Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl> Acked-by: Randy Dunlap <randy.dunlap@oracle.com> Cc: Ingo Molnar <mingo@elte.hu> Cc: Len Brown <lenb@kernel.org> Cc: Stephen Rothwell <sfr@canb.auug.org.au> Cc: Luming Yu <luming.yu@intel.com> Cc: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2011-01-12Merge branch 'misc' into releaseLen Brown1-12/+5
2011-01-12thermal: Add event notification to thermal frameworkR.Durgadoss1-1/+102
This patch adds event notification support to the generic thermal sysfs framework in the kernel. The notification is in the form of a netlink event. Signed-off-by: R.Durgadoss <durgadoss.r@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2010-11-30thermal: make ops constantAlan Cox1-12/+5
And while touching that function definition do something about the disaster of formatting there. Signed-off-by: Alan Cox <alan@linux.intel.com> Acked-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2010-04-07drivers/thermal/thermal_sys.c: fix 'key f70f4b50 not in .data' in thermal_sysSergey Senozhatsky1-0/+3
Initialize sysfs attributes before device_create_file call. Addresses https://bugzilla.kernel.org/show_bug.cgi?id=15548 Signed-off-by: Wolfram Sang <w.sang@pengutronix.de> Signed-off-by: Sergey Senozhatsky <sergey.senozhatsky@gmail.com> Cc: "Eric W. Biederman" <ebiederm@xmission.com> Cc: Greg KH <gregkh@suse.de> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Len Brown <len.brown@intel.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2010-03-30include cleanup: Update gfp.h and slab.h includes to prepare for breaking implicit slab.h inclusion from percpu.hTejun Heo1-0/+1
percpu.h is included by sched.h and module.h and thus ends up being included when building most .c files. percpu.h includes slab.h which in turn includes gfp.h making everything defined by the two files universally available and complicating inclusion dependencies. percpu.h -> slab.h dependency is about to be removed. Prepare for this change by updating users of gfp and slab facilities include those headers directly instead of assuming availability. As this conversion needs to touch large number of source files, the following script is used as the basis of conversion. http://userweb.kernel.org/~tj/misc/slabh-sweep.py The script does the followings. * Scan files for gfp and slab usages and update includes such that only the necessary includes are there. ie. if only gfp is used, gfp.h, if slab is used, slab.h. * When the script inserts a new include, it looks at the include blocks and try to put the new include such that its order conforms to its surrounding. It's put in the include block which contains core kernel includes, in the same order that the rest are ordered - alphabetical, Christmas tree, rev-Xmas-tree or at the end if there doesn't seem to be any matching order. * If the script can't find a place to put a new include (mostly because the file doesn't have fitting include block), it prints out an error message indicating which .h file needs to be added to the file. The conversion was done in the following steps. 1. The initial automatic conversion of all .c files updated slightly over 4000 files, deleting around 700 includes and adding ~480 gfp.h and ~3000 slab.h inclusions. The script emitted errors for ~400 files. 2. Each error was manually checked. Some didn't need the inclusion, some needed manual addition while adding it to implementation .h or embedding .c file was more appropriate for others. This step added inclusions to around 150 files. 3. The script was run again and the output was compared to the edits from #2 to make sure no file was left behind. 4. Several build tests were done and a couple of problems were fixed. e.g. lib/decompress_*.c used malloc/free() wrappers around slab APIs requiring slab.h to be added manually. 5. The script was run on all .h files but without automatically editing them as sprinkling gfp.h and slab.h inclusions around .h files could easily lead to inclusion dependency hell. Most gfp.h inclusion directives were ignored as stuff from gfp.h was usually wildly available and often used in preprocessor macros. Each slab.h inclusion directive was examined and added manually as necessary. 6. percpu.h was updated not to include slab.h. 7. Build test were done on the following configurations and failures were fixed. CONFIG_GCOV_KERNEL was turned off for all tests (as my distributed build env didn't work with gcov compiles) and a few more options had to be turned off depending on archs to make things build (like ipr on powerpc/64 which failed due to missing writeq). * x86 and x86_64 UP and SMP allmodconfig and a custom test config. * powerpc and powerpc64 SMP allmodconfig * sparc and sparc64 SMP allmodconfig * ia64 SMP allmodconfig * s390 SMP allmodconfig * alpha SMP allmodconfig * um on x86_64 SMP allmodconfig 8. percpu.h modifications were reverted so that it could be applied as a separate patch and serve as bisection point. Given the fact that I had only a couple of failures from tests on step 6, I'm fairly confident about the coverage of this conversion patch. If there is a breakage, it's likely to be something in one of the arch headers which should be easily discoverable easily on most builds of the specific arch. Signed-off-by: Tejun Heo <tj@kernel.org> Guess-its-ok-by: Christoph Lameter <cl@linux-foundation.org> Cc: Ingo Molnar <mingo@redhat.com> Cc: Lee Schermerhorn <Lee.Schermerhorn@hp.com>
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