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2017-02-18thermal: ti-soc-thermal: Remove CPU_THERMAL Dependency from TI_THERMALKeerthy1-1/+0
Currently when CPU_THERMAL is not defined the thermal sensors are not even exposed consequently no cooling is possible. CPU_THERMAL eventually depends on CPUFREQ. CPPUFREQ is not the only cooling for CPU. The thermal shutdown for critical temperatures is another cooling solution which will currently not get enabled if CPU_THERMAL is not defined. Remove this dependency so as to have the last level of thermal protection working even without CPUFREQ defined. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-29ti-soc-thermal: implement omap3 supportPavel Machek1-0/+15
This adds support for OMAP3 chips to ti-soc-thermal. As requested by TI people, it is marked unreliable and warning is printed. Signed-off-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13thermal: ti-soc: Kconfig fix to avoid menu showing wronglyEduardo Valentin1-2/+0
Move the dependencies to menu, so we avoid showing it wrongly. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-omap@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13thermal: ti-soc: allow compile testEduardo Valentin1-4/+4
Adding COMPILE_TEST flag to ti-soc driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-omap@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2013-06-13thermal: ti-soc-thermal: add thermal data for DRA752 chipsEduardo Valentin1-0/+12
This patch adds the thermal data for TI DRA752 chips. In this change it includes (autogen): . Register offset definitions . Bitfields and masks for all registers . Conversion table Also, the thermal limits, thresholds and extrapolation rules are included. The extrapolation rule is simply add +2C as margin. All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined and exposed. Only MPU has cooling device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-28thermal: introduce TI SoC thermal driverEduardo Valentin1-0/+48
This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>