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2015-08-03Merge branch 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into for-rcZhang Rui4-14/+20
2015-08-03thermal: Drop owner assignment from platform_driverKrzysztof Kozlowski1-1/+0
platform_driver does not need to set an owner because platform_driver_register() will set it. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-08-02thermal: exynos: Remove unused code related to platform_data on probe()Chanwoo Choi1-3/+0
This patch removes the unused code related to struct exynos_tmu_platform_data because exynos_tmu_probe() don't handle the struct exynos_tmu_platform_data *pdata. Test HW: Exynos4412 - Trats2 board Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com> Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Tested-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-08-02thermal: exynos: Add the dependency of CONFIG_THERMAL_OF instead of CONFIG_OFChanwoo Choi1-1/+1
The exynos thermal driver use the of_thermal_*() API to parse the basic data for thermal management from devicetree file. So, if CONFIG_EXYNOS_THERMAL is selected without CONFIG_THERMAL_OF, kernel can build it without any problem. But, exynos thermal driver is not working with following error log. This patch add the dependency of CONFIG_THERMAL_OF instead of CONFIG_OF. [ 1.458644] get_th_reg: Cannot get trip points from of-thermal.c! [ 1.459096] get_th_reg: Cannot get trip points from of-thermal.c! [ 1.465211] exynos4412_tmu_initialize: No CRITICAL trip point defined at of-thermal.c! Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com> Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-08-02thermal: exynos: Disable the regulator on probe failureKrzysztof Kozlowski1-0/+2
During probe the regulator (if present) was enabled but not disabled in case of failure. So an unsuccessful probe lead to enabling the regulator which was actually not needed because the device was not enabled. Additionally each deferred probe lead to increase of regulator enable count so it would not be effectively disabled during removal of the device. Test HW: Exynos4412 - Trats2 board Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Fixes: 498d22f616f6 ("thermal: exynos: Support for TMU regulator defined at device tree") Cc: <stable@vger.kernel.org> Reviewed-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk> Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Tested-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-08-02thermal: power_allocator: trace the real requested powerJavi Merino1-10/+16
The power allocator governor uses ftrace to output a bunch of internal data for debugging and tuning. Currently, the requested power it outputs is the "weighted" requested power, that is, what each cooling device has requested multiplied by the cooling device weight. It is more useful to trace the real request, without any weight being applied. This commit only affects the data traced, there is no functional change. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-08-02thermal: remove dangling 'weight_attr' device fileViresh Kumar1-0/+1
This file isn't getting removed while we unbind a device from thermal zone. And this causes following messages when the device is registered again: WARNING: CPU: 0 PID: 2228 at /home/viresh/linux/fs/sysfs/dir.c:31 sysfs_warn_dup+0x60/0x70() sysfs: cannot create duplicate filename '/devices/virtual/thermal/thermal_zone0/cdev0_weight' Modules linked in: cpufreq_dt(+) [last unloaded: cpufreq_dt] CPU: 0 PID: 2228 Comm: insmod Not tainted 4.2.0-rc3-00059-g44fffd9473eb #272 Hardware name: SAMSUNG EXYNOS (Flattened Device Tree) [<c00153e8>] (unwind_backtrace) from [<c0012368>] (show_stack+0x10/0x14) [<c0012368>] (show_stack) from [<c053a684>] (dump_stack+0x84/0xc4) [<c053a684>] (dump_stack) from [<c002284c>] (warn_slowpath_common+0x80/0xb0) [<c002284c>] (warn_slowpath_common) from [<c00228ac>] (warn_slowpath_fmt+0x30/0x40) [<c00228ac>] (warn_slowpath_fmt) from [<c012d524>] (sysfs_warn_dup+0x60/0x70) [<c012d524>] (sysfs_warn_dup) from [<c012d244>] (sysfs_add_file_mode_ns+0x13c/0x190) [<c012d244>] (sysfs_add_file_mode_ns) from [<c012d2d4>] (sysfs_create_file_ns+0x3c/0x48) [<c012d2d4>] (sysfs_create_file_ns) from [<c03c04a8>] (thermal_zone_bind_cooling_device+0x260/0x358) [<c03c04a8>] (thermal_zone_bind_cooling_device) from [<c03c2e70>] (of_thermal_bind+0x88/0xb4) [<c03c2e70>] (of_thermal_bind) from [<c03c10d0>] (__thermal_cooling_device_register+0x17c/0x2e0) [<c03c10d0>] (__thermal_cooling_device_register) from [<c03c3f50>] (__cpufreq_cooling_register+0x3a0/0x51c) [<c03c3f50>] (__cpufreq_cooling_register) from [<bf00505c>] (cpufreq_ready+0x44/0x88 [cpufreq_dt]) [<bf00505c>] (cpufreq_ready [cpufreq_dt]) from [<c03d6c30>] (cpufreq_add_dev+0x4a0/0x7dc) [<c03d6c30>] (cpufreq_add_dev) from [<c02cd3ec>] (subsys_interface_register+0x94/0xd8) [<c02cd3ec>] (subsys_interface_register) from [<c03d785c>] (cpufreq_register_driver+0x10c/0x1f0) [<c03d785c>] (cpufreq_register_driver) from [<bf0057d4>] (dt_cpufreq_probe+0x60/0x8c [cpufreq_dt]) [<bf0057d4>] (dt_cpufreq_probe [cpufreq_dt]) from [<c02d03e4>] (platform_drv_probe+0x44/0xa4) [<c02d03e4>] (platform_drv_probe) from [<c02cead8>] (driver_probe_device+0x174/0x2b4) [<c02cead8>] (driver_probe_device) from [<c02ceca4>] (__driver_attach+0x8c/0x90) [<c02ceca4>] (__driver_attach) from [<c02cd078>] (bus_for_each_dev+0x68/0x9c) [<c02cd078>] (bus_for_each_dev) from [<c02ce2f0>] (bus_add_driver+0x19c/0x214) [<c02ce2f0>] (bus_add_driver) from [<c02cf490>] (driver_register+0x78/0xf8) [<c02cf490>] (driver_register) from [<c0009710>] (do_one_initcall+0x8c/0x1d4) [<c0009710>] (do_one_initcall) from [<c05396b0>] (do_init_module+0x5c/0x1b8) [<c05396b0>] (do_init_module) from [<c0086490>] (load_module+0xd34/0xed8) [<c0086490>] (load_module) from [<c0086704>] (SyS_init_module+0xd0/0x120) [<c0086704>] (SyS_init_module) from [<c000f480>] (ret_fast_syscall+0x0/0x3c) ---[ end trace 3be0e7b7dc6e3c4f ]--- Fixes: db91651311c8 ("thermal: export weight to sysfs") Acked-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-07-01Merge tag 'modules-next-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/rusty/linuxLinus Torvalds1-2/+2
Pull module updates from Rusty Russell: "Main excitement here is Peter Zijlstra's lockless rbtree optimization to speed module address lookup. He found some abusers of the module lock doing that too. A little bit of parameter work here too; including Dan Streetman's breaking up the big param mutex so writing a parameter can load another module (yeah, really). Unfortunately that broke the usual suspects, !CONFIG_MODULES and !CONFIG_SYSFS, so those fixes were appended too" * tag 'modules-next-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/rusty/linux: (26 commits) modules: only use mod->param_lock if CONFIG_MODULES param: fix module param locks when !CONFIG_SYSFS. rcu: merge fix for Convert ACCESS_ONCE() to READ_ONCE() and WRITE_ONCE() module: add per-module param_lock module: make perm const params: suppress unused variable error, warn once just in case code changes. modules: clarify CONFIG_MODULE_COMPRESS help, suggest 'N'. kernel/module.c: avoid ifdefs for sig_enforce declaration kernel/workqueue.c: remove ifdefs over wq_power_efficient kernel/params.c: export param_ops_bool_enable_only kernel/params.c: generalize bool_enable_only kernel/module.c: use generic module param operaters for sig_enforce kernel/params: constify struct kernel_param_ops uses sysfs: tightened sysfs permission checks module: Rework module_addr_{min,max} module: Use __module_address() for module_address_lookup() module: Make the mod_tree stuff conditional on PERF_EVENTS || TRACING module: Optimize __module_address() using a latched RB-tree rbtree: Implement generic latch_tree seqlock: Introduce raw_read_seqcount_latch() ...
2015-06-25Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linuxLinus Torvalds23-529/+3612
Pull thermal management updates from Zhang Rui: "Specifics: - enhance Thermal Framework with several new capabilities: * use power estimates * compute weights with relative integers instead of percentages * allow governors to have private data in thermal zones * export thermal zone parameters through sysfs Thanks to the ARM thermal team (Javi, Punit, KP). - introduce a new thermal governor: power allocator. First in kernel closed loop PI(D) controller for thermal control. Thanks to ARM thermal team. - enhance OF thermal to allow thermal zones to have sustainable power HW specification. Thanks to Punit. - introduce thermal driver for Intel Quark SoC x1000platform. Thanks to Ong, Boon Leong. - introduce QPNP PMIC temperature alarm driver. Thanks to Ivan T. I. - introduce thermal driver for Hisilicon hi6220. Thanks to kongxinwei. - enhance Exynos thermal driver to handle Exynos5433 TMU. Thanks to Chanwoo C. - TI thermal driver now has a better implementation for EOCZ bit. From Pavel M. - add id for Skylake processors in int340x processor thermal driver. - a couple of small fixes and cleanups." * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits) thermal: hisilicon: add new hisilicon thermal sensor driver dt-bindings: Document the hi6220 thermal sensor bindings thermal: of-thermal: add support for reading coefficients property thermal: support slope and offset coefficients thermal: power_allocator: round the division when divvying up power thermal: exynos: Add the support for Exynos5433 TMU thermal: cpu_cooling: Fix power calculation when CPUs are offline thermal: cpu_cooling: Remove cpu_dev update on policy CPU update thermal: export thermal_zone_parameters to sysfs thermal: cpu_cooling: Check memory allocation of power_table ti-soc-thermal: request temperature periodically if hw can't do that itself ti-soc-thermal: implement eocz bit to make driver useful on omap3 cleanup ti-soc-thermal thermal: remove stale THERMAL_POWER_ACTOR select thermal: Default OF created trip points to writable thermal: core: Add Kconfig option to enable writable trips thermal: x86_pkg_temp: drop const for thermal_zone_parameters of: thermal: Introduce sustainable power for a thermal zone thermal: add trace events to the power allocator governor thermal: introduce the Power Allocator governor ...
2015-06-11Merge branches 'release' and 'thermal-soc' of .git into nextZhang Rui19-161/+2544
2015-06-11Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-socZhang Rui17-118/+2494
2015-06-03thermal: hisilicon: add new hisilicon thermal sensor driverkongxinwei3-0/+430
This patch adds the support for hisilicon thermal sensor, within hisilicon SoC. there will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-28kernel/params: constify struct kernel_param_ops usesLuis R. Rodriguez1-2/+2
Most code already uses consts for the struct kernel_param_ops, sweep the kernel for the last offending stragglers. Other than include/linux/moduleparam.h and kernel/params.c all other changes were generated with the following Coccinelle SmPL patch. Merge conflicts between trees can be handled with Coccinelle. In the future git could get Coccinelle merge support to deal with patch --> fail --> grammar --> Coccinelle --> new patch conflicts automatically for us on patches where the grammar is available and the patch is of high confidence. Consider this a feature request. Test compiled on x86_64 against: * allnoconfig * allmodconfig * allyesconfig @ const_found @ identifier ops; @@ const struct kernel_param_ops ops = { }; @ const_not_found depends on !const_found @ identifier ops; @@ -struct kernel_param_ops ops = { +const struct kernel_param_ops ops = { }; Generated-by: Coccinelle SmPL Cc: Rusty Russell <rusty@rustcorp.com.au> Cc: Junio C Hamano <gitster@pobox.com> Cc: Andrew Morton <akpm@linux-foundation.org> Cc: Kees Cook <keescook@chromium.org> Cc: Tejun Heo <tj@kernel.org> Cc: Ingo Molnar <mingo@kernel.org> Cc: cocci@systeme.lip6.fr Cc: linux-kernel@vger.kernel.org Signed-off-by: Luis R. Rodriguez <mcgrof@suse.com> Signed-off-by: Rusty Russell <rusty@rustcorp.com.au>
2015-05-19Merge branch 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into for-rcZhang Rui5-7/+89
2015-05-11thermal: of-thermal: add support for reading coefficients propertyEduardo Valentin1-2/+24
In order to avoid having each driver adding their own specific DT property to specify slope and offset, this patch adds a basic coefficient reading from DT thermal zone node. Right now, as the thermal framework does not support multiple sensors, the current coefficients apply only to the only sensor in the thermal zone. The supported equation is a simple linear model: slope * <sensor reading> + offset. slope and offset are read from the coefficients DT property. In the same way as it is described in the DT thermal binding. So, as of today, the thermal framework will support only cases like: /* hotspot = 1 * adc + 6000 */ coefficients = <1 6000>; Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-11thermal: support slope and offset coefficientsEduardo Valentin1-0/+4
It is common to have a linear extrapolation from the current sensor readings and the actual temperature value. This is specially the case when the sensor is in use to extrapolate hotspots. This patch adds slope and offset constants for single sensor linear extrapolation equation. Because the same sensor can be use in different locations, from board to board, these constants are added as part of thermal_zone_params. The constants are available through sysfs. It is up to the device driver to determine the usage of these values. Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-11thermal: power_allocator: round the division when divvying up powerJavi Merino1-1/+2
In situations where there is an uneven number of cooling devices, the division of power among them can lead to a milliwatt being dropped on the floor due to rounding errors. This doesn't sound like a lot, but some devices only grant the lowest cooling device state for their maximum power. So for instance, if the granted_power is the maximum power and all devices are getting their maximum power, one would get max_power - 1, making it choose cooling device state 1, instead of 0. Round the division to make the calculation more accurate. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-09thermal: armada: Update Armada 380 thermal sensor coefficientsNadav Haklai1-3/+3
Improve the Armada 380 thermal sensor accuracy by using updated formula. The updated formula is: Temperature[C degrees] = 0.4761 * tsen_vsen_out - 279.1 Signed-off-by: Nadav Haklai <nadavh@marvell.com> Signed-off-by: Gregory CLEMENT <gregory.clement@free-electrons.com> Cc: <stable@vger.kernel.org> #v3.16 Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-09thermal: rockchip: fix an error codeDan Carpenter1-1/+1
There is a copy and paste bug, "->clk" vs "->pclk", so we return the wrong error code here. Fixes: cbac8f639437 ('thermal: rockchip: add driver for thermal') Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com> Reviewed-by: Caesar Wang <wxt@rock-chips.com> Reviewed-by: Doug Anderson <dianders@chromium.org> Tested-by: Caesar Wang <wxt@rock-chips.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-09thermal/powerclamp: fix missing newer package c-statesJacob Pan1-37/+43
Package C8 to C10 was introduced in newer Intel CPUs, we need to include them in the package c-state residency calculation. Otherwise, idle injection target is not accurately maintained by the closed control loop. Also cleaned up the code to make it scale better with large number of c-states. Reported-by: Kristen Carlson Accardi <kristen@linux.intel.com> Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-09thermal/intel_powerclamp: add id for broadwell serverJacob Pan1-0/+1
Broadwell server has support for package C-states, idle injection works as expected on this platform. Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-09thermal/intel_powerclamp: add __init / __exit annotationsMathias Krause1-4/+4
Mark the module init / exit functions with __init / __exit accodingly. This allows making the intel_powerclamp_ids[] array __initconst, too, as it only gets referenced from powerclamp_probe(). This is safe as file2alias doesn't care about the section, but the symbol name for the MODULE_DEVICE_TABLE alias. Cc: Arjan van de Ven <arjan@linux.intel.com> Cc: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Mathias Krause <minipli@googlemail.com> Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-08thermal: ti-soc-thermal: OMAP5: Implement Workaround for Errata i813Keerthy3-3/+45
DESCRIPTION Spurious Thermal Alert: Talert can happen randomly while the device remains under the temperature limit defined for this event to trig. This spurious event is caused by a incorrect re-synchronization between clock domains. The comparison between configured threshold and current temperature value can happen while the value is transitioning (metastable), thus causing inappropriate event generation. No spurious event occurs as long as the threshold value stays unchanged. Spurious event can be generated while a thermal alert threshold is modified in CONTROL_BANDGAP_THRESHOLD_MPU/GPU/CORE/DSPEVE/IVA_n. WORKAROUND Spurious event generation can be avoided by performing following sequence when the threshold is modified: 1. Mask the hot/cold events at the thermal IP level. 2. Modify Threshold. 3. Unmask the hot/cold events at the thermal IP level. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-08thermal: ti-soc-thermal: dra7: Implement Workaround for Errata i814Keerthy3-2/+42
Bandgap Temperature read Dtemp can be corrupted DESCRIPTION Read accesses to registers listed below can be corrupted due to incorrect resynchronization between clock domains. Read access to registers below can be corrupted : • CTRL_CORE_DTEMP_MPU/GPU/CORE/DSPEVE/IVA_n (n = 0 to 4) • CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA_n WORKAROUND Multiple reads to CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA[9:0]: BGAP_DTEMPMPU/GPU/CORE/DSPEVE/IVA is needed to discard false value and read right value: 1. Perform two successive reads to BGAP_DTEMP bit field. (a) If read1 returns Val1 and read2 returns Val1, then right value is Val1. (b) If read1 returns Val1, read 2 returns Val2, a third read is needed. 2. Perform third read (a) If read3 returns Val2 then right value is Val2. (b) If read3 returns Val3, then right value is Val3. The above in gist means if val1 and val2 are the same then we can go ahead with that value else we need a third read which will be right since synchronization will be complete by then. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: exynos: Add the support for Exynos5433 TMUChanwoo Choi2-2/+186
This patch adds the support for Exynos5433's TMU (Thermal Management Unit). Exynos5433 has a little different register bit fields as following description: - Support the eight trip points for rising/falling interrupt by using two registers - Read the calibration type (1-point or 2-point) and sensor id from TRIMINFO register - Use a little different register address Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: cpu_cooling: Fix power calculation when CPUs are offlineKapileshwar Singh1-1/+12
Ensure that the CPU for which the frequency is being requested is online. If none of the CPUs are online the requested power is returned as 0. Acked-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: cpu_cooling: Remove cpu_dev update on policy CPU updateKapileshwar Singh1-40/+0
It was initially understood that an update to the cpu_device (cached in cpufreq_cooling_device) was required to ascertain the correct operating point of the device on a cpufreq policy->cpu update or creation or deletion of a cpufreq policy. (e.g. when the existing policy CPU goes offline). This update is not required and it is possible to ascertain the OPPs from the leading CPU in a cpufreq domain even if the CPU is hotplugged out. Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API") Acked-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: export thermal_zone_parameters to sysfsJavi Merino1-0/+101
It's useful for tuning to be able to edit thermal_zone_parameters from userspace. Export them to the thermal_zone sysfs so that they can be easily changed. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: cpu_cooling: Check memory allocation of power_tableJavi Merino1-0/+4
We allocate the power_table in memory but we don't test whether the allocation succeeded. Return -ENOMEM if kcalloc() fails. Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API") Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Reported-by: kbuild test robot <fengguang.wu@intel.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04ti-soc-thermal: request temperature periodically if hw can't do that itselfPavel Machek1-0/+8
When periodic mode is not enabled, it is neccessary to force reads. Signed-off-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04ti-soc-thermal: implement eocz bit to make driver useful on omap3Pavel Machek1-6/+18
For omap3, proper implementation of eocz bit is needed. It was actually a TODO in the driver. Signed-off-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04cleanup ti-soc-thermalPavel Machek2-49/+25
Simplify code by removing goto's where they point to simple return. Avoid confusing |= on error values. Correct whitespace. Signed-off-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: remove stale THERMAL_POWER_ACTOR selectJavi Merino1-1/+0
A previous version of this patch had a config for THERMAL_POWER_ACTOR but it was dropped. Remove the select as it is not doing anything. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Reported-by: Valentin Rothberg <valentinrothberg@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: Default OF created trip points to writablePunit Agrawal1-1/+5
When registering a thermal zone from device tree, default the trip points to writable. By default, only the root user can change these. This allows the trip points to be tweaked after the system has booted. Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: core: Add Kconfig option to enable writable tripsPunit Agrawal2-1/+13
Add a Kconfig option to allow system integrators to control whether userspace tools can change trip temperatures. This option overrides the thermal zone setup in the driver code and must be enabled for platform specified writable trips to come into effect. The original behaviour of requiring root privileges to change trip temperatures remains unchanged. Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: x86_pkg_temp: drop const for thermal_zone_parametersJavi Merino1-1/+1
8754d5115693 ("thermal: introduce the Power Allocator governor") dropped the const attribute in the struct thermal_zone_device. That means that the thermal_zone_params pointer passed to thermal_zone_device_register() also lost the const qualifier. Drop the const in x86_pkg_temp_thermal.c as well to avoid the following warning as reported by the kbuild test robot: drivers/thermal/x86_pkg_temp_thermal.c: In function 'pkg_temp_thermal_device_add': >> drivers/thermal/x86_pkg_temp_thermal.c:450:31: warning: passing argument 6 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type phy_dev_entry, &tzone_ops, &pkg_temp_tz_params, 0, 0); ^ In file included from drivers/thermal/x86_pkg_temp_thermal.c:30:0: include/linux/thermal.h:378:29: note: expected 'struct thermal_zone_params *' but argument is of type 'const struct thermal_zone_params *' struct thermal_zone_device *thermal_zone_device_register(const char *, int, int, ^ Cc: Jean Delvare <jdelvare@suse.de> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04of: thermal: Introduce sustainable power for a thermal zonePunit Agrawal1-0/+4
Introduce an optional property called, sustainable-power, which represents the power (in mW) which the thermal zone can safely dissipate. If provided the property is parsed and associated with the thermal zone via the thermal zone parameters. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: add trace events to the power allocator governorJavi Merino2-4/+49
Add trace events for the power allocator governor and the power actor interface of the cpu cooling device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Frederic Weisbecker <fweisbec@gmail.com> Cc: Ingo Molnar <mingo@redhat.com> Acked-by: Steven Rostedt <rostedt@goodmis.org> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: introduce the Power Allocator governorJavi Merino5-2/+551
The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: cpu_cooling: implement the power cooling device APIJavi Merino1-17/+566
Add a basic power model to the cpu cooling device to implement the power cooling device API. The power model uses the current frequency, current load and OPPs for the power calculations. The cpus must have registered their OPPs using the OPP library. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: extend the cooling device API to include power informationJavi Merino1-0/+52
Add three optional callbacks to the cooling device interface to allow them to express power. In addition to the callbacks, add helpers to identify cooling devices that implement the power cooling device API. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: let governors have private data for each thermal zoneJavi Merino1-8/+75
A governor may need to store its current state between calls to throttle(). That state depends on the thermal zone, so store it as private data in struct thermal_zone_device. The governors may have two new ops: bind_to_tz() and unbind_from_tz(). When provided, these functions let governors do some initialization and teardown when they are bound/unbound to a tz and possibly store that information in the governor_data field of the struct thermal_zone_device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: Add QPNP PMIC temperature alarm driverIvan T. Ivanov3-0/+321
Add support for the temperature alarm peripheral found inside Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm peripheral outputs a pulse on an interrupt line whenever the thermal over temperature stage value changes. Register a thermal sensor. The temperature reported by this thermal sensor device should reflect the actual PMIC die temperature if an ADC is present on the given PMIC. If no ADC is present, then the reported temperature should be estimated from the over temperature stage value. Cc: David Collins <collinsd@codeaurora.org> Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: fair_share: generalize the weight conceptJavi Merino1-5/+21
The fair share governor has the concept of weights, which is the influence of each cooling device in a thermal zone. The current implementation forces the weights of all cooling devices in a thermal zone to add up to a 100. This complicates setups, as you need to know in advance how many cooling devices you are going to have. If you bind a new cooling device, you have to modify all the other cooling devices weights, which is error prone. Furthermore, you can't specify a "default" weight for platforms since that default value depends on the number of cooling devices in the platform. This patch generalizes the concept of weight by allowing any number to be a "weight". Weights are now relative to each other. Platforms that don't specify weights get the same default value for all their cooling devices, so all their cdevs are considered to be equally influential. It's important to note that previous users of the weights don't need to alter the code: percentages continue to work as they used to. This patch just removes the constraint of all the weights in a thermal zone having to add up to a 100. If they do, you get the same behavior as before. If they don't, fair share now works for that platform. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Durgadoss R <durgadoss.r@intel.com> Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: export weight to sysfsJavi Merino2-0/+42
It's useful to have access to the weights for the cooling devices for thermal zones and change them if needed. Export them to sysfs. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: fair_share: fix typoJavi Merino1-1/+1
s/asscciated/associated/ Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Durgadoss R <durgadoss.r@intel.com> Reviewed-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: fair_share: use the weight from the thermal instanceJavi Merino1-14/+3
The fair share governor is not usable with thermal zones that use the bind op and don't populate thermal_zone_parameters, the majority of them. Now that the weight is in the thermal instance, we can use that in the fair share governor to allow every thermal zone to trivially use this governor. Furthermore, this simplifies the code. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Durgadoss R <durgadoss.r@intel.com> Reviewed-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: of: fix cooling device weights in device treeKapileshwar Singh7-12/+26
Currently you can specify the weight of the cooling device in the device tree but that information is not populated to the thermal_bind_params where the fair share governor expects it to be. The of thermal zone device doesn't have a thermal_bind_params structure and arguably it's better to pass the weight inside the thermal_instance as it is specific to the bind of a cooling device to a thermal zone parameter. Core thermal code is fixed to populate the weight in the instance from the thermal_bind_params, so platform code that was passing the weight inside the thermal_bind_params continue to work seamlessly. While we are at it, create a default value for the weight parameter for those thermal zones that currently don't define it and remove the hardcoded default in of-thermal. Cc: Zhang Rui <rui.zhang@intel.com> Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> Cc: Len Brown <lenb@kernel.org> Cc: Peter Feuerer <peter@piie.net> Cc: Darren Hart <dvhart@infradead.org> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Kukjin Kim <kgene@kernel.org> Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-01thermal: Use bool function return values of true/false not 1/0Joe Perches1-1/+1
Use the normal return values for bool functions Signed-off-by: Joe Perches <joe@perches.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-01intel powerclamp: support Knights LandingDasaratharaman Chandramouli1-0/+1
This patch enables intel_powerclamp driver to run on the next-generation Intel(R) Xeon Phi Microarchitecture code named "Knights Landing" Signed-off-by: Dasaratharaman Chandramouli <dasaratharaman.chandramouli@intel.com> Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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