Age | Commit message (Collapse) | Author | Files | Lines | |
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2012-03-02 | usb: dwc3: Add Exynos Specific Glue layer | 1 | -0/+24 | ||
Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com> |