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2012-12-12Thermal: Fix DEFAULT_THERMAL_GOVERNORZhang Rui1-2/+8
Fix DEFAULT_THERMAL_GOVERNOR to be consistant with the default governor selected in kernel config file. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Add a notification APIDurgadoss R1-0/+1
This patch adds a notification API which the sensor drivers' can use to notify the framework. The framework then takes care of the throttling according to the configured policy. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Make thermal_cdev_update as a global functionDurgadoss R1-0/+1
This patch makes the thermal_cdev_update function as a global one, so that other files can use it. This function serves as a single arbitrator to set the state of a cooling device. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Add thermal governor registration APIsDurgadoss R1-0/+16
This patch creates a structure to hold platform thermal governor information, and provides APIs for individual thermal governors to register/unregister with the Thermal framework. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Pass zone parameters as argument to tzd_registerDurgadoss R1-1/+2
This patch adds the thermal zone parameter as an argument to the tzd_register() function call; and updates other drivers using this function. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Add platform level information to thermal.hDurgadoss R1-0/+29
This patch adds platform level information to thermal.h by introducing two structures to hold: * bind parameters for a thermal zone, * zone level platform parameters Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Add get trend, get instance API's to thermal_sysDurgadoss R1-0/+4
This patch adds the following API's to thermal_sys.c, that can be used by other Thermal drivers. * get_tz_trend: obtain the trend of the given thermal zone * get_thermal_instance: obtain the instance corresponding to the given tz, cdev and the trip point. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Refactor thermal.h fileDurgadoss R1-35/+43
This patch rearranges the code in thermal.h file, in the following order, so that it is easy to read/maintain. 1. All #defines 2. All enums 3. All fops structures 4. All device structures 5. All function declarations Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24Thermal: Introduce locking for cdev.thermal_instances list.Zhang Rui1-0/+1
we need to go over all the thermal_instance list of a cooling device to decide which cooling state to put the cooling device to. But at this time, as a cooling device may be referenced in multiple thermal zones, we need to lock the list first in case another thermal zone is updating this cooling device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: Unify the code for both active and passive coolingZhang Rui1-1/+1
Remove thermal_zone_device_passive(). And use thermal_zone_trip_update() and thermal_zone_do_update() for both active and passive cooling. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: Introduce simple arbitrator for setting device cooling stateZhang Rui1-0/+1
This fixes the problem that a cooling device may be referenced by by multiple trip points in multiple thermal zones. With this patch, we have two stages for updating a thermal zone, 1. check if a thermal_instance needs to be updated or not 2. update the cooling device, based on the target cooling state of all its instances. Note that, currently, the cooling device is set to the deepest cooling state required. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: List thermal_instance in thermal_cooling_device.Zhang Rui1-0/+1
List thermal_instance in thermal_cooling_device so that cooling device can know the cooling state requirement of all the thermal instances. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: Rename thermal_zone_device.cooling_devicesZhang Rui1-2/+2
Rename thermal_zone_device.cooling_devices to thermal_zone_device.thermal_instances thermal_zone_device.cooling_devices is not accurate as this is a list for thermal instances, rather than cooling devices. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24Thermal: Remove tc1/tc2 in generic thermal layer.Zhang Rui1-4/+1
Remove tc1/tc2 in generic thermal layer. .get_trend() callback starts to take effect from this patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-09-24Thermal: Introduce .get_trend() callback.Zhang Rui1-0/+9
According to ACPI spec, tc1 and tc2 are used by OSPM to anticipate the temperature trends. We introduced the same concept to the generic thermal layer for passive cooling, but now it seems that these values are hard to be used on other platforms. So We introduce .get_trend() as a more general solution. For the platform thermal drivers that have their own way to anticipate the temperature trends, they should provide their own .get_trend() callback. Or else, we will calculate the temperature trends by simply comparing the current temperature and the cached previous temperature reading. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-09-24Thermal: set upper and lower limitsZhang Rui1-1/+4
set upper and lower limits when binding a thermal cooling device to a thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-07-31Merge tag 'for-v3.6' of git://git.infradead.org/battery-2.6Linus Torvalds1-1/+1
Pull battery updates from Anton Vorontsov: "The tag contains just a few battery-related changes for v3.6. It's is all pretty straightforward, except one thing. One of our patches added thermal support for power supply class, but thermal/ subsystem changed under our feet. We (well, Stephen, that is) caught the issue and it was decided[1] that I'd just delay the battery pull request, and then will fix it up by merging upstream back into battery tree at the specific commit. That's not all though: another[2] small fixup for thermal subsystem was needed to get rid of a warning in power supply subsystem (the warning was not drivers/power's "fault", the thermal registration function just needed a proper const annotation, which is also done by a small commit on top of the merge. So, to sum this up: - The 'master' branch of the battery tree was in the -next tree for weeks, was never rebased, altered etc. It should be all OK; - Although, for-v3.6 tag contains the 'master' branch + merge + the warning fix. [1] http://lkml.org/lkml/2012/6/19/23 [2] http://lkml.org/lkml/2012/6/18/28" * tag 'for-v3.6' of git://git.infradead.org/battery-2.6: (23 commits) thermal: Constify 'type' argument for the registration routine olpc-battery: update CHARGE_FULL_DESIGN property for BYD LiFe batteries olpc-battery: Add VOLTAGE_MAX_DESIGN property charger-manager: Fix build break related to EXTCON lp8727_charger: Move header file into platform_data directory power_supply: Add min/max alert properties for CAPACITY, TEMP, TEMP_AMBIENT bq27x00_battery: Add support for BQ27425 chip charger-manager: Set current limit of regulator for over current protection charger-manager: Use EXTCON Subsystem to detect charger cables for charging test_power: Add VOLTAGE_NOW and BATTERY_TEMP properties test_power: Add support for USB AC source gpio-charger: Use cansleep version of gpio_set_value bq27x00_battery: Add support for power average and health properties sbs-battery: Don't trigger false supply_changed event twl4030_charger: Allow charger to control the regulator that feeds it twl4030_charger: Add backup-battery charging twl4030_charger: Fix some typos max17042_battery: Support CHARGE_COUNTER power supply attribute smb347-charger: Add constant charge and current properties power_supply: Add constant charge_current and charge_voltage properties ...
2012-07-31thermal: Constify 'type' argument for the registration routineAnton Vorontsov1-1/+1
thermal_zone_device_register() does not modify 'type' argument, so it is safe to declare it as const. Otherwise, if we pass a const string, we are getting the ugly warning: CC drivers/power/power_supply_core.o drivers/power/power_supply_core.c: In function 'psy_register_thermal': drivers/power/power_supply_core.c:204:6: warning: passing argument 1 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default] include/linux/thermal.h:140:29: note: expected 'char *' but argument is of type 'const char *' Signed-off-by: Anton Vorontsov <anton.vorontsov@linaro.org> Acked-by: Jean Delvare <khali@linux-fr.org>
2012-07-24Thermal: Add Hysteresis attributesDurgadoss R1-0/+5
The Linux Thermal Framework does not support hysteresis attributes. Most thermal sensors, today, have a hysteresis value associated with trip points. This patch adds hysteresis attributes on a per-trip-point basis, to the Thermal Framework. These attributes are optionally writable. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2012-07-24Thermal: Make Thermal trip points writeableDurgadoss R1-3/+12
Some of the thermal drivers using the Generic Thermal Framework require (all/some) trip points to be writeable. This patch makes the trip point temperatures writeable on a per-trip point basis, and modifies the required function call in thermal.c. This patch also updates the Documentation to reflect the new change. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2012-01-23thermal: Rename generate_netlink_eventJean Delvare1-2/+2
It doesn't seem right for the thermal subsystem to export a symbol named generate_netlink_event. This function is thermal-specific and its name should reflect that fact. Rename it to thermal_generate_netlink_event. Signed-off-by: Jean Delvare <khali@linux-fr.org> Acked-by: Rafael J. Wysocki <rjw@sisk.pl> Acked-by: R.Durgadoss <durgadoss.r@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2011-08-02thermal: make THERMAL_HWMON implementation fully internalJean Delvare1-22/+0
THERMAL_HWMON is implemented inside the thermal_sys driver and has no effect on drivers implementing thermal zones, so they shouldn't see anything related to it in <linux/thermal.h>. Making the THERMAL_HWMON implementation fully internal has two advantages beyond the cleaner design: * This avoids rebuilding all thermal drivers if the THERMAL_HWMON implementation changes, or if CONFIG_THERMAL_HWMON gets enabled or disabled. * This avoids breaking the thermal kABI in these cases too, which should make distributions happy. The only drawback I can see is slightly higher memory fragmentation, as the number of kzalloc() calls will increase by one per thermal zone. But I doubt it will be a problem in practice, as I've never seen a system with more than two thermal zones. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2011-02-28ACPI: Fix build for CONFIG_NET unsetRafael J. Wysocki1-0/+8
Several ACPI drivers fail to build if CONFIG_NET is unset, because they refer to things depending on CONFIG_THERMAL that in turn depends on CONFIG_NET. However, CONFIG_THERMAL doesn't really need to depend on CONFIG_NET, because the only part of it requiring CONFIG_NET is the netlink interface in thermal_sys.c. Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET and remove the dependency of CONFIG_THERMAL on CONFIG_NET from drivers/thermal/Kconfig. Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl> Acked-by: Randy Dunlap <randy.dunlap@oracle.com> Cc: Ingo Molnar <mingo@elte.hu> Cc: Len Brown <lenb@kernel.org> Cc: Stephen Rothwell <sfr@canb.auug.org.au> Cc: Luming Yu <luming.yu@intel.com> Cc: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2011-01-12Merge branch 'misc' into releaseLen Brown1-10/+5
2011-01-12thermal: Add event notification to thermal frameworkR.Durgadoss1-0/+32
This patch adds event notification support to the generic thermal sysfs framework in the kernel. The notification is in the form of a netlink event. Signed-off-by: R.Durgadoss <durgadoss.r@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2010-11-30thermal: make ops constantAlan Cox1-10/+5
And while touching that function definition do something about the disaster of formatting there. Signed-off-by: Alan Cox <alan@linux.intel.com> Acked-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2009-03-27thermal: support forcing support for passive coolingMatthew Garrett1-0/+1
Due to poor thermal design or Linux driving hardware outside its thermal envelope, some systems will reach critical temperature and shut down under high load. This patch adds support for forcing a polling-based passive trip point if the firmware doesn't provide one. The assumption is made that the processor is the most practical means to reduce the dynamic heat generation, so hitting the passive thermal limit will cause the CPU to be throttled until the temperature stabalises around the defined value. UI is provided via a "passive" sysfs entry in the thermal zone directory. It accepts a decimal value in millidegrees celsius, or "0" to disable the functionality. Default behaviour is for this functionality to be disabled. Signed-off-by: Matthew Garrett <mjg@redhat.com> Signed-off-by: Len Brown <len.brown@intel.com>
2009-02-20ACPI: move thermal trip handling to generic thermal layerMatthew Garrett1-1/+14
The ACPI code currently carries its own thermal trip handling, meaning that any other thermal implementation will need to reimplement it. Move the code to the generic thermal layer. Signed-off-by: Matthew Garrett <mjg@redhat.com> Signed-off-by: Len Brown <len.brown@intel.com>
2009-02-20thermal: use integers rather than strings for thermal valuesMatthew Garrett1-8/+24
The thermal API currently uses strings to pass values to userspace. This makes it difficult to use from within the kernel. Change the interface to use integers and fix up the consumers. Signed-off-by: Matthew Garrett <mjg@redhat.com> Acked-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Thomas Renninger <trenn@suse.de> Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-25thermal: Create CONFIG_THERMAL_HWMON=nRene Herman1-4/+2
A bug in libsensors <= 2.10.6 is exposed when this new hwmon I/F is enabled. Create CONFIG_THERMAL_HWMON=n until some time after libsensors 2.10.7 ships so those users can run the latest kernel. libsensors 3.x is already fixed -- those users can use CONFIG_THERMAL_HWMON=y now. Signed-off-by: Rene Herman <rene.herman@gmail.com> Acked-by: Mark M. Hoffman <mhoffman@lightlink.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29thermal: add hwmon sysfs I/FZhang Rui1-0/+24
Add hwmon sys I/F for generic thermal driver. Note: we have one hwmon class device for EACH TYPE of the thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29thermal: add new get_crit_temp callbackZhang, Rui1-0/+1
Add a new callback so that the generic thermal can get the critical trip point info of a thermal zone, which is needed for building the tempX_crit hwmon sysfs attribute. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29thermal: add the support for building the generic thermal as a moduleZhang Rui1-14/+0
Build the generic thermal driver as module "thermal_sys". Make ACPI thermal, video, processor and fan SELECT the generic thermal driver, as these drivers rely on it to build the sysfs I/F. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-15acpi thermal trip points increased to 12Krzysztof Helt1-1/+1
The THERMAL_MAX_TRIPS value is set to 10. It is too few for the Compaq AP550 machine which has 12 trip points. Signed-off-by: Krzysztof Helt <krzysztof.h1@wp.pl> Cc: Len Brown <lenb@kernel.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: "Rafael J. Wysocki" <rjw@sisk.pl> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2008-02-09ACPI: thermal: buildfix for CONFIG_THERMAL=nLen Brown1-3/+20
This fixes the build, but acpi_fan_add() still needs to be updated to handle thermal_cooling_device_register() returning NULL as a non-fatal condition. Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-01ACPI: CELSIUS_TO_KELVIN fixupZhang Rui1-0/+4
Fix an imprecision in CELSIUS_TO_KELVIN and move these two macroes to a proper place. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-01the generic thermal sysfs driverZhang Rui1-0/+90
The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
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