linux-dev - Linux kernel development work

Age	Commit message (Collapse)	Author	Files	Lines
2019-05-24	treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 89	Thomas Gleixner	1	-12/+1
	Based on 1 normalized pattern(s): this program is free software you can redistribute it and or modify it under the terms of the gnu general public license version 2 or later as published by the free software foundation this program is distributed in the hope that it will be useful but without any warranty without even the implied warranty of merchantability or fitness for a particular purpose see the gnu general public license for more details extracted by the scancode license scanner the SPDX license identifier GPL-2.0-or-later has been chosen to replace the boilerplate/reference in 6 file(s). Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Richard Fontana <rfontana@redhat.com> Reviewed-by: Allison Randal <allison@lohutok.net> Cc: linux-spdx@vger.kernel.org Link: https://lkml.kernel.org/r/20190520075211.856638608@linutronix.de Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-11-07	tools/thermal: Introduce tmon, a tool for thermal subsystem	Jacob Pan	1	-0/+131
	Increasingly, Linux is running on thermally constrained devices. The simple thermal relationship between processor and fan has become past for modern computers. As hardware vendors cope with the thermal constraints on their products, more sensors are added, new cooling capabilities are introduced. The complexity of the thermal relationship can grow exponentially among cooling devices, zones, sensors, and trip points. They can also change dynamically. To expose such relationship to the userspace, Linux generic thermal layer introduced sysfs entry at /sys/class/thermal with a matrix of symbolic links, trip point bindings, and device instances. To traverse such matrix by hand is not a trivial task. Testing is also difficult in that thermal conditions are often exception cases that hard to reach in normal operations. TMON is conceived as a tool to help visualize, tune, and test the complex thermal subsystem. Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>