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The cooling device state change generates an event, also when there is no
need, because temperature is low and device is not throttled. Avoid to
unnecessary update the cooling device which means also not sending event.
The cooling device state has not changed because the temperature is still
below the first activation trip point value, so we can do this.
Add a tracking mechanism to make sure it updates cooling devices only
once - when the temperature dropps below first trip point.
Reported-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210422114308.29684-4-lukasz.luba@arm.com
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When the temperature is below the first activation trip point the cooling
devices are not checked, so they cannot maintain fresh statistics. It
leads into the situation, when temperature crosses first trip point, the
statistics are stale and show state for very long period. This has impact
on IPA algorithm calculation and wrong decisions. Thus, check the cooling
devices even when the temperature is low, to refresh these statistics.
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210422114308.29684-3-lukasz.luba@arm.com
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There is a need to have a helper function which updates cooling device
state from the governors code. With this change governor can use
lock and unlock while calling helper function. This avoid unnecessary
second time lock/unlock which was in previous solution present in
governor implementation. This new helper function must be called
with mutex 'cdev->lock' hold.
The changed been discussed and part of code presented in thread:
https://lore.kernel.org/linux-pm/20210419084536.25000-1-lukasz.luba@arm.com/
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20210422114308.29684-2-lukasz.luba@arm.com
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Document the use of bindings used for msm8960 tsens based devices.
msm8960 use the same gcc regs and is set as a child of the qcom gcc.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-10-ansuelsmth@gmail.com
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Add support for tsens present in ipq806x SoCs based on generic msm8960
tsens driver.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-9-ansuelsmth@gmail.com
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Drop unused define for msm8960 replaced by generic api and reg_field.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-8-ansuelsmth@gmail.com
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Rework calibrate function to use common function. Derive the offset from
a missing hardcoded slope table and the data from the nvmem calib
efuses.
Drop custom get_temp function and use generic api.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-7-ansuelsmth@gmail.com
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Device based on tsens VER_0 contains a hardware bug that results in some
problem with sensor enablement. Sensor id 6-11 can't be enabled
selectively and all of them must be enabled in one step.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-6-ansuelsmth@gmail.com
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Use init_common and drop custom init for msm8960.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-5-ansuelsmth@gmail.com
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VER_0 is used to describe device based on tsens version before v0.1.
These device are devices based on msm8960 for example apq8064 or
ipq806x. Add support for VER_0 in tsens.c and set the right tsens feat
in tsens-8960.c file.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Reported-by: kernel test robot <lkp@intel.com>
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-4-ansuelsmth@gmail.com
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Convert msm9860 driver to reg_field to use the init_common
function.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-3-ansuelsmth@gmail.com
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Function compute_intercept_slope hardcode the sensor slope to
SLOPE_DEFAULT. Change this and use the default value only if a slope is
not defined. This is needed for tsens VER_0 that has a hardcoded slope
table.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-2-ansuelsmth@gmail.com
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Since thermal_notify_framework is no longer supported/implemented
remove the entry from sysfs-api.rst.
Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210122023406.3500424-4-thara.gopinath@linaro.org
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thermal_notify_framework just updates for a single trip point where as
thermal_zone_device_update does other bookkeeping like updating the
temperature of the thermal zone and setting the next trip point. The only
driver that was using thermal_notify_framework was updated in the previous
patch to use thermal_zone_device_update instead. Since there are no users
for thermal_notify_framework remove it.
Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210122023406.3500424-3-thara.gopinath@linaro.org
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thermal_notify_framework just updates for a single trip point where as
thermal_zone_device_update does other bookkeeping like updating the
temperature of the thermal zone and setting the next trip point etc.
Replace thermal_notify_framework with thermal_zone_device_update as the
later is more thorough.
Acked-by: Kalle Valo <kvalo@codeaurora.org>
Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210122023406.3500424-2-thara.gopinath@linaro.org
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This helps validating DTS files.
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420210104.10555-1-zajec5@gmail.com
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The function ti_bandgap_restore_ctxt() restores the context at resume
time. It checks if the sensor has a counter, reads the register but
does nothing with the value.
The block was probably omitted by the commit b87ea759a4cc.
Remove the unused variable as well as the block using it as we can
consider it as dead code.
Reported-by: Hulk Robot <hulkci@huawei.com>
Fixes: b87ea759a4cc ("staging: omap-thermal: fix context restore function")
Signed-off-by: Lin Ruizhe <linruizhe@huawei.com>
Reviewed-by: Tony Lindgren <tony@atomide.com>
Tested-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210421084256.57591-1-linruizhe@huawei.com
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This property is required for every thermal sensor as it's used when
using phandles.
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210415112121.4999-1-zajec5@gmail.com
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For the sake of lisibility, reorder the header files alphabetically.
Signed-off-by: Zhen Lei <thunder.leizhen@huawei.com>
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210406091912.2583-2-thunder.leizhen@huawei.com
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Use the devm_platform_ioremap_resource_byname() helper instead of
calling platform_get_resource_byname() and devm_ioremap_resource()
separately.
Signed-off-by: dingsenjie <dingsenjie@yulong.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210414063943.96244-1-dingsenjie@163.com
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There is a error message within devm_ioremap_resource
already, so remove the dev_err call to avoid redundant
error message.
Reported-by: Hulk Robot <hulkci@huawei.com>
Signed-off-by: Ye Bin <yebin10@huawei.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210409075224.2109503-1-yebin10@huawei.com
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On Intel processors, the core frequency can be reduced below OS request,
when the current temperature reaches the TCC (Thermal Control Circuit)
activation temperature.
The default TCC activation temperature is specified by
MSR_IA32_TEMPERATURE_TARGET. However, it can be adjusted by specifying an
offset in degrees C, using the TCC Offset bits in the same MSR register.
This patch introduces a cooling devices driver that utilizes the TCC
Offset feature. The bigger the current cooling state is, the lower the
effective TCC activation temperature is, so that the processors can be
throttled earlier before system critical overheats.
Note that, on different platforms, the behavior might be different on
how fast the setting takes effect, and how much the CPU frequency is
reduced.
This patch has been tested on a KabyLake mobile platform from me, and also
on a CometLake platform from Doug.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested by: Doug Smythies <dsmythies@telus.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210412125901.12549-1-rui.zhang@intel.com
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There is a error message within devm_ioremap_resource already, so
remove the dev_err call to avoid redundant error message.
Reported-by: Hulk Robot <hulkci@huawei.com>
Signed-off-by: Ruiqi Gong <gongruiqi1@huawei.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210408100329.7585-1-gongruiqi1@huawei.com
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There is a error message within devm_ioremap_resource already, so
remove the dev_err call to avoid redundant error message.
Reported-by: Hulk Robot <hulkci@huawei.com>
Signed-off-by: Ruiqi Gong <gongruiqi1@huawei.com>
Acked-by: Talel Shenhar <talel@amazon.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210408100144.7494-1-gongruiqi1@huawei.com
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MDM9607 TSENS IP is very similar to the one of MSM8916, with
minor adjustments to various tuning values.
Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210319220802.198215-2-konrad.dybcio@somainline.org
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Add tsens bindings for sm8350.
Signed-off-by: Robert Foss <robert.foss@linaro.org>
Reviewed-by: Vinod Koul <vkoul@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210324124308.1265626-1-robert.foss@linaro.org
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Fixes coccicheck error:
drivers/thermal/qcom/tsens.c:759:4-10: ERROR: missing put_device; call
of_find_device_by_node on line 715, but without a corresponding object
release within this function.
Fixes: a7ff82976122 ("drivers: thermal: tsens: Merge tsens-common.c into tsens.c")
Signed-off-by: Guangqing Zhu <zhuguangqing83@gmail.com>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210404125431.12208-1-zhuguangqing83@gmail.com
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Update maintainers responsible for CPU cooling on Arm side.
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Acked-by: Javi Merino <javi.merino@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210217115908.22547-1-lukasz.luba@arm.com
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Add support for TEMP_ALARM GEN2 PMIC peripherals with digital
major revision 1. This revision utilizes a different temperature
threshold mapping than earlier revisions.
Signed-off-by: David Collins <collinsd@codeaurora.org>
Signed-off-by: Guru Das Srinagesh <gurus@codeaurora.org>
Reviewed-by: Stephen Boyd <sboyd@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/69c90a004b3f5b7ae282f5ec5ca2920a48f23e02.1596040416.git.gurus@codeaurora.org
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Slab OOB issue is scanned by KASAN in cpu_power_to_freq().
If power is limited below the power of OPP0 in EM table,
it will cause slab out-of-bound issue with negative array
index.
Return the lowest frequency if limited power cannot found
a suitable OPP in EM table to fix this issue.
Backtrace:
[<ffffffd02d2a37f0>] die+0x104/0x5ac
[<ffffffd02d2a5630>] bug_handler+0x64/0xd0
[<ffffffd02d288ce4>] brk_handler+0x160/0x258
[<ffffffd02d281e5c>] do_debug_exception+0x248/0x3f0
[<ffffffd02d284488>] el1_dbg+0x14/0xbc
[<ffffffd02d75d1d4>] __kasan_report+0x1dc/0x1e0
[<ffffffd02d75c2e0>] kasan_report+0x10/0x20
[<ffffffd02d75def8>] __asan_report_load8_noabort+0x18/0x28
[<ffffffd02e6fce5c>] cpufreq_power2state+0x180/0x43c
[<ffffffd02e6ead80>] power_actor_set_power+0x114/0x1d4
[<ffffffd02e6fac24>] allocate_power+0xaec/0xde0
[<ffffffd02e6f9f80>] power_allocator_throttle+0x3ec/0x5a4
[<ffffffd02e6ea888>] handle_thermal_trip+0x160/0x294
[<ffffffd02e6edd08>] thermal_zone_device_check+0xe4/0x154
[<ffffffd02d351cb4>] process_one_work+0x5e4/0xe28
[<ffffffd02d352f44>] worker_thread+0xa4c/0xfac
[<ffffffd02d360124>] kthread+0x33c/0x358
[<ffffffd02d289940>] ret_from_fork+0xc/0x18
Fixes: 371a3bc79c11b ("thermal/drivers/cpufreq_cooling: Fix wrong frequency converted from power")
Signed-off-by: brian-sy yang <brian-sy.yang@mediatek.com>
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Cc: stable@vger.kernel.org #v5.7
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201229050831.19493-1-michael.kao@mediatek.com
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s/Hisilicon/HiSilicon/g.
It should use capital S, according to
https://www.hisilicon.com/en/terms-of-use.
Signed-off-by: Hao Fang <fanghao11@huawei.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1617086733-2705-1-git-send-email-fanghao11@huawei.com
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Add the compatible for MDM9607.
Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210319220802.198215-1-konrad.dybcio@somainline.org
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When the function successfully finishes it logs an information about
the registration of the cooling device and use its name to build the
message. Unfortunately it was freed right before:
drivers/thermal/cpuidle_cooling.c:218 __cpuidle_cooling_register()
warn: 'name' was already freed.
Fix this by freeing after the message happened.
Fixes: 6fd1b186d900 ("thermal/drivers/cpuidle_cooling: Use device name instead of auto-numbering")
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20210319202522.891061-1-daniel.lezcano@linaro.org
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The following error is reported by kbuild:
smatch warnings:
drivers/thermal/devfreq_cooling.c:433 of_devfreq_cooling_register_power() warn: passing zero to 'ERR_PTR'
Fix the error code by the setting the 'err' variable instead of 'cdev'.
Fixes: f8d354e821b2 ("thermal/drivers/devfreq_cooling: Use device name instead of auto-numbering")
Reported-by: kernel test robot <lkp@intel.com>
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210319202424.890968-1-daniel.lezcano@linaro.org
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Fix the following error:
smatch warnings:
drivers/thermal/thermal_core.c:1020 __thermal_cooling_device_register() warn: possible memory leak of 'cdev'
by freeing the cdev when exiting the function in the error path.
Fixes: 584837618100 ("thermal/drivers/core: Use a char pointer for the cooling device name")
Reported-by: kernel test robot <lkp@intel.com>
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210319202257.890848-1-daniel.lezcano@linaro.org
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Add myself as the maintainer for Qualcomm tsens drivers so that I
can help Daniel by taking care of/reviewing changes to these drivers.
Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210319153711.2836652-1-thara.gopinath@linaro.org
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The sensor *is* in fact used and does report temperature.
Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210225213119.116550-1-konrad.dybcio@somainline.org
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The division is used directly in re-divvying up power, the decimal part will
be discarded, devices will get less than the extra_actor_power - 1.
if using round the division to make the calculation more accurate.
For example:
actor0 received more than its max_power, it has the extra_power 759
actor1 received less than its max_power, it require extra_actor_power 395
actor2 received less than its max_power, it require extra_actor_power 365
actor1 and actor2 require the total capped_extra_power 760
using division in re-divvying up power
actor1 would actually get the extra_actor_power 394
actor2 would actually get the extra_actor_power 364
if using round the division in re-divvying up power
actor1 would actually get the extra_actor_power 394
actor2 would actually get the extra_actor_power 365
Signed-off-by: Jeson Gao <jeson.gao@unisoc.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1615796737-4688-1-git-send-email-gao.yunxiao6@gmail.com
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There is a list with the purpose of grouping the cpufreq cooling
device together as described in the comments but actually it is
unused, the code evolved since 2012 and the list was no longer needed.
Delete the remaining unused list related code.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20210314111333.16551-5-daniel.lezcano@linaro.org
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Currently the naming of a cooling device is just a cooling technique
followed by a number. When there are multiple cooling devices using
the same technique, it is impossible to clearly identify the related
device as this one is just a number.
For instance:
thermal-idle-0
thermal-idle-1
thermal-idle-2
thermal-idle-3
etc ...
The 'thermal' prefix is redundant with the subsystem namespace. This
patch removes the 'thermal prefix and changes the number by the device
name. So the naming above becomes:
idle-cpu0
idle-cpu1
idle-cpu2
idle-cpu3
etc ...
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20210314111333.16551-4-daniel.lezcano@linaro.org
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Currently the naming of a cooling device is just a cooling technique
followed by a number. When there are multiple cooling devices using
the same technique, it is impossible to clearly identify the related
device as this one is just a number.
For instance:
thermal-devfreq-0
thermal-devfreq-1
etc ...
The 'thermal' prefix is redundant with the subsystem namespace. This
patch removes the 'thermal' prefix and changes the number by the device
name. So the naming above becomes:
devfreq-5000000.gpu
devfreq-1d84000.ufshc
etc ...
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20210314111333.16551-3-daniel.lezcano@linaro.org
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Currently the naming of a cooling device is just a cooling technique
followed by a number. When there are multiple cooling devices using
the same technique, it is impossible to clearly identify the related
device as this one is just a number.
For instance:
thermal-cpufreq-0
thermal-cpufreq-1
etc ...
The 'thermal' prefix is redundant with the subsystem namespace. This
patch removes the 'thermal' prefix and changes the number by the device
name. So the naming above becomes:
cpufreq-cpu0
cpufreq-cpu4
etc ...
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20210314111333.16551-2-daniel.lezcano@linaro.org
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We want to have any kind of name for the cooling devices as we do no
longer want to rely on auto-numbering. Let's replace the cooling
device's fixed array by a char pointer to be allocated dynamically
when registering the cooling device, so we don't limit the length of
the name.
Rework the error path at the same time as we have to rollback the
allocations in case of error.
Tested with a dummy device having the name:
"Llanfairpwllgwyngyllgogerychwyrndrobwllllantysiliogogogoch"
A village on the island of Anglesey (Wales), known to have the longest
name in Europe.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Ido Schimmel <idosch@nvidia.com>
Link: https://lore.kernel.org/r/20210314111333.16551-1-daniel.lezcano@linaro.org
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There is a spelling mistake in a comment, fix it.
Signed-off-by: Colin Ian King <colin.king@canonical.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210311093054.5338-1-colin.king@canonical.com
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When adding support for V3U (r8a779a0) it was incorrectly recorded it
supports four nodes, while in fact it supports five. The fifth node is
named TSC0 and breaks the existing naming schema starting at 1. Work
around this by separately defining the reg property for V3U and others.
Restore the maximum number of nodes to three for other compatibles as
it was before erroneously increasing it for V3U.
Fixes: d7fdfb6541f3be88 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a779a0 support")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210310110716.3297544-1-niklas.soderlund+renesas@ragnatech.se
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When kcalloc() returns NULL to __tcbp or of_count_phandle_with_args()
returns zero or -ENOENT to count, no error return code of
thermal_of_populate_bind_params() is assigned.
To fix these bugs, ret is assigned with -ENOMEM and -ENOENT in these
cases, respectively.
Fixes: a92bab8919e3 ("of: thermal: Allow multiple devices to share cooling map")
Reported-by: TOTE Robot <oslab@tsinghua.edu.cn>
Signed-off-by: Jia-Ju Bai <baijiaju1990@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210310122423.3266-1-baijiaju1990@gmail.com
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'of_device.h' included in 'ti-bandgap.c' is duplicated.
It is also included in the 25th line.
Signed-off-by: Zhang Yunkai <zhang.yunkai@zte.com.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210306123415.219441-1-zhang.yunkai@zte.com.cn
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Add support for up to five TSC nodes. The new THCODE values are taken
from the example in the datasheet.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210309162419.2621359-1-niklas.soderlund+renesas@ragnatech.se
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s/calibartion/calibration/
s/undocummented/undocumented/
Signed-off-by: Bhaskar Chowdhury <unixbhaskar@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210305014348.17412-1-unixbhaskar@gmail.com
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s/calibaration/calibration/
Signed-off-by: Bhaskar Chowdhury <unixbhaskar@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210305015320.7614-1-unixbhaskar@gmail.com
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Lukasz Luba
Ansuel Smith
Thara Gopinath
Rafał Miłecki
Lin Ruizhe
Zhen Lei
dingsenjie
Ye Bin
Zhang Rui
Ruiqi Gong
Konrad Dybcio
Robert Foss
Guangqing Zhu
David Collins
brian-sy yang
Hao Fang
Daniel Lezcano
jeson.gao
Colin Ian King
Niklas Söderlund
Jia-Ju Bai
Zhang Yunkai
Bhaskar Chowdhury