diff options
| author |   Daniel Lezcano <daniel.lezcano@linaro.org> | 2019-12-19 23:53:17 +0100 |
|---|---|---|
| committer | Daniel Lezcano <daniel.lezcano@linaro.org> | 2020-01-27 10:24:32 +0100 |
| commit | 23affa2e29c5faa8cb59778f71e3bce2c8b3aa5c (patch) | |
| tree | 494162b9032bc19ab827019f667d05d2cee29be1 | |
| parent | thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driver (diff) | |
| download | linux-dev-23affa2e29c5faa8cb59778f71e3bce2c8b3aa5c.tar.xz linux-dev-23affa2e29c5faa8cb59778f71e3bce2c8b3aa5c.zip | |
thermal/drivers/cpu_cooling: Rename to cpufreq_cooling
As we introduced the idle injection cooling device called
cpuidle_cooling, let's be consistent and rename the cpu_cooling to
cpufreq_cooling as this one mitigates with OPPs changes.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org
| -rw-r--r-- | Documentation/driver-api/thermal/exynos_thermal.rst | 2 | ||||
| -rw-r--r-- | MAINTAINERS | 2 | ||||
| -rw-r--r-- | drivers/thermal/Makefile | 2 | ||||
| -rw-r--r-- | drivers/thermal/clock_cooling.c | 2 | ||||
| -rw-r--r-- | drivers/thermal/cpufreq_cooling.c (renamed from drivers/thermal/cpu_cooling.c) | 6 | ||||
| -rw-r--r-- | include/linux/clock_cooling.h | 2 |
6 files changed, 8 insertions, 8 deletions
diff --git a/Documentation/driver-api/thermal/exynos_thermal.rst b/Documentation/driver-api/thermal/exynos_thermal.rst index 5bd556566c70..d4e4a5b75805 100644 --- a/Documentation/driver-api/thermal/exynos_thermal.rst +++ b/Documentation/driver-api/thermal/exynos_thermal.rst @@ -67,7 +67,7 @@ TMU driver description: The exynos thermal driver is structured as:: Kernel Core thermal framework - (thermal_core.c, step_wise.c, cpu_cooling.c) + (thermal_core.c, step_wise.c, cpufreq_cooling.c) ^ | | diff --git a/MAINTAINERS b/MAINTAINERS index fd45bd0ec68e..08ebdc7071d7 100644 --- a/MAINTAINERS +++ b/MAINTAINERS @@ -16349,7 +16349,7 @@ L: linux-pm@vger.kernel.org S: Supported F: Documentation/driver-api/thermal/cpu-cooling-api.rst F: Documentation/driver-api/thermal/cpu-idle-cooling.rst -F: drivers/thermal/cpu_cooling.c +F: drivers/thermal/cpufreq_cooling.c F: drivers/thermal/cpuidle_cooling.c F: include/linux/cpu_cooling.h diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile index 6929e6fad1ac..d502a597a717 100644 --- a/drivers/thermal/Makefile +++ b/drivers/thermal/Makefile @@ -19,7 +19,7 @@ thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o thermal_sys-$(CONFIG_THERMAL_GOV_POWER_ALLOCATOR) += power_allocator.o # cpufreq cooling -thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpu_cooling.o +thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpufreq_cooling.o thermal_sys-$(CONFIG_CPU_IDLE_THERMAL) += cpuidle_cooling.o # clock cooling diff --git a/drivers/thermal/clock_cooling.c b/drivers/thermal/clock_cooling.c index 3ad3256c48fd..7cb3ae4b44ee 100644 --- a/drivers/thermal/clock_cooling.c +++ b/drivers/thermal/clock_cooling.c @@ -7,7 +7,7 @@ * Copyright (C) 2013 Texas Instruments Inc. * Contact: Eduardo Valentin <eduardo.valentin@ti.com> * - * Highly based on cpu_cooling.c. + * Highly based on cpufreq_cooling.c. * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) * Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org> */ diff --git a/drivers/thermal/cpu_cooling.c b/drivers/thermal/cpufreq_cooling.c index 53dd08f238d5..fe83d7a210d4 100644 --- a/drivers/thermal/cpu_cooling.c +++ b/drivers/thermal/cpufreq_cooling.c @@ -1,6 +1,6 @@ // SPDX-License-Identifier: GPL-2.0 /* - * linux/drivers/thermal/cpu_cooling.c + * linux/drivers/thermal/cpufreq_cooling.c * * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) * @@ -621,7 +621,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy) struct thermal_cooling_device *cdev = NULL; if (!np) { - pr_err("cpu_cooling: OF node not available for cpu%d\n", + pr_err("cpufreq_cooling: OF node not available for cpu%d\n", policy->cpu); return NULL; } @@ -631,7 +631,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy) cdev = __cpufreq_cooling_register(np, policy, em); if (IS_ERR(cdev)) { - pr_err("cpu_cooling: cpu%d failed to register as cooling device: %ld\n", + pr_err("cpufreq_cooling: cpu%d failed to register as cooling device: %ld\n", policy->cpu, PTR_ERR(cdev)); cdev = NULL; } diff --git a/include/linux/clock_cooling.h b/include/linux/clock_cooling.h index b5cebf766e02..4b0a69863656 100644 --- a/include/linux/clock_cooling.h +++ b/include/linux/clock_cooling.h @@ -7,7 +7,7 @@ * Copyright (C) 2013 Texas Instruments Inc. * Contact: Eduardo Valentin <eduardo.valentin@ti.com> * - * Highly based on cpu_cooling.c. + * Highly based on cpufreq_cooling.c. * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) * Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org> */ |