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authorGiuseppe CAVALLARO <peppe.cavallaro@st.com>2014-10-14 08:12:56 +0200
committerDavid S. Miller <davem@davemloft.net>2014-10-14 16:40:06 -0400
commit53b26b9bc9a547bf10135a8079e5ae88f354b9f6 (patch)
tree29b29141f53cc5582d0ea692bd09c1278dee8dfc /CREDITS
parentstmmac: make the STi Layer compatible to STiH407 (diff)
downloadlinux-dev-53b26b9bc9a547bf10135a8079e5ae88f354b9f6.tar.xz
linux-dev-53b26b9bc9a547bf10135a8079e5ae88f354b9f6.zip
stmmac: dwmac-sti: review the glue-logic for STi4xx and STiD127 SoCs
This patch is to review the whole glue logic adopted on STi SoCs that was bugged. In the old glue-logic there was a lot of confusion when setup the retiming especially for STiD127 where, for example, the bits 6 and 7 (in the GMAC control register) have a different meaning of what is used for STiH4xx SoCs. So we cannot adopt the same glue for all these SoCs. Moreover, GiGa on STiD127 didn't work and, for all the SoCs, the RGMII couldn't run when the speed was 10Mbps (because the clock was not properly managed). Note that the phy clock needs to be provided by the platform as well as documented in the related binding file (updated as consequence). The old code supported too many configurations never adopted and validated. This made the code very complex to maintain and debug in case of issues. The patch simplifies all the configurations as commented in the tables inside the file and obviously it has been tested on all the boards based on the SoCs mentioned. With this patch, the dwmac-sti is also ready to support new configurations that will be available on next SoC generations. Signed-off-by: Giuseppe Cavallaro <peppe.cavallaro@st.com> Cc: Srinivas Kandagatla <srinivas.kandagatla@st.com> Signed-off-by: David S. Miller <davem@davemloft.net>
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