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authorBjorn Andersson <bjorn.andersson@linaro.org>2021-06-08 13:16:38 -0700
committerDaniel Lezcano <daniel.lezcano@linaro.org>2021-07-04 18:28:04 +0200
commit481bd297291b59480b87f88f88fbcff59455dcc3 (patch)
treea5062f6ce1399d2020ca0f39e62df15accefcef9 /Documentation/devicetree/bindings/thermal
parentdt-bindings: rockchip-thermal: Support the RK3568 SoC compatible (diff)
downloadlinux-dev-481bd297291b59480b87f88f88fbcff59455dcc3.tar.xz
linux-dev-481bd297291b59480b87f88f88fbcff59455dcc3.zip
dt-bindings: thermal: tsens: Add sc8180x compatible
The Qualcomm sc8180x platform has the usual tsens blocks, add compatible for this. Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Acked-by: Thara Gopinath <thara.gopinath@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210608201638.2136344-1-bjorn.andersson@linaro.org
Diffstat (limited to 'Documentation/devicetree/bindings/thermal')
-rw-r--r--Documentation/devicetree/bindings/thermal/qcom-tsens.yaml1
1 files changed, 1 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
index 0d4cfe04648f..ccf70dd06d5b 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
@@ -47,6 +47,7 @@ properties:
- qcom,msm8998-tsens
- qcom,sc7180-tsens
- qcom,sc7280-tsens
+ - qcom,sc8180x-tsens
- qcom,sdm845-tsens
- qcom,sm8150-tsens
- qcom,sm8250-tsens