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authorDaniel Lezcano <daniel.lezcano@linaro.org>2021-10-01 18:17:28 +0200
committerHeiko Stuebner <heiko@sntech.de>2021-10-20 10:00:11 +0200
commit43f9699b0c12d4e50b66723213cef456c52254f3 (patch)
treec493c52a67a4a106f3c41f4e25bfdee643e5a334 /arch/arm64/boot/dts/rockchip/rk3399.dtsi
parentarm64: dts: rockchip: fix resets in tsadc node for rk356x (diff)
downloadlinux-dev-43f9699b0c12d4e50b66723213cef456c52254f3.tar.xz
linux-dev-43f9699b0c12d4e50b66723213cef456c52254f3.zip
arm64: dts: rockchip: Add idle cooling devices to rk3399
The thermal framework accepts now the cpu idle cooling device as an alternative when the cpufreq cooling device fails. Add the node in the DT so the cooling devices will be present and the platforms can extend the thermal zone definition to add them. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20211001161728.1729664-1-daniel.lezcano@linaro.org Signed-off-by: Heiko Stuebner <heiko@sntech.de>
Diffstat (limited to 'arch/arm64/boot/dts/rockchip/rk3399.dtsi')
-rw-r--r--arch/arm64/boot/dts/rockchip/rk3399.dtsi12
1 files changed, 12 insertions, 0 deletions
diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
index 721bc2b5a9a6..d3cdf6f42a30 100644
--- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
+++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
@@ -124,6 +124,12 @@
#cooling-cells = <2>; /* min followed by max */
dynamic-power-coefficient = <436>;
cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+
+ thermal-idle {
+ #cooling-cells = <2>;
+ duration-us = <10000>;
+ exit-latency-us = <500>;
+ };
};
cpu_b1: cpu@101 {
@@ -136,6 +142,12 @@
#cooling-cells = <2>; /* min followed by max */
dynamic-power-coefficient = <436>;
cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+
+ thermal-idle {
+ #cooling-cells = <2>;
+ duration-us = <10000>;
+ exit-latency-us = <500>;
+ };
};
idle-states {