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author | Daniel Lezcano <daniel.lezcano@linaro.org> | 2021-10-01 18:17:28 +0200 |
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committer | Heiko Stuebner <heiko@sntech.de> | 2021-10-20 10:00:11 +0200 |
commit | 43f9699b0c12d4e50b66723213cef456c52254f3 (patch) | |
tree | c493c52a67a4a106f3c41f4e25bfdee643e5a334 /arch/arm64/boot/dts/rockchip/rk3399.dtsi | |
parent | arm64: dts: rockchip: fix resets in tsadc node for rk356x (diff) | |
download | linux-dev-43f9699b0c12d4e50b66723213cef456c52254f3.tar.xz linux-dev-43f9699b0c12d4e50b66723213cef456c52254f3.zip |
arm64: dts: rockchip: Add idle cooling devices to rk3399
The thermal framework accepts now the cpu idle cooling device as an
alternative when the cpufreq cooling device fails.
Add the node in the DT so the cooling devices will be present and the
platforms can extend the thermal zone definition to add them.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20211001161728.1729664-1-daniel.lezcano@linaro.org
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
Diffstat (limited to 'arch/arm64/boot/dts/rockchip/rk3399.dtsi')
-rw-r--r-- | arch/arm64/boot/dts/rockchip/rk3399.dtsi | 12 |
1 files changed, 12 insertions, 0 deletions
diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi b/arch/arm64/boot/dts/rockchip/rk3399.dtsi index 721bc2b5a9a6..d3cdf6f42a30 100644 --- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi +++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi @@ -124,6 +124,12 @@ #cooling-cells = <2>; /* min followed by max */ dynamic-power-coefficient = <436>; cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>; + + thermal-idle { + #cooling-cells = <2>; + duration-us = <10000>; + exit-latency-us = <500>; + }; }; cpu_b1: cpu@101 { @@ -136,6 +142,12 @@ #cooling-cells = <2>; /* min followed by max */ dynamic-power-coefficient = <436>; cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>; + + thermal-idle { + #cooling-cells = <2>; + duration-us = <10000>; + exit-latency-us = <500>; + }; }; idle-states { |