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| author |   Jingoo Han <jg1.han@samsung.com> | 2014-11-04 11:01:47 +0900 |
|---|---|---|
| committer |   Felipe Balbi <balbi@ti.com> | 2014-11-05 13:22:19 -0600 |
| commit | b4c9f578cb9608f7de0c89aa637a6af4a48061ef (patch) | |
| tree | ea917a51f732633820dde7b65cfd77625cf13434 /drivers/usb/gadget/function/f_midi.c | |
| parent | usb: renesas_usbhs: fix usbhs_pipe_clear() for DCP PIPE (diff) | |
| download | linux-dev-b4c9f578cb9608f7de0c89aa637a6af4a48061ef.tar.xz linux-dev-b4c9f578cb9608f7de0c89aa637a6af4a48061ef.zip | |
usb: dwc3: exynos: remove non-DT support for Exynos Specific Glue layer
DWC3 Exynos Specific Glue layer can be used only for Exynos SoCs.
In addition, non-DT for EXYNOS SoCs is not supported from v3.11;
thus, there is no need to support non-DT for DWC3 Exynos Specific
Glue layer.
The 'linux/platform_data/dwc3-exynos.h' file has been used for
non-DT support. Thus, the 'dwc3-exynos.h' file is removed, because
it is not used anymore.
Signed-off-by: Jingoo Han <jg1.han@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Diffstat (limited to 'drivers/usb/gadget/function/f_midi.c')
0 files changed, 0 insertions, 0 deletions