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authorKrzysztof Kozlowski <krzk@kernel.org>2020-01-04 16:20:53 +0100
committerDaniel Lezcano <daniel.lezcano@linaro.org>2020-01-27 10:24:32 +0100
commitca07ee4e3de468582e9a370ccfad3e4cf83b5268 (patch)
tree8f74d0496c45e9b430dd519ae7a7156f72bd9978 /include/dt-bindings
parentthermal: generic-adc: silence info message for IIO_TEMP channels (diff)
downloadlinux-dev-ca07ee4e3de468582e9a370ccfad3e4cf83b5268.tar.xz
linux-dev-ca07ee4e3de468582e9a370ccfad3e4cf83b5268.zip
thermal: exynos: Rename Samsung and Exynos to lowercase
Fix up inconsistent usage of upper and lowercase letters in "Samsung" and "Exynos" names. "SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked names. Therefore they should be written with lowercase letters starting with capital letter. The lowercase "Exynos" name is promoted by its manufacturer Samsung Electronics Co., Ltd., in advertisement materials and on website. Although advertisement materials usually use uppercase "SAMSUNG", the lowercase version is used in all legal aspects (e.g. on Wikipedia and in privacy/legal statements on https://www.samsung.com/semiconductor/privacy-global/). Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org
Diffstat (limited to 'include/dt-bindings')
-rw-r--r--include/dt-bindings/thermal/thermal_exynos.h2
1 files changed, 1 insertions, 1 deletions
diff --git a/include/dt-bindings/thermal/thermal_exynos.h b/include/dt-bindings/thermal/thermal_exynos.h
index 642e4e7f4084..52fcb51dda3c 100644
--- a/include/dt-bindings/thermal/thermal_exynos.h
+++ b/include/dt-bindings/thermal/thermal_exynos.h
@@ -1,6 +1,6 @@
/* SPDX-License-Identifier: GPL-2.0+ */
/*
- * thermal_exynos.h - Samsung EXYNOS TMU device tree definitions
+ * thermal_exynos.h - Samsung Exynos TMU device tree definitions
*
* Copyright (C) 2014 Samsung Electronics
* Lukasz Majewski <l.majewski@samsung.com>