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| author | 2018-10-09 22:47:47 +0300 | |
|---|---|---|
| committer | 2018-11-05 12:47:18 +0100 | |
| commit | f1487c19781a07144d8be88cca3c1c85a62f00da (patch) | |
| tree | d8e7cfa1910286fb39202a2aa01011cd3e3bb4d8 /scripts/patch-kernel | |
| parent | arm64: dts: renesas: r8a77990: Add DMA properties to MSIOF nodes (diff) | |
arm64: dts: renesas: r8a77970: add thermal support
Describe THS/CIVM in the R8A77970 device tree.
Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Diffstat (limited to 'scripts/patch-kernel')
0 files changed, 0 insertions, 0 deletions
