aboutsummaryrefslogtreecommitdiffstats
path: root/include/dt-bindings/interconnect (follow)
AgeCommit message (Collapse)AuthorFilesLines
2022-07-15Merge branch 'icc-imx8mp' into icc-nextGeorgi Djakov1-0/+59
This patchset is to support i.MX8MP NoC settings, i.MX8MP NoC initial value after power up is invalid, need set a valid value after related power domain up. This patchset also includes two patch[1,2] during my development to enable the ICC feature for i.MX8MP. I not include ddrc DVFS in this patchset, ths patchset is only to support NoC value mode/priority/ext_control being set to a valid value that suggested by i.MX Chip Design Team. The value is same as NXP downstream one inside Arm Trusted Firmware: https://source.codeaurora.org/external/imx/imx-atf/tree/plat/imx/imx8m/i/gpc.c?h=lf_v2.4#n97 Link: https://lore.kernel.org/r/20220703091132.1412063-1-peng.fan@oss.nxp.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-07-04dt-bindings: interconnect: add fsl,imx8mp.hPeng Fan1-0/+59
Add fsl,imx8mp.h for i.MX8MP Signed-off-by: Peng Fan <peng.fan@nxp.com> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220703091132.1412063-3-peng.fan@oss.nxp.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-06-20dt-bindings: interconnect: Add Qualcomm SM6350 NoC supportLuca Weiss1-0/+148
Add bindings for Qualcomm SM6350 Network-On-Chip interconnect devices. As SM6350 has two pairs of NoCs sharing the same reg, allow this in the binding documentation, as was done for qcm2290. Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20220525144404.200390-4-luca.weiss@fairphone.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-05-18Merge branch 'icc-sc8180x' into icc-nextGeorgi Djakov1-0/+7
This contains a few fixes for the sc8180x interconnect provider driver to make it functional. * icc-sc8180x dt-bindings: interconnect: Add SC8180X QUP0 virt provider interconnect: qcom: sc8180x: Modernize sc8180x probe interconnect: qcom: sc8180x: Fix QUP0 nodes interconnect: qcom: sc8180x: Mark some BCMs keepalive Link: https://lore.kernel.org/r/20220503211925.1022169-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-05-18interconnect: qcom: sc8180x: Fix QUP0 nodesBjorn Andersson1-0/+7
The QUP0 BCM relates to some internal property of the QUPs, and should be configured independently of the path to the QUP. In line with other platforms expose QUP_CORE endpoints in order allow this configuration. Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220503211925.1022169-4-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-05-18Merge branch 'icc-sdx65' into icc-nextGeorgi Djakov1-0/+67
This adds interconnect driver support for SDX65 platform for scaling the bandwidth requirements over RPMh. Link: https://lore.kernel.org/r/1649854415-11174-1-git-send-email-quic_rohiagar@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-04-26dt-bindings: interconnect: Add Qualcomm SDX65 DT bindingsRohit Agarwal1-0/+67
Add interconnect IDs for Qualcomm SDX65 platform. Signed-off-by: Rohit Agarwal <quic_rohiagar@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/1649854415-11174-2-git-send-email-quic_rohiagar@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-04-22dt-bindings: interconnect: qcom: Add sc8280xp bindingBjorn Andersson1-0/+232
The Qualcomm SC8280XP platform has the usual set of busses, add a binding for these interconnect providers and port definitions to allow interconnect paths to be expressed in the sc8280xp DeviceTree. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220408214835.624494-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-15Merge branch 'icc-qcm2290' into icc-nextGeorgi Djakov1-0/+94
Add support for QCM2290 including a few prep changes. * icc-qcm2290 interconnect: icc-rpm: Define ICC device type interconnect: icc-rpm: Add QNOC type QoS support interconnect: icc-rpm: Support child NoC device probe dt-bindings: interconnect: Add Qualcomm QCM2290 NoC support interconnect: qcom: Add QCM2290 driver support Link: https://lore.kernel.org/r/20211215002324.1727-1-shawn.guo@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-15dt-bindings: interconnect: Add Qualcomm QCM2290 NoC supportShawn Guo1-0/+94
Add bindings for Qualcomm QCM2290 Network-On-Chip interconnect devices. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20211215002324.1727-5-shawn.guo@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-14Merge branch 'icc-sm8450' into icc-nextGeorgi Djakov1-0/+171
This add device tree binding and driver for interconnect providers found in SM8450 SoC. * icc-sm8450 dt-bindings: interconnect: Add Qualcomm SM8450 DT bindings interconnect: qcom: Add SM8450 interconnect provider driver Link: https://lore.kernel.org/r/20211209084842.189627-1-vkoul@kernel.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-14dt-bindings: interconnect: Add Qualcomm SM8450 DT bindingsVinod Koul1-0/+171
The Qualcomm SM8450 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand Signed-off-by: Vinod Koul <vkoul@kernel.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20211209084842.189627-2-vkoul@kernel.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-11-22dt-bindings: interconnect: Add Qualcomm MSM8996 DT bindingsYassine Oudjana1-0/+163
Add bindings for interconnects on Qualcomm MSM8996. Signed-off-by: Yassine Oudjana <y.oudjana@protonmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Tested-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> #db820c Link: https://lore.kernel.org/r/20211021132329.234942-4-y.oudjana@protonmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-08-09dt-bindings: interconnect: Add Qualcomm SC8180x DT bindingsGeorgi Djakov1-0/+185
Add compatibles and port definitions for the SC8180x RPMH interconnect providers. Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> [bjorn: Split defines from driver patch and added binding update] Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210723194243.3675795-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-05-11dt-bindings: interconnect: Add Qualcomm SC7280 DT bindingsOdelu Kukatla1-0/+165
The Qualcomm SC7280 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/1619517059-12109-2-git-send-email-okukatla@codeaurora.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-04-02Merge branch 'icc-sm8350' into icc-nextGeorgi Djakov1-0/+172
This adds interconnect support for SM8350 SoC. * icc-sm8350 dt-bindings: interconnect: Add Qualcomm SM8350 DT bindings interconnect: qcom: Add SM8350 interconnect provider driver interconnect: qcom: sm8350: Use the correct ids interconnect: qcom: sm8350: Add missing link between nodes Link: https://lore.kernel.org/r/20210318094617.951212-1-vkoul@kernel.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-03-27dt-bindings: interconnect: Add Qualcomm SM8350 DT bindingsVinod Koul1-0/+172
The Qualcomm SM8350 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Vinod Koul <vkoul@kernel.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210318094617.951212-2-vkoul@kernel.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-03-08dt-bindings: interconnect: Add bindings for Qualcomm SDM660 NoCAngeloGioacchino Del Regno1-0/+116
Add the bindings for the Qualcomm SDM660-class NoC, valid for SDM630, SDM636, SDM660 and SDA variants. Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20201017133718.31327-2-kholk11@gmail.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-02-01Merge branch 'icc-sdx55' into icc-nextGeorgi Djakov1-0/+76
Add interconnect driver support for SDX55 platform for scaling the bandwidth requirements over RPMh. * icc-sdx55 dt-bindings: interconnect: Add Qualcomm SDX55 DT bindings interconnect: qcom: Add SDX55 interconnect provider driver Link: https://lore.kernel.org/r/20210121053254.8355-1-manivannan.sadhasivam@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-01-27dt-bindings: interconnect: Add Qualcomm SDX55 DT bindingsManivannan Sadhasivam1-0/+76
The Qualcomm SDX55 platform has several bus fabrics that could be controlled and tuned dynamically over RPMh according to the bandwidth demand. Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org> Link: https://lore.kernel.org/r/20210121053254.8355-2-manivannan.sadhasivam@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-01-05dt-bindings: interconnect: Add Qualcomm MSM8939 DT bindingsJun Nie1-0/+105
The Qualcomm MSM8939 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jun Nie <jun.nie@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20201204075345.5161-5-jun.nie@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-11-30dt-bindings: interconnect: sdm845: Add IDs for the QUP portsGeorgi Djakov1-0/+2
The QUP ports exist in the topology, but are not exposed as an endpoints in DT. Fix this by creating IDs and attach them to their NoCs, so that the various QUP drivers (i2c/spi/uart etc.) are able to request their interconnect paths and scale their bandwidth. Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Link: https://lore.kernel.org/r/20201105135211.7160-1-georgi.djakov@linaro.org Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
2020-09-08dt-bindings: interconnect: Add EPSS L3 DT binding on SM8250Sibi Sankar1-0/+3
Add Epoch Subsystem (EPSS) L3 interconnect provider binding on SM8250 SoCs. Signed-off-by: Sibi Sankar <sibis@codeaurora.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20200801123049.32398-5-sibis@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08dt-bindings: interconnect: Add generic qcom bindingsMike Tipton1-0/+26
Add generic qcom interconnect bindings that are common across platforms. In particular, these include QCOM_ICC_TAG_* macros that clients can use when calling icc_set_tag(). Signed-off-by: Mike Tipton <mdtipton@codeaurora.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20200903192149.30385-3-mdtipton@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08dt-bindings: interconnect: Add Qualcomm SM8250 DT bindingsJonathan Marek1-0/+172
The Qualcomm SM8250 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jonathan Marek <jonathan@marek.ca> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Sibi Sankar <sibis@codeaurora.org> Link: https://lore.kernel.org/r/20200728023811.5607-4-jonathan@marek.ca Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08dt-bindings: interconnect: Add Qualcomm SM8150 DT bindingsJonathan Marek1-0/+162
The Qualcomm SM8150 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jonathan Marek <jonathan@marek.ca> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Sibi Sankar <sibis@codeaurora.org> Link: https://lore.kernel.org/r/20200728023811.5607-3-jonathan@marek.ca Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-04-28interconnect: imx: Add platform driver for imx8mnLeonard Crestez1-0/+41
Add a platform driver for the i.MX8MN SoC describing bus topology, based on internal documentation. Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com> Link: https://lore.kernel.org/r/338a5409ce88811ba6c940ba06441db3faa8c187.1586174566.git.leonard.crestez@nxp.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-04-28interconnect: imx: Add platform driver for imx8mqLeonard Crestez1-0/+48
Add a platform driver for the i.MX8MQ SoC describing bus topology, based on internal documentation. Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com> Tested-by: Martin Kepplinger <martin.kepplinger@puri.sm> Link: https://lore.kernel.org/r/864310d1f2599c3bd621e70b77028a6e89f6410e.1586174566.git.leonard.crestez@nxp.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-04-28interconnect: imx: Add platform driver for imx8mmLeonard Crestez1-0/+50
Add a platform driver for the i.MX8MM SoC describing bus topology. Bandwidth adjustments is currently only supported on the DDRC and main NOC. Scaling for the vpu/gpu/display NICs could be added in the future. Signed-off-by: Alexandre Bailon <abailon@baylibre.com> Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com> Link: https://lore.kernel.org/r/b14eef179dbd837a486619724b8033490f49db72.1586174566.git.leonard.crestez@nxp.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-03-03dt-bindings: interconnect: Add OSM L3 DT bindingsSibi Sankar1-0/+12
Add bindings for Operating State Manager (OSM) L3 interconnect provider on SDM845 SoCs. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Sibi Sankar <sibis@codeaurora.org> Link: https://lore.kernel.org/r/20200227105632.15041-3-sibis@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-03-03dt-bindings: interconnect: Add Qualcomm SC7180 DT bindingsOdelu Kukatla1-0/+161
The Qualcomm SC7180 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/1583241493-21212-2-git-send-email-okukatla@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-02-28interconnect: qcom: sdm845: Split qnodes into their respective NoCsDavid Dai1-129/+134
In order to better represent the hardware and its different Network-On-Chip devices, split the sdm845 provider driver into NoC specific providers. Remove duplicate functionality already provided by the icc rpmh and bcm voter drivers to calculate and commit bandwidth requests to hardware. Signed-off-by: David Dai <daidavid1@codeaurora.org> Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org> Signed-off-by: Sibi Sankar <sibis@codeaurora.org> Reviewed-by: Evan Green <evgreen@chromium.org> Link: https://lore.kernel.org/r/20200209183411.17195-6-sibis@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-01-07dt-bindings: interconnect: Add Qualcomm MSM8916 DT bindingsGeorgi Djakov1-0/+100
The Qualcomm MSM8916 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2019-11-08dt-bindings: interconnect: qcom: add msm8974 bindingsBrian Masney1-0/+146
Add device tree bindings for the Qualcomm MSM8974 interconnect providers that support setting system bandwidth requirements between various network-on-chip fabrics. Signed-off-by: Brian Masney <masneyb@onstation.org> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20191024103054.9770-2-masneyb@onstation.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Link: https://lore.kernel.org/r/20191108125349.24191-2-georgi.djakov@linaro.org Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2019-08-13dt-bindings: interconnect: Add Qualcomm QCS404 DT bindingsGeorgi Djakov1-0/+88
The Qualcomm QCS404 platform has several buses that could be controlled and tuned according to the bandwidth demand. Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2019-01-22interconnect: qcom: Add sdm845 interconnect provider driverDavid Dai1-0/+143
Introduce Qualcomm SDM845 specific provider driver using the interconnect framework. Signed-off-by: David Dai <daidavid1@codeaurora.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Copyright © 1996 – 2023 Jason A. Donenfeld. All Rights Reverse Engineered.