diff options
author | 2025-05-31 08:08:56 -0700 | |
---|---|---|
committer | 2025-05-31 08:08:56 -0700 | |
commit | ec71f661a572a770d7c861cd52a50cbbb0e1a8d1 (patch) | |
tree | 2acbf8594298ab393c8d56882ba5b171da896d53 /Documentation/devicetree/bindings/vendor-prefixes.yaml | |
parent | Merge tag 'soc-defconfig-6.16' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc (diff) | |
parent | Merge tag 'renesas-dts-for-v6.16-tag5' of https://git.kernel.org/pub/scm/linux/kernel/git/geert/renesas-devel into soc/dt (diff) | |
download | linux-rng-ec71f661a572a770d7c861cd52a50cbbb0e1a8d1.tar.xz linux-rng-ec71f661a572a770d7c861cd52a50cbbb0e1a8d1.zip |
Merge tag 'soc-dt-6.16' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull SoC devicetree updates from Arnd Bergmann:
"There are 11 newly supported SoCs, but these are all either new
variants of existing designs, or straight reuses of the existing chip
in a new package:
- RK3562 is a new chip based on the old Cortex-A53 core, apparently a
low-cost version of the Cortex-A55 based RK3568/RK3566.
- NXP i.MX94 is a minor variation of i.MX93/i.MX95 with a different
set of on-chip peripherals.
- Renesas RZ/V2N (R9A09G056) is a new member of the larger RZ/V2
family
- Amlogic S6/S7/S7D
- Samsung Exynos7870 is an older chip similar to Exynos7885
- WonderMedia wm8950 is a minor variation on the wm8850 chip
- Amlogic s805y is almost idential to s805x
- Allwinner A523 is similar to A527 and T527
- Qualcomm MSM8926 is a variant of MSM8226
- Qualcomm Snapdragon X1P42100 is related to R1E80100
There are also 65 boards, including reference designs for the chips
above, this includes
- 12 new boards based on TI K3 series chips, most of them from
Toradex
- 10 devices using Rockchips RK35xx and PX30 chips
- 2 phones and 2 laptops based on Qualcomm Snapdragon designs
- 10 NXP i.MX8/i.MX9 boards, mostly for embedded/industrial uses
- 3 Samsung Galaxy phones based on Exynos7870
- 5 Allwinner based boards using a variety of ARMv8 chips
- 9 32-bit machines, each based on a different SoC family
Aside from the new hardware, there is the usual set of cleanups and
newly added hardware support on existing machines, for a total of 965
devicetree changesets"
* tag 'soc-dt-6.16' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (956 commits)
MAINTAINERS, mailmap: update Sven Peter's email address
arm64: dts: renesas: rzg3e-smarc-som: Reduce I2C2 clock frequency
arm64: dts: nuvoton: Add pinctrl
ARM: dts: samsung: sp5v210-aries: Align wifi node name with bindings
arm64: dts: blaize-blzp1600: Enable GPIO support
dt-bindings: clock: socfpga: convert to yaml
arm64: dts: rockchip: move rk3562 pinctrl node outside the soc node
arm64: dts: rockchip: fix rk3562 pcie unit addresses
arm64: dts: rockchip: move rk3528 pinctrl node outside the soc node
arm64: dts: rockchip: remove a double-empty line from rk3576 core dtsi
arm64: dts: rockchip: move rk3576 pinctrl node outside the soc node
arm64: dts: rockchip: fix rk3576 pcie unit addresses
arm64: dts: rockchip: Drop assigned-clock* from cpu nodes on rk3588
arm64: dts: rockchip: Add missing SFC power-domains to rk3576
Revert "arm64: dts: mediatek: mt8390-genio-common: Add firmware-name for scp0"
arm64: dts: mediatek: mt8188: Address binding warnings for MDP3 nodes
arm64: dts: mt6359: Rename RTC node to match binding expectations
arm64: dts: mt8365-evk: Add goodix touchscreen support
arm64: dts: mediatek: mt8188: Add missing #reset-cells property
arm64: dts: airoha: en7581: Add PCIe nodes to EN7581 SoC evaluation board
...
Diffstat (limited to 'Documentation/devicetree/bindings/vendor-prefixes.yaml')
-rw-r--r-- | Documentation/devicetree/bindings/vendor-prefixes.yaml | 10 |
1 files changed, 10 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml b/Documentation/devicetree/bindings/vendor-prefixes.yaml index 55b6139d5e04..c01adbaacbbb 100644 --- a/Documentation/devicetree/bindings/vendor-prefixes.yaml +++ b/Documentation/devicetree/bindings/vendor-prefixes.yaml @@ -868,6 +868,8 @@ patternProperties: description: Linux-specific binding "^linx,.*": description: Linx Technologies + "^liontron,.*": + description: Shenzhen Liontron Technology Co., Ltd "^liteon,.*": description: LITE-ON Technology Corp. "^litex,.*": @@ -1268,6 +1270,8 @@ patternProperties: description: Renesas Electronics Corporation "^rervision,.*": description: Shenzhen Rervision Technology Co., Ltd. + "^retronix,.*": + description: Retronix Technology Inc. "^revotics,.*": description: Revolution Robotics, Inc. (Revotics) "^rex,.*": @@ -1500,6 +1504,8 @@ patternProperties: description: Toby Churchill Ltd. "^tcs,.*": description: Shenzhen City Tang Cheng Technology Co., Ltd. + "^tcu,.*": + description: TC Unterhaltungselektronik AG "^tdo,.*": description: Shangai Top Display Optoelectronics Co., Ltd "^team-source-display,.*": @@ -1613,6 +1619,8 @@ patternProperties: description: Universal Scientific Industrial Co., Ltd. "^usr,.*": description: U.S. Robotics Corporation + "^ultratronik,.*": + description: Ultratronik GmbH "^utoo,.*": description: Aigo Digital Technology Co., Ltd. "^v3,.*": @@ -1755,6 +1763,8 @@ patternProperties: description: Y Soft Corporation a.s. "^yuridenki,.*": description: Yuridenki-Shokai Co. Ltd. + "^yuzukihd,.*": + description: YuzukiHD Open Source Hardware "^zarlink,.*": description: Zarlink Semiconductor "^zealz,.*": |