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| author | 2026-03-31 17:53:51 +0800 | |
|---|---|---|
| committer | 2026-03-31 15:46:47 +0000 | |
| commit | cf6788aed0cd911c2e7dded6f28214996dfabc30 (patch) | |
| tree | 0ca947c08946a5cbc09c9cef9520d5e58cd2f552 /tools/perf/scripts/python/stackcollapse.py | |
| parent | mtd: spi-nor: winbond: Fix locking support for w25q256jw (diff) | |
mtd: spi-nor: micron-st: Enable die erase support for MT35XU02GCBA
The MT35XU02GCBA flash device does not support chip erase according
to its datasheet, but supports die erase. The existing code had a TODO
comment noting that the SPI_NOR_IO_MODE_EN_VOLATILE flag probably needs
to be enabled and the driver implementation needs to be converted to
use die erase.
This patch enables the SPI_NOR_IO_MODE_EN_VOLATILE flag and adds the
mt35_two_die_fixups to the MT35XU02GCBA entry, which includes the
micron_st_nor_two_die_late_init() function that sets up die erase
support.
With these changes, the flash device can properly use die erase
operations instead of chip erase.
Signed-off-by: Haoyu Lu <hechushiguitu666@gmail.com>
Reviewed-by: Pratyush Yadav (Google) <pratyush@kernel.org>
[pratyush@kernel.org: drop the whole comment instead of just the TODO line]
Signed-off-by: Pratyush Yadav (Google) <pratyush@kernel.org>
Diffstat (limited to 'tools/perf/scripts/python/stackcollapse.py')
0 files changed, 0 insertions, 0 deletions
