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path: root/drivers/mtd/nand/spi/winbond.c (follow)
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2025-06-18mtd: spinand: winbond: Prevent unsupported frequencies on dual/quad I/O variantsMiquel Raynal1-2/+2
Dual and quad capable chips natively support dual and quad I/O variants at up to 104MHz (1-2-2 and 1-4-4 operations). Reaching the maximum speed of 166MHz is theoretically possible (while still unsupported in the field) by adding a few more dummy cycles. Let's be accurate and clearly state this limit. Setting a maximum frequency implies adding the frequency parameter to the macro, which is done using a variadic argument to avoid impacting all the other drivers which already make use of this macro. Fixes: 1ea808b4d15b ("mtd: spinand: winbond: Update the *JW chip definitions") Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-06-18mtd: spinand: winbond: Increase maximum frequency on an octal operationMiquel Raynal1-1/+1
The default number of dummy cycles is 16 in octal I/O mode (1S-8S-8S), and with this default configuration the maximum frequency is higher than what is being advertised. There are higher and lower frequency possibilities, which involve making changes in the number of dummy cycles through the VCR register. At this stage, let's just describe the default configuration correctly. There should be no functional change. Fixes: 1ac5ff2f2ad6 ("mtd: spinand: winbond: Add octal support") Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-06-18mtd: spinand: winbond: Fix W35N number of planes/LUNMiquel Raynal1-2/+2
There's been a mistake when extracting the geometry of the W35N02 and W35N04 chips from the datasheet. There is a single plane, however there are respectively 2 and 4 LUNs. They are actually referred in the datasheet as dies (equivalent of target), but as there is no die select operation and the chips only feature a single configuration register for the entire chip (instead of one per die), we can reasonably assume we are talking about LUNs and not dies. Reported-by: Andreas Dannenberg <dannenberg@ti.com> Suggested-by: Vignesh Raghavendra <vigneshr@ti.com> Fixes: 25e08bf66660 ("mtd: spinand: winbond: Add support for W35N02JW and W35N04JW chips") Cc: stable@vger.kernel.org Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-04-29mtd: spinand: winbond: Add support for W35N02JW and W35N04JW chipsMiquel Raynal1-0/+18
These chips support single SPI, octal SPI and octal DDR SPI. For now, only the SDR protocols are supported. Tested with the W35N02JW variant, but the 04 one just has twice more dies and is described in the same datasheet, so we can reasonably expect that it will behave identically. Acked-by: Tudor Ambarus <tudor.ambarus@linaro.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-04-29mtd: spinand: winbond: Add octal supportMiquel Raynal1-0/+6
Describe the octal "read from cache" (1S_1S_8S, 1S_8S_8S and 1S_1D_8D_OP) and "program load" (1S_1S_8S and 1S_8S_8S) operations supported by the W35N01JW chip. There is no observable improvement between the two octal SDR modes, which anyway offered a great read speed improvement compared to single mode. flash_speed test results ran on the TI AM62A7 LP SK using a 25MHz SPI bus: * Single mode: eraseblock read speed is 2346 KiB/s page read speed is 2342 KiB/s eraseblock write speed is 2028 KiB/s page write speed is 2028 KiB/s * Octal modes: eraseblock read speed is 10801 KiB/s page read speed is 10711 KiB/s eraseblock write speed is 7335 KiB/s page write speed is 7293 KiB/s However, testing on the cadence qspi controller driver did not allow mixed modes (where SDR and DTR cycles are mixed in the same operation), thus 1S-1D-8D mode could not be tested and is provided for reference (it is anyway skipped on platforms not supporting this). It did not allow easy "update cache" tests either, so these macros are untested and given as-is. Acked-by: Tudor Ambarus <tudor.ambarus@linaro.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-04-29mtd: spinand: winbond: Add support for W35N01JW in single modeMiquel Raynal1-0/+54
Add support for the W35N series by describing the smaller (single die) chip. It has 1b/512B ECC support and its own OOB layout. Acked-by: Tudor Ambarus <tudor.ambarus@linaro.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-04-29mtd: spinand: winbond: Rename DTR variantsMiquel Raynal1-3/+3
So far all the chips supported in the driver apparently have support for the same kind of operation (typically, single, dual and quad). The future introduction of W35N chips will change that as these chips only support single and octal modes. Let's rename the variants accordingly to make these future additions more understandable. Acked-by: Tudor Ambarus <tudor.ambarus@linaro.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-04-29mtd: spinand: Use more specific naming for the (quad) program load opMiquel Raynal1-2/+2
SPI operations have been initially described through macros implicitly implying the use of a single SPI SDR bus. Macros for supporting dual and quad I/O transfers have been added on top, generally inspired by vendor naming, followed by DTR operations. Soon we might see octal and even octal DTR operations as well (including the opcode byte). Let's clarify what the macro really means by describing the expected bus topology in the (quad) program load macro name. While at modifying it, better add the missing_ OP suffix to align with all the other macros of the same kind. Acked-by: Tudor Ambarus <tudor.ambarus@linaro.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-04-29mtd: spinand: Use more specific naming for the (single) program load opMiquel Raynal1-2/+2
SPI operations have been initially described through macros implicitly implying the use of a single SPI SDR bus. Macros for supporting dual and quad I/O transfers have been added on top, generally inspired by vendor naming, followed by DTR operations. Soon we might see octal and even octal DTR operations as well (including the opcode byte). Let's clarify what the macro really means by describing the expected bus topology in the (single) program load macro name. While at modifying it, better add the missing_ OP suffix to align with all the other macros of the same kind. Acked-by: Tudor Ambarus <tudor.ambarus@linaro.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-04-29mtd: spinand: Use more specific naming for the (quad IO) read from cache opsMiquel Raynal1-3/+3
SPI operations have been initially described through macros implicitly implying the use of a single SPI SDR bus. Macros for supporting dual and quad I/O transfers have been added on top, generally inspired by vendor naming, followed by DTR operations. Soon we might see octal and even octal DTR operations as well (including the opcode byte). Let's clarify what the macro really mean by describing the expected bus topology in the (quad IO) read from cache macro names. Acked-by: Tudor Ambarus <tudor.ambarus@linaro.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-04-29mtd: spinand: Use more specific naming for the (quad output) read from cache opsMiquel Raynal1-3/+3
SPI operations have been initially described through macros implicitly implying the use of a single SPI SDR bus. Macros for supporting dual and quad I/O transfers have been added on top, generally inspired by vendor naming, followed by DTR operations. Soon we might see octal and even octal DTR operations as well (including the opcode byte). Let's clarify what the macro really mean by describing the expected bus topology in the (quad output) read from cache macro names. Acked-by: Tudor Ambarus <tudor.ambarus@linaro.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-04-29mtd: spinand: Use more specific naming for the (dual IO) read from cache opsMiquel Raynal1-3/+3
SPI operations have been initially described through macros implicitly implying the use of a single SPI SDR bus. Macros for supporting dual and quad I/O transfers have been added on top, generally inspired by vendor naming, followed by DTR operations. Soon we might see octal and even octal DTR operations as well (including the opcode byte). Let's clarify what the macro really mean by describing the expected bus topology in the (dual IO) read from cache macro names. While at modifying them, better reordering the macros to group them all by bus topology which now feels more intuitive. Acked-by: Tudor Ambarus <tudor.ambarus@linaro.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-04-29mtd: spinand: Use more specific naming for the (dual output) read from cache opsMiquel Raynal1-3/+3
SPI operations have been initially described through macros implicitly implying the use of a single SPI SDR bus. Macros for supporting dual and quad I/O transfers have been added on top, generally inspired by vendor naming, followed by DTR operations. Soon we might see octal and even octal DTR operations as well (including the opcode byte). Let's clarify what the macro really mean by describing the expected bus topology in the (dual output) read from cache macro names. Acked-by: Tudor Ambarus <tudor.ambarus@linaro.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-04-29mtd: spinand: Use more specific naming for the (single) read from cache opsMiquel Raynal1-5/+5
SPI operations have been initially described through macros implicitly implying the use of a single SPI SDR bus. Macros for supporting dual and quad I/O transfers have been added on top, generally inspired by vendor naming, followed by DTR operations. Soon we might see octal and even octal DTR operations as well (including the opcode byte). Let's clarify what the macro really mean by describing the expected bus topology in the (single) read from cache macro names. Acked-by: Tudor Ambarus <tudor.ambarus@linaro.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-04-29mtd: spinand: Use more specific naming for the get/set feature opsMiquel Raynal1-1/+1
SPI operations have been initially described through macros implicitly implying the use of a single SPI SDR bus. Macros for supporting dual and quad I/O transfers have been added on top, generally inspired by vendor naming, followed by DTR operations. Soon we might see octal and even octal DTR operations as well (including the opcode byte). Let's clarify what the macro really mean by describing the expected bus topology in the get/set feature macro names. Reviewed-by: Tudor Ambarus <tudor.ambarus@linaro.org> [Miquel: Fixed conflicts with -next by updating macronix driver] Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-01-15mtd: spinand: winbond: Add support for DTR operationsMiquel Raynal1-0/+5
W25N01JW and W25N02JW support many DTR read modes in single, dual and quad configurations. DTR modes however cannot be used at 166MHz, as the bus frequency in this case must be lowered to 80MHz. Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-01-15mtd: spinand: winbond: Add comment about namingMiquel Raynal1-0/+5
Make the link between the core macros and the datasheet. Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-01-15mtd: spinand: winbond: Update the *JW chip definitionsMiquel Raynal1-2/+11
W25N01JW and W25N02JW use a different technology with higher frequencies supported (up to 166MHz). There is one drawback though, the slowest READ_FROM_CACHE command cannot run above 54MHz. Because of that, we need to set a limit for these chips on the basic READ_FROM_CACHE variant. Duplicating this list is not a problem because these chips have DTR support, and the list of supported variants will diverge from all the other chips when adding support for it. Cc: stable+noautosel@kernel.org # New feature being added Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2025-01-15mtd: spinand: Create distinct fast and slow read from cache variantsMiquel Raynal1-2/+2
So far, the SPINAND_PAGE_READ_FROM_CACHE_OP macro was taking a first argument, "fast", which was inducing the possibility to support higher bus frequencies than with the normal (slower) read from cache alternative. In practice, without frequency change on the bus, this was likely without effect, besides perhaps allowing another variant of the same command, that could run at the default highest speed. If we want to support this fully, we need to add a frequency parameter to the slowest command. But before we do that, let's drop the "fast" boolean from the macro and duplicate it, this will further help supporting having different frequencies allowed for each variant. The change is also of course propagated to all users. It has the nice effect to have all macros aligned on the same pattern. Reviewed-by: Tudor Ambarus <tudor.ambarus@linaro.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2024-10-21mtd: spinand: winbond: Sort the devicesMiquel Raynal1-35/+48
Use alphabetical order, not because it's pretty, but because it makes sense. This way the devices are listed by density, and then by hardware feature set. Add comments to make the list more understandable. There is no intended functional change. Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de> Link: https://lore.kernel.org/linux-mtd/20241009125002.191109-5-miquel.raynal@bootlin.com
2024-10-21mtd: spinand: winbond: Ignore the last ID charactersMiquel Raynal1-3/+3
The last 4 characters in Winbond's branding indicate: - the package type (ZE/SF/TB), - the temperature grade (I/J), - special options, typically the continuous read vs. page read feature support and its default (G/T/F/R), None of these information impact us, at the software level (well, the continuous read mode by default is impacting, but is already handled gracefully by disabling it in the initialization phase), so let's get rid of it. Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de> Link: https://lore.kernel.org/linux-mtd/20241009125002.191109-4-miquel.raynal@bootlin.com
2024-10-21mtd: spinand: winbond: Fix 512GW, 01GW, 01JW and 02JW ECC informationMiquel Raynal1-8/+8
These four chips: * W25N512GW * W25N01GW * W25N01JW * W25N02JW all require a single bit of ECC strength and thus feature an on-die Hamming-like ECC engine. There is no point in filling a ->get_status() callback for them because the main ECC status bytes are located in standard places, and retrieving the number of bitflips in case of corrected chunk is both useless and unsupported (if there are bitflips, then there is 1 at most, so no need to query the chip for that). Without this change, a kernel warning triggers every time a bit flips. Fixes: 6a804fb72de5 ("mtd: spinand: winbond: add support for serial NAND flash") Cc: stable@vger.kernel.org Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de> Link: https://lore.kernel.org/linux-mtd/20241009125002.191109-3-miquel.raynal@bootlin.com
2024-10-21mtd: spinand: winbond: Fix 512GW and 02JW OOB layoutMiquel Raynal1-2/+2
Both W25N512GW and W25N02JW chips have 64 bytes of OOB and thus cannot use the layout for 128 bytes OOB. Reference the correct layout instead. Fixes: 6a804fb72de5 ("mtd: spinand: winbond: add support for serial NAND flash") Cc: stable@vger.kernel.org Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de> Link: https://lore.kernel.org/linux-mtd/20241009125002.191109-2-miquel.raynal@bootlin.com
2024-08-23mtd: spinand: winbond: add support for W25N01KVRobert Marko1-0/+26
Add support for Winbond W25N01KV 1Gbit SPI-NAND. It has 4-bit on-die ECC. Signed-off-by: Robert Marko <robimarko@gmail.com> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Link: https://lore.kernel.org/linux-mtd/20240805175125.6658-1-robimarko@gmail.com
2024-02-05mtd: spinand: winbond: add support for W25N04KVZhi-Jun You1-0/+12
Add support for W25N04KV. W25N04KV has 8-bit on-die ECC. Signed-off-by: Zhi-Jun You <hujy652@gmail.com> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Link: https://lore.kernel.org/linux-mtd/20240107144120.532-1-hujy652@gmail.com
2023-10-16mtd: spinand: winbond: add support for serial NAND flashSridharan S N1-0/+45
Add support for W25N01JW, W25N02JWZEIF, W25N512GW, W25N02KWZEIR and W25N01GWZEIG. W25N02KWZEIR has 8b/512b on-die ECC capability and other four has 4b/512b on-die ECC capability. Signed-off-by: Sridharan S N <quic_sridsn@quicinc.com> Signed-off-by: Md Sadre Alam <quic_mdalam@quicinc.com> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Link: https://lore.kernel.org/linux-mtd/20231012064134.4068621-1-quic_sridsn@quicinc.com
2023-07-12mtd: spinand: winbond: Fix ecc_get_statusOlivier Maignial1-2/+2
Reading ECC status is failing. w25n02kv_ecc_get_status() is using on-stack buffer for SPINAND_GET_FEATURE_OP() output. It is not suitable for DMA needs of spi-mem. Fix this by using the spi-mem operations dedicated buffer spinand->scratchbuf. See spinand->scratchbuf: https://git.kernel.org/pub/scm/linux/kernel/git/torvalds/linux.git/tree/include/linux/mtd/spinand.h?h=v6.3#n418 spi_mem_check_op(): https://git.kernel.org/pub/scm/linux/kernel/git/torvalds/linux.git/tree/drivers/spi/spi-mem.c?h=v6.3#n199 Fixes: 6154c7a58348 ("mtd: spinand: winbond: add Winbond W25N02KV flash support") Cc: stable@vger.kernel.org Signed-off-by: Olivier Maignial <olivier.maignial@hotmail.fr> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Link: https://lore.kernel.org/linux-mtd/DB4P250MB1032EDB9E36B764A33769039FE23A@DB4P250MB1032.EURP250.PROD.OUTLOOK.COM
2022-10-18mtd: spinand: winbond: add Winbond W25N02KV flash supportMikhail Kshevetskiy1-0/+75
Add support of Winbond W25N02KV flash Signed-off-by: Mikhail Kshevetskiy <mikhail.kshevetskiy@iopsys.eu> Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Link: https://lore.kernel.org/linux-mtd/20221010105110.446674-2-mikhail.kshevetskiy@iopsys.eu
2022-10-18mtd: spinand: winbond: fix flash identificationMikhail Kshevetskiy1-2/+2
Winbond uses 3 bytes to identify flash: vendor_id, dev_id_0, dev_id_1, but current driver uses only first 2 bytes of it for devices identification. As result Winbond W25N02KV flash (id_bytes: EF, AA, 22) is identified as W25N01GV (id_bytes: EF, AA, 21). Fix this by adding missed identification bytes. Signed-off-by: Mikhail Kshevetskiy <mikhail.kshevetskiy@iopsys.eu> Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Link: https://lore.kernel.org/linux-mtd/20221010105110.446674-1-mikhail.kshevetskiy@iopsys.eu
2020-03-09mtd: spinand: rework detect procedure for different READ_ID operationChuanhong Guo1-28/+6
Currently there are 3 different variants of read_id implementation: 1. opcode only. Found in GD5FxGQ4xF. 2. opcode + 1 addr byte. Found in GD5GxGQ4xA/E 3. opcode + 1 dummy byte. Found in other currently supported chips. Original implementation was for variant 1 and let detect function of chips with variant 2 and 3 to ignore the first byte. This isn't robust: 1. For chips of variant 2, if SPI master doesn't keep MOSI low during read, chip will get a random id offset, and the entire id buffer will shift by that offset, causing detect failure. 2. For chips of variant 1, if it happens to get a devid that equals to manufacture id of variant 2 or 3 chips, it'll get incorrectly detected. This patch reworks detect procedure to address problems above. New logic do detection for all variants separatedly, in 1-2-3 order. Since all current detect methods do exactly the same id matching procedure, unify them into core.c and remove detect method from manufacture_ops. Tested on GD5F1GQ4UAYIG and W25N01GVZEIG. Signed-off-by: Chuanhong Guo <gch981213@gmail.com> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Link: https://lore.kernel.org/linux-mtd/20200208074439.146296-1-gch981213@gmail.com
2019-04-08mtd: nand: Add max_bad_eraseblocks_per_lun info to memorgBoris Brezillon1-2/+2
NAND datasheets usually give the maximum number of bad blocks per LUN and this number can be used to help upper layers decide how much blocks they should reserve for bad block handling. Add a max_bad_eraseblocks_per_lun to the nand_memory_organization struct and update the NAND_MEMORG() macro (and its users) accordingly. We also provide a default mtd->_max_bad_blocks() implementation. Signed-off-by: Boris Brezillon <bbrezillon@kernel.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
2018-11-05mtd: spinand: winbond: Add support for W25N01GVRobert Marko1-0/+8
W25N01GV is a single die version of the already supported W25M02GV with half the capacity. Everything else is the same so introduce support for W25N01GV. Datasheet:http://www.winbond.com/resource-files/w25n01gv%20revl%20050918%20unsecured.pdf Tested on 8devices Jalapeno dev board under OpenWrt running 4.19-rc5. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Boris Brezillon <boris.brezillon@bootlin.com> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2018-07-18mtd: spinand: Add initial support for Winbond W25M02GVFrieder Schrempf1-0/+141
Add support for the W25M02GV chip. Signed-off-by: Frieder Schrempf <frieder.schrempf@exceet.de> Signed-off-by: Boris Brezillon <boris.brezillon@bootlin.com> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>